David Harame
COO AIM Photonics and Associate Vice President for Process Development, EPDA, and Test Assembly and Packaging
AIM Photonics
David Harame received his Ph.D. in Electrical Engineering from Stanford University. He is the COO for AIM Photonics and the Associate Vice President managing photonics, electronic photonic design automation, test, assembly, and packaging technical areas. He has been with AIM Photonics since 2019. In his current position, David Harame manages all the technology development in the photonics and packaging areas for AIM Photonics in Albany, NY, at the Albany NanoTech Center and Rochester, NY, at the Test Assembly and Packaging facility.
Prior to joining AIM Photonics, David Harame was a GLOBALFOUNDRIES Fellow and CTO for Development and Enablement. David was an IBM Fellow and CTO for Development and Enablement at IBM before joining GLOBALFOUNDRIES. David Harame is an IEEE Fellow and received the IEEE Daniel E. Noble Award in Emerging Technologies “For the development of manufacturable Silicon Germanium, HBT Bipolar and BiCMOS technologies.” David is best known for his work bringing SiGe BiCMOS into manufacturing. David also worked on foundry enablement and technology development for RF CMOS, RF PD, and FD SOI technologies.
Presentations
AIM Photonics / NY Creates PIC and Packaging Foundry for an End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging
AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the world-class 300 mm NY Creates’ Albany NanoTech Complex, which houses the Center for Semiconductor Research, CMOS Fabrication, Heterogeneous Integration, and High NA EUV Centers. The Institute’s PIC technologies include a full-featured CLO Silicon Photonics (SiPh) base technology, quantum-optimized SiPh, SiN-only for sensors and other applications, and base SiPh with III-V quantum dot lasers providing a broad set of PICs across all the major photonic application areas. 300 mm electronic-photonic interposers provide a unique platform for large-area packaging substrates with SiPh and waveguides. The NY Creates HI center provides dense interconnects, including C4, C2, Cu-Cu, wafer, and die-to-wafer hybrid bonding and advanced packaging build capabilities, including wafer and chip-level assembly and packaging. EPDA, process design kits, and assembly design kits enable design across all PIC, interposer, and packaging offerings. The rapid expansion of AI is driving the development of co-packaged optics (CPO), arguably the most challenging application area in photonic packaging. Addressing the challenges of CPO requires a coordinated development of PIC fabrication processes and packaging technologies. Systems will typically include custom-designed PICs, dense interconnects to electronic integrated circuits, interposers/substrates, lasers, and detachable fiber array units (DFAUs). Having all the parts developed in one foundry and leveraging an advanced 300 mm tool set maximizes the ability to optimize custom designs for CPO. Another challenge is building a skilled workforce for the industry. This talk will share an overview of AIM Photonics and NY Creates education and workforce development programs, including online and hands-on offerings.