Michael Geiselmann (Managing Director) studied physics and engineering at University Stuttgart and Ecole Centrale Paris. After his PhD at ICFO in Barcelona in 2014 he joined the laboratory of Prof. Kippenberg at EPFL in Lausanne, where he advanced frequency comb generation on integrated silicon nitride chips towards applications and was involved in several international research projects. In 2016, he co-founded LIGENTEC and brought the company to the international stage of photonic integration.
Minimising optical losses in a PIC is a key for almost all applications. I will give an overview of the base components of LIGENTEC low loss silicon nitride platform and show application examples in Quantum, LiDAR and sensing, where these base components are crucial to be low loss. Access to LIGENTEC PICs is given through fast prototyping as well as through a 200mm CMOS volume line catering the growing demand in PICs out of Europe.
Photonics touches our daily lives from our cell phones, TVs, illumination to optical communications. As applications and user requirement become more complex, there is a need for integration. The question remains what is the principle driver. Within each market segment there are different requirements in terms of speed, power, efficacy, size and cost. Is the mass production the key driver for increasing the functionality on a photonic chip, or is it the cost, or the application itself. In this panel session we will discuss the challenges faced in different market segments and whether there remain advantages in hybrid and discrete packaging or whether photonic integration is inevitable.