The PIC International team are currently in the process of securing the leading industry insiders to present at PIC International 2018.
Click speaker image to view biography.
Moving the data: PICs for cloud computing and telecoms
Yuichi Nakamura - NEC
Yuichi Nakamura received his B.E. degree in information engineering and M.E. degree in electrical engineering from the Tokyo Institute of Technology in 1986 and 1988, respectively. He received his PhD. from the Graduate School of Information, Production and Systems, Waseda University, in 2007. He joined NEC Corp. in 1988 and he is currently a general manager at System Platform Research Labs., NEC Corp. He is also a guest professor of National Institute of Informatics and chair of IEEE CAS Japan Chapter. He has more than 25 years of professional experience in electronic design automation, signal processing, network on chip, signal processing, and embedded software development.
Big data analysis - a golden opportunity for silicon photonics
Today, information and communication technology (ICT) systems make a valuable contribution to solving social problems, with techniques such as big data analysis able to enrich our daily life in many ways. Evolution in processing architecture puts faster performance in reach, but only if innovation in interface architecture among servers can be achieved to avoid the bottleneck of data communication. One solution is optical communication among the servers, and to share our thoughts on the topic we will examine the latest trends in silicon photonics as a way forwards, as well as looking ahead at the advantages of optical connection further into the future.
Eric Mounier - Yole Développement
Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. He previously worked at CEA LETI R&D lab in Grenoble, France in marketing dept. Since 1998 he is a cofounder of Yole Développement, a market research company based in France. At Yole Développement, Dr. Eric Mounier is in charge of market analysis for MEMS & Sensors, visible and IR imagers (CIS, microbolometers), semiconductors, printed electronics and photonics (e.g. Silicon photonics). He has contributed to more than 200 marketing & technological analysis and 100 reports. Eric is also an expert at the OMNT ("Observatoire des Micro & Nanotechnologies") for Optics.
Data centre technology - the big PICture, opportunities for energy efficient photonics
Martin Schell - Fraunhofer HHI
Martin Schell is chair for Optic and Optoelectronic Integration at the Technical University of Berlin, and Executive Director of the Fraunhofer Heinrich Hertz Institute, Berlin, Germany. He also is a board member of the European Photonics Industry Consortium (EPIC), of OptecBB (Competence Network for Optical Technologies in Berlin/Brandenburg, Germany), and member of the Photonics21 Board of Stakeholders. Prior to Fraunhofer, he worked for Infineon Fiber optics as head of production and product line manager FTTH, and at The Boston Consulting Group.
PIC evolution in fibre communications: Incumbent InP verses new platforms of polymer and silicon for 100 and 400G data rates
Weiming Yao - JePPIX/PITC
Weiming Yao received his B.Sc. degree in electrical engineering with honours from Technische Universität Berlin, Germany, and two M.Sc. degrees in photonic networks engineering, with honours, from Aston University, Birmingham, UK, and Scuola Superiore Sant’Anna, Pisa, Italy, in 2010 and 2012 respectively. Since then, he is with the Photonic Integration Group at Eindhoven University of Technology (TU/e) where his work focused on the design and characterization of high bandwidth integrated multichannel transmitter PICs. After receiving his Ph.D. in 2017, he is with the Joint European Platform for Photonic Integration of Components and Circuits (JePPIX) and the newly established Photonic Integration Technology Center (PITC), working on technology development.
III-V photonic integrated circuits for telecoms and beyond
The generic foundry approach to photonic integrated circuits (PIC) has enabled easy access to PIC technology by lowering its entry and prototyping costs, leading to the wider adoption of optical chips across many application areas. We focus here on the recent progress and the challenges of high-capacity WDM transmitters on III-V material for data and telecom that have been fabricated in such generic integration platforms. Furthermore, we outline the platform architecture of the next generation PICs that support extended scaling in device footprint and performance and at the same time assure a more intimate integration with electronics.
Peter Winzer - Nokia Bell Labs
Massive array integration and the need for a holistic digital/analog optics/electronics co-design
Nokia Bell Labs
Refining the PIC: achieving the next milestone in performance
Michael Lebby - Lightwave Logic
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Scalable PIC platforms: The impact of using polymer PICs for 100 and 400Gbps datacom applications
The explosive growth of integrated photonics both in datacenters, telecom as well as non-communications applications, especially from a market standpoint are opening new doors for scalable PIC platforms. Polymer based PICs offer scalability with increased data-rates as well as lower cost structures and provide an excellent vehicle to address the 'purple brick walls’ (cost/performance) that have appeared in photonics roadmaps.
Wim Bogaerts - Ghent University/imec
Wim Bogaerts is professor in Silicon Photonics at Ghent University and IMEC. Since his PhD research, he has been one of the pioneers in this field, being the first to manufacture silicon photonic circuits in a CMOS pilot line. In 2014, Wim co-founded Luceda Photonics to bring the design tools he developed to the market. Today, his research focuses on the challenges for large-scale photonic integration, and the potential of programmable photonic ICs. He holds an ERC consolidator grant.
Programmable photonic ICs: making optical devices more versatile
Most of today’s photonic ICs are designed for a specific purpose and targeted at a specific application, in that they resemble an electronic application-specific integrated circuit (ASIC). But with PIC technologies and design processes now starting to support larger-scale integration, this opens the door to more generic photonics ICs that can be reconfigured or programmed for diverse applications, resembling electronic FPGAs. Such circuits can implement programmable wavelength filters for WDM or microwave photonics, tunable delay lines, multi-format transceivers or optical information processors. In our talk, we will discuss the current state of this new field in PICs, and the future challenges and applications.
Tan Yong Tsong - Institute of Microelectronics
Dr. Tan obtained his Master’s degree and Ph.D. in Physics at the University of Cambridge as a National Science and Technology Board (NSTB) scholar. After returning to the Institute of Microelectronics (IME) as a Senior Engineer and Business Development Leader, he joined the private sector in 2003, as the Country Manager of Fujikura (Singapore), General Manager of FiberTech Ltd (China) and of Mitsui & Co. Ltd. (Japan). He joined A*STAR as Covering Executive Director (ED) Data Storage Institute (DSI) and Deputy ED Science and Engineering Research Council on 1 August 2015. With effect from 1 September 2016, he assumed the appointment as ED IME whilst retaining his concurrent appointment at DSI.
Coupling electronics and photonics – promising paths for device-makers to explore
Silicon photonics packaging is a crucial technology for the commercialisation of photonic integrated circuits (PICs) - especially with the drive towards small form-factor and lower cost modules. Comprehensive capabilities have been established in device libraries and associated tool boxes to enable the integration of electronic chips, low cost lateral optical fibre assembly and automated laser diode assembly. Further innovation in the areas of optical packaging, electronic-photonic integrated circuit (EPIC) full co-design will lead to a more integrated solution for enabling optimal performance and cost effectiveness. These developments will help to achieve the next milestones in Si-Photonics and contribute to addressing overall system requirements - boosting the deployment of products in the market.
Tan Yong Tsong
Institute of Microelectronics
Radha Nagarajan - Inphi
Radha Nagarajan has served as Inphi’s Chief Technology Officer, Optical Interconnect, since June 2013. He brings more than 20 years of experience in the area of high-speed optical interconnects. Prior to joining Inphi, he was with Infinera, as a Fellow, working on the design, development and commercialization of large-scale photonic integrated circuits. From 1995 until 2001, he was with SDL/JDS Uniphase.
Dr. Nagarajan is a Fellow of the IEEE, OSA and IET. He has authored four book chapters, and more than 180 technical papers in the areas of high-speed optical components and photonic integration. He has been awarded 114 US patents. In 2006, he shared the IEEE/LEOS Aron Kressel Award for his work on commercializing large-scale photonic integrated circuits. He received his B.Eng. from the National University of Singapore, M.Eng. from the University of Tokyo, and Ph.D. from the University of California, Santa Barbara.
Highly integrated silicon photonics to push PICs to the next level
Sasan Fathpour - CREOL, The College of Optics & Photonics
Silicon photonics beyond silicon-on-insulator - emerging solutions for integrated photonics
CREOL, The College of Optics & Photonics
Yvain Thonnart - CEA-Leti
Yvain Thonnart graduated from the Ecole Polytechnique, France, in 2003, and received the Engineering Diploma from Telecom ParisTech, France, in 2005, specializing in electrical engineering. Since 2005, he has been a researcher with CEA-LETI, Grenoble, France, where he has been appointed expert on communications and synchronization in Systems on Chip. His research interests include asynchronous logic, network-on-chip architectures, physical implementation of energy-efficient SoCs. He is currently leading a project on silicon photonics interposers for optical communications in massively parallel Systems on Chip.
Integrating photonic building blocks towards complete electro-optical computing
Efficient data transfer between IOs, memories and cores is a key element of high-performance computing. The trend for massively parallel architectures increases the communication needs, at the cost of increasing latency and power consumption. To overcome this, we are investigating the potential of optical communication on large silicon interposers, to stack and connect computing and memory chiplets together. In this talk, we present recent developments at CEA-Leti considering the architectural, design and fabrication aspects of optical interposers, from digital and high-speed analog elements, to the optical devices, in view of the power and thermal constraints. In addition, we share our insight on the integration of these building blocks in a complete electro-optical computing module.
Shinji Matsuo - NTT
Shinji Matsuo received Ph.D. degree from the Tokyo Institute of Technology, Japan. He has been researching high-speed directly modulated lasers, tunable lasers and photonic functional devices. He is currently Senior Distinguished Researcher in NTT Device Technology Laboratories. He received the Opto-Electronic Integration Technology Award (Izuo Hayashi Award) in 2013.
III-V membrane lasers on silicon for datacom and computercom applications
Delivering the goods: advances in PIC manufacturing
Henk Bulthuis - Kaiam Corporation
Henk Bulthuis is Team leader of the optics design group of Kaiam Europe, formerly Gemfire Europe, Avanex, Alcatel Optronics and Kymata.
He co-founded BBV software BV and BBV design BV which were acquired by Kymata in 2000. Close to 800 mask reticles and 2000 of his PLC/PIC designs were simulated, layed out fabricated and tested. Most of the designs were made in glass or silicon technologies.
Vertical integration: bringing key elements together to match PICs to the market
At PIC International 2018, we'll be discussing planar lightwave circuits and free space coupling techniques, highlighting functions for various commercial transceiver configurations targeting data centre and telecoms applications.
Jessie Rosenberg - IBM
Inline wafer-scale photonic testing to boost PIC manufacturing efficiency
Jack Xu - Finisar
Meeting the challenge of producing PICs at high-volume
PIC Design, simulation and packaging: a blueprint for future success
Christopher Cone - Mentor Graphics
From schematic to layout – overcoming today’s PIC design challenges
André Richter - VPIphotonics
Dr. André Richter is an expert in the field of optical communications and related modeling and design aspects. He holds a M.Sc. degree from Georgia Tech and a Ph.D. from TU Berlin. Being member of the VPIphotonics team since 1997, André contributed numerous fundamental modeling advances in various fields. For many years he led product management, technical services and R&D activities. André serves as General Manager of VPIphotonics since 2013.
Scalable design of integrated photonic and optoelectronic circuits
Efficient and convenient solutions for electronic photonic design automation (EPDA) present fundamental prerequisites for the fast and innovative development of next generation integrated photonic and optoelectronic circuits. To highlight progress in this area, we will demonstrate how a layout-aware schematic-driven methodology enables the rapid prototyping of new design concepts, including parameter optimization of photonic and electronic parts, analysis of manufacturing tolerances, and comparison of technology and integration alternatives.
Peter O'Brien - Tyndall
Dr. Peter O’Brien obtained his PhD in Physics from University College Cork in 1999. He has a Masters in Electronic Engineering and Degree in Physics from Trinity College Dublin. He was a postdoctoral scholar at the California Institute of Technology and research scientist at NASA’s Jet Propulsion Laboratory in Pasadena (Micro Devices Laboratory) where he worked on the development of millimetre wave devices for remote sensing applications. Dr O’Brien co-founded one (Biosensia) and founded a second company (Epi-Light). His second company, Epi-Light limited, developed speciality photonic systems for medical device and pharmaceutical applications. He successfully sold the company in 2009 and returned to the Tyndall National Institute to establish a research activity in advanced photonic packaging. Dr O’Brien is now head of the Photonics Packaging Group and is involved in a wide range of both academic and industry research projects, across the telecoms and medical device sectors. Dr. O’Brien is also deputy director of the Science Foundation Ireland, Irish Photonic Integration Centre