PANEL SESSION

Accelerating the Adoption of Advanced Photonic Integrated Circuits Using Design Standardisation in PIC Packaging

For many years PICs have been designed following strict design rules imposed by foundries (PDKs), but adoption of PIC technologies outside of data communications has been slowed dramatically by the complexity and high-cost associated with packaging processes. Current photonic packaging solutions are often bespoke, and to reduce costs tooling and processes need to be standardized as they are in the electronics industry. With the recent 400million euro announcement of PIXEurope – a consortium to lead the European Pilot Line on Advanced PICs – from the European Commission and Chips JU, we move towards open-access standardization of the complete ecosystem, including design, chip fabrication and hybrid integration, packaging, and test and reliability technologies. In this panel session, we’ll discuss how the packaging and test design rules will be developed alongside established foundry PDKs to converge onto a photonic-electronic integrated system ready for volume manufacturing.

MODERATOR

Jon Pugh

OPTICA

Dr. Jon Pugh is a leading expert in Quantum Engineering, currently serving as the Director of PIC and Quantum Technologies at Optica, a position he assumed in October 2024. In this role, he manages corporate members involved in photonic integrated circuits (PICs) and quantum technologies. His responsibilities include connecting members with potential partners, suppliers, customers, and investment opportunities, as well as providing market insights and facilitating opportunities for members to showcase their technologies to key stakeholders. Before joining Optica, Dr. Pugh was a Lecturer in Quantum Engineering at the University of Bristol, where he played a crucial role in the Quantum Engineering Centre for Doctoral Training. With over a decade of research experience, his work focused on quantum enabling technologies including advancing PICs and exploring the potential for scaling single-photon sources using cutting-edge fabrication technologies. He has been instrumental in bridging the gap between academia and industry, particularly in the commercialization of quantum technologies and lowering the barrier to entry into PIC and quantum by facilitating training to upskill the current workforce.

PANELLISTS INCLUDE

Andon Bano

ficonTEC

Dr. Andon Bano is currently responsible for ficonTEC sales in the European market. He is working since 10 years in the photonics industry covering different roles from R&D to sales covering topics like Integrated Photonics, Photonics assembly and testing, Optical fiber sensors, Femtosecond lasers, metrology etc. He has a master’s degree in Electronic engineering and a PhD in Metrology form Politecnico di Torino.

Jeroen Duis

PHIX

Jeroen received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics where he gained experience on III-V materials and was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX Photonics Assembly where he is responsible for the commercial activities and the strategic direction for the packaging. He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.

Philippe Soussan

imec

Philippe Soussan is currently program director for the sense & actuate business unit of IMEC. His field of technical expertise covers the interaction between processes and material properties for wafer technology integration in the field of multi-physics devices which comprises: 3D interconnects, micro-fluidics, photonics and opto-electronics. From 2007 till 2011, he has led the group “Packaging, Microsystems and Hybrid Technology”. The group dealt with complex process integration using 3D interconnects, advanced packaging and micro-systems. In 2011, he became program manager for the smart system division of IMEC, which mission is to enable novel product in the field of More than Moore, such as sensors and specialty components. Since 2019, he is technology director in the field of optical sensors and devices. Within his function he is developing novel platforms for integrated photonics and opto-electronics as well as custom process technology solutions for various markets maturity.

Simon Kibben

Photonics Foundry

I grew up in the City of Münster, Germany, where I studied Applied Physics / Laser application technology (Diploma) at the University of Applied Sciences in Münster and Photonics (MSc) at the FernUni Hagen. I focused on research in the field of integrated optics at the BIAS in Bremen for eight years (Dr.) and started working at ficonTEC (since 2016). Here, I gained lots of experience on challenging projects in the field of applied MicroOptics (pattern projectors, mobile cameras, interated optics (coherent / DWDM transceivers / WSS)), and fiber optics, all with a focus on assembly technologies and how to come up with simple, yet reliable assembly principles in these different fields. With this experience and knowledge, I now support the customers of the Photonics Foundry in developing their prototypes and modules with a focus on reliable and simple optical assembly as well as production ramp up and contract manufacturing at the facilities of Photonics Foundry.