Dr. Laura Horan is responsible for leading Product Management at Vanguard Automation, based in Karlsruhe, Germany. She has over 10 years of professional experience in the UK and in Germany, with a focus on the development of optical products and metrology for the medical, automotive, and manufacturing sectors. Laura holds a Ph.D. in Physics from University College Cork, awarded for her work investigating the applications of Hollow Core Photonic Crystal Fibers at the Tyndall National Institute in Ireland, for which she was granted an IRCSET scholarship.
Driven by mega trends such as the IoT and autonomous driving, PICs have been growing at a CAGR of greater 25%. Conventional packaging approaches are unlikely to keep up with short innovation cycles and future volume requirements. 3D laser lithography based Photonic Wire Bonding allows for compact chip-to-chip packaging with high yields, complying with tight optical specification and environmental requirements. Micro-optical lenses can be directly fabricated on wafer-level, allowing for passive alignment of PICs with low coupling losses, while also meeting industrial reliability specifications. See how these technologies have been implemented in a reconfigurable tool chain which scales from prototyping to high-volume production.