Bay Photonics are experts in Photonic Integrated Circuit (PIC) packaging for proof of concept, prototyping and production, using their extensive knowledge of semiconductor and laser/led assembly for design, development, design for manufacture (DFM), production method and test (DFT). They offer both design consultancy and bespoke assembly/packaging services to achieve the customer’s goal. The Team can assist with New Product Introduction (NPI) engineering as product line volume grows and offer services to help transfer to manufacturing facilities within the UK, Europe or to both offshore Contract Electronic Manufacturers and company subsidiaries. The founders and Senior Engineers all have in depth experience with fibre optic assembly and die packaging from their careers with STC, Nortel and Bookham. The equipment list continues to expand to meet new and future customer demands and currently includes manual die bonding, manual and auto gold and aluminium wire bonding , various optical alignment capabilities (including a 6 axis auto align stage, auto/semi-auto die bonding and hermetic seam sealing capability. Located in the South West of the UK, they have their main office at the Brixham Laboratory complex which also houses other members of the Torbay Photonics Cluster ecosystem.
Brolis Semiconductors is an infrared laser diode maker in the spectral range from 800 nm - 3000 nm based on GaAs, InP and GaSb. The company develops a range of light sources from SLDs to high-power multi-watt singel emitters and laser bars for defence, medical, sensing and research applications.
CORNERSTONE is a fabrication capability that can provide competitive prices for both active and passive silicon photonic devices. The CORNERSTONE team, headed up by Professor Graham Reed at the University of Southampton, aims to offer up to 6 passive calls and 2 active calls per year via an MPW service. With a track record of world-leading results, and supported by some of the world’s best academic fabrication facilities for microfabrication and high-spec nanofabrication, CORNERSTONE is also open to dedicated fabrication runs at affordable prices. Through the use of advanced projection lithography, CORNERSTONE can offer both an industry compatible fabrication capability, and design flexibility and freedom, essential for research and prototyping purposes, which may not be accessible at other foundries.
EXFO pioneers smarter network test, monitoring and analytics solutions for the world’s leading CSPs, NEMs and webscale companies. Our portfolio of test orchestration and real-time 3D analytics solutions turns complex into simple and delivers business-critical insights from the network, service and subscriber dimensions. EXFO.com
IQE is the leading global supplier of advanced semiconductor wafers with products that cover a diverse range of applications, supported by an innovative outsourced foundry services portfolio that allows the Group to provide a 'one stop shop' for the wafer needs of the world's leading semiconductor manufacturers. With a pedigree dating back more than twenty-five years, IQE offers the industry’s broadest product portfolio, with a choice of technology platforms from multiple, global manufacturing facilities across Europe, Asia and the USA. Our unparalleled experience in the production and supply of substrates and epiwafers across a number of key market areas make IQE the perfect partner for substrates and epiwafers for visible and infrared optoelectronic devices, multi-junction CPV solar cells and RF components for wireless applications.
Multiphoton Optics offers a 3D Printing Platform (LithoProf3D) and Software (LithoSoft3D) for high-precision 3D printing of arbitrarily shaped structures of a large variety of materials. The equipment allows additive and subtractive processes. Our technology supports scalable processes for different applications and products. The high-precision fabrication of 3D optical interconnects to integrate optical links on-chip, on-board, or in photonic integrated circuits to create sophisticated optical packages is compatible to standard processes in electronic manufacturing and saves app. 80 % of process steps. This enables to significantly reduce energy consumption in production and to save other resources in production and in end-use, for example in high performance computers. We also provide Prototyping & Engineering Services for aspheric or free-form microoptics, and biomedical products, such as scaffolds for tissue engineering, microfluidic cells, or drug delivery structures.
Nanoscribe is a worldwide leader in high-precision additive manufacturing on the nano-, micro- and mesoscale. With more than 10 years on the market, we supply 3D printers, resins and related process solutions. The 3D printers "Photonic Professional GT" are the world's highest resolution systems for three-dimensional nano- and microfabrication. They are designed for high-speed fabrication into photosensitive materials. Our customers are pioneers and innovation leaders in science and industry, e.g. producing DOEs, micro-optics as well as photonic wire bonds for ICT. More than 1,000 users in 30 countries rely on our products and services.
Pioneering photonics design automation already since 1991, today PhoeniX Software has a global presence and is a trusted and well recognized partner for a large number of organizations. We enable easy and cost-effective realisation of integrated photonics chips and systems, by means of our internally developed superior products and services. Our customers range from large OEM's to start-ups and include some of the world’s top universities and research institutes.As the leader in Photonic IC design solutions, we will continue to develop the market by anticipating market demand and customer needs. In combination with our strategic partnerships, this results in offering world class design flows and access to all relevant fabrication technologies for our customers.
Teem Photonics offers innovative solutions for silicon-photonics chip-to-fibre optical interfacing based on its flexible, competitive, reliable, scalable and cost-effective ioNext platform. This ion-exchange technology has been developed for more than 20 years for the manufacturing of optical integrated circuits on glass wafers. We also propose standard and advanced PIC (splitters, couplers, Taps, duplexers, polarizers, interferometers) as well as skills in optical design, fibre-to-chip assembly and packaging.
Teem provides worldwide clients for many applications in Telecom, Bio-medical, Transport, Energy, Defence, Science,… Let us know your need and we will show how a little piece of glass can change everything.
VTT Technical Research Centre of Finland Ltd. is a non-profit R&D company that covers the whole value-chain from devices to systems in various application and technology fields. VTT offers design, wafer-level processing, hybrid integration, packaging and testing services for photonic integrated circuits. In silicon photonics VTT is one of the pioneers globally and leading the development of micron-scale silicon waveguide technology. Benefits of VTT's 3 and 12 µm SOI technlogies include low loss, small polarisation dependency, ultra-wide bandwidth and ultra-small footprint. In addition to R&D VTT can offer small and medium volume manufacturing services.