# PIC International 2026 Programme

Two days of technical talks, panels and networking across PIC design, foundry, packaging and applications. Sessions and timings below are subject to change.

## Sunday 19 April 2026 (starting at 11:00 CET)

- 11:00 - AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register
- 18:00 - Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)

## Monday 20 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Michael Lebby and David Cheskis - Conference Chairs

**Theme: Foundations of PIC design: materials, devices and processes**

- 09:00 - Scaling Co-packaged Optics Requires a Fundamental Rethink of Fibre-to-chip Interconnects - presented by Dominic Sulway (Light Trace Photonics)
- 09:15 - Advances in PIC Testing: Challenges and Measurement Needs from R&D to Volume Production - presented by Marc-Andre Laliberte (APEX Technologies)
- 09:30 - From Design to Silicon: Foundry Solutions for Next-Gen Photonics ICs - presented by Bowen Wang (Tower Semiconductor)
- 09:45 - Simulation-Driven PIC Design – Accelerating Performance, Reliability and Time-to-Market - presented by Shin-Sung Kim (Ansys, part of Synopsys)
- 10:00 - Photonics Chip Level Test Strategies Overcoming Vibration Challenges in High Volume Production Environments - presented by Nikta Jalayer (Physik Instrumente (PI) GmbH & Co. KG)
- 10:15 - Glass-Integrated PICs: Shaping the Future of Photonics - presented by Giacomo Corrielli (Ephos)
- 10:30 - Enabling High-Volume PIC Manufacturing through Interactive Verification & Data-Driven Design Workflows - presented by Martin Fiers (Luceda Photonics)
- 10:45 - Morning Break and Networking
- 11:15 - High‑Yield, High‑Volume TFLN Technology Using CMOS‑Compatible Processing - presented by Bob van Someren (Rapid Photonics)
- 11:30 - LN-Based PICs: Novel Techniques for Structuring and Yield Improvements with Ion Beam Etching - presented by Susanne Hartmann (scia Systems GmbH)
- 11:45 - New Materials for Enabling High-performance Photonic Devices and Emerging Applications - presented by Leili Shiramin (inTEC GROUP)
- 12:00 - TFLN for CPO and Beyond - presented by Hiroyuki Takanashi (Shincron Co. Ltd)
- 12:15 - How Co Packaged Optics Is Transforming Optical Test & Measurement - presented by Matt Adams (VIAVI Solutions)
- 12:30 - Next-Generation Ultra-Low-Loss Integrated Photonics: From Mode-Locked Lasers to Traveling-Wave Amplifiers - presented by Tobias Kippenberg (Swiss Federal Institute of Technology (EPFL))
- 12:45 - Lunch Break and Networking
- 14:15 - Startup Elevator Presentations

**Theme: Connectivity and scalability for secure, high-speed data networks**

- 14:25 - PIC-enabled Quantum-safe Cryptography - presented by Francesco Raffaelli (KETS Quantum Security)
- 14:40 - Building Scalable, Energy-Efficient TFLN PICs Through Industrial-Grade Manufacturing - presented by Hernán Furci (CCRAFT)
- 14:55 - Beyond the Chip: System-Scale Simulations for Next-Gen PICs - presented by Andrzej Połatynski (VPIphotonics)
- 15:10 - Optics in AI Clusters: Innovation Mixed with Expediency - presented by Roy Rubenstein (LightCounting)
- 15:25 - Afternoon Break and Networking
- 15:55 - Integrated Optics in the Age of AI - presented by Jochem Verbist (NVIDIA)
- 16:10 - Integrated Photonics from Opportunity to Mass Production for 50G+ Access Networks - presented by Antonio Teixeira (PICadvanced)
- 16:25 - Enabling Network Scalability through Advanced Photonic Integration - presented by Mehrdad Ziari (Nokia)
- 16:40 - Silicon Photonics Platform for Next-Generation Co-Packaged Optics and Optical I/O - presented by Yoojin Ban (inTEC GROUP)
- 16:55 - From Lab to Volume: Scalable Active Alignment & Test Automation for PIC-Based Optical Transceivers - presented by Tobias Müller (AEMtec)
- 17:10 - Panel: Novel Startups in Photonic Integrated Circuits — From Concept to Deployment - with Dominic Sulway (Light Trace Photonics), Francesco Raffaelli (KETS Quantum Security), Ivan-Lazar Bundalo (InSpek), Jon Pugh (OPTICA), Liam Moroney (Alter Technology), Scott Burroughs (Uviquity)
- 17:40 - Closing Remarks
- 18:00 - Networking Drinks and Dinner Reception (concludes around 20:00)
- 18:30 - AngelTech Rump Session - Bottlenecks & Battlegrounds: The Future of the AI Chip Ecosystem - presented by David Cheskis (Square Zero Technologies), Diana Khlan (Chips Weekly)

## Tuesday 21 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Michael Lebby and David Cheskis - Conference Chairs

**Theme: Future computing: PICs for photonic processing, quantum computers, and neural networks**

- 09:00 - PIC for Photonic Quantum Computing - presented by Nicolas Maring (Quandela)
- 09:15 - System-Level Simulation: Towards Hardware–Software Co-Design for Photonics-Enabled AI Accelerators - presented by Sébastien d'Herbais de Thun (Hewlett Packard Enterprise)
- 09:30 - Beyond Electronics with TFLN Photonic Integrated Circuits for Next-Generation Computing - presented by Sep Mohajerani (Quantum Computing Inc)
- 09:45 - AIM Photonics / NY Creates PIC and Packaging Foundry for an End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging - presented by David Harame (AIM Photonics)
- 10:00 - Morning Break and Networking

**Theme: Foundations of PIC design: materials, devices and processes**

- 10:30 - Enabling THz Bandwidth on-chip with Plasmonic Modulators - presented by Stephan Koch (Polariton Technologies AG)
- 10:45 - Advancing Scalable Photonic Integration: Heterogeneous Integration of Active Components for Next-Generation Applications - presented by Michael Geiselmann (LIGENTEC)
- 11:00 - Aligned 2-Photon Grayscale Lithography for Free Space Microoptical Coupling in Photonic Packaging - presented by Stephan Dottermusch (Nanoscribe)
- 11:15 - How Photonic Intelligent Manufacturing Enables Artificial Intelligence at Scale - presented by Lorenzo Mandelli (ficonTEC)
- 11:30 - Scaling Integrated Photonics by Advancing Wafer Uniformity via Vacuum Technologies - presented by Daniel de Sá Pereira (Buhler Group)
- 11:45 - Enabling Scalable Silicon Photonics Manufacturing Through Laser-Based Trimming and Cleaning - presented by Simon Duval (Femtum)
- 12:00 - Convergence of Photonics and Electronics in Design - presented by Xu Wang (Cadence)
- 12:15 - From Materials to Silicon Photonics PDKs: Scaling Foundry Platforms to 400G and Beyond - presented by Robert Blum (Lightwave Logic)
- 12:30 - Lunch Break and Networking

**Theme: Connectivity and scalability for secure, high-speed data networks**

- 13:45 - Designing for Yield: Production-Grade PDKs for Ultra-high-speed TFLN Photonic Engines - presented by Amir Ghadimi (Lightium)
- 14:00 - Building the Fab of the Future: Scaling PIC Manufacturing Through Ecosystem Collaboration - presented by Andre van de Geijn (Smart Photonics), Bart Thiesen (Itility)
- 14:15 - Advancing Photonic Packaging and Integration Through UV Nanoimprint Lithography - presented by Patrick Schuster (EV Group)
- 14:30 - Industry Ready Photonic Integration using Photonic Wire Bonds and Facet-Attached Micro-Lenses - presented by Abdeslem Ben Hamida (Vanguard Automation)
- 14:45 - Photonic Integrated Circuits and Co-packaged Optics for HPC and AI Data Centers - presented by Mika Takahashi (IDTechEx)
- 15:00 - Afternoon Break and Networking

**Theme: Emerging applications: photonics for sensing, imaging and beyond**

- 15:30 - From Fab to Solving Real‑World Challenges: Delivering 11 Real‑World Proof Points by 2029 - presented by Peter van Arkel (PhotonDelta)
- 15:45 - Enabling Foundry Ready BaTiO₃ Photonics: Advances and 300 mm Wafer Manufacturing - presented by Sabina Hatch (DCA Instruments)
- 16:00 - All Glass Atomic-photonic Chips for Quantum Sensing and Metrology - presented by Gianvito Lucivero (University of Bari/QSensAto)
- 16:15 - Multi-Wavelength Laser Sources for Scaling Datacenter Capacity - presented by Amol Delmade (Pilot Photonics)
- 16:30 - Aluminum Nitride Photonic Integrated Circuits for Extending Nonlinear Photonics Applications to UV Spectrum - presented by Scott Burroughs (Uviquity)
- 16:45 - Closing Remarks

Sessions and timings are subject to change.

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