Structuring and Uniformity Improvement of Thin Film LN and other Waveguide Materials

Demand for PICs is growing rapidly in telecommunications and data centers due to their wide bandwidth, low transmission loss, and numerous other advantages over traditional electronic integrated circuits. Thin film waveguides, widely acclaimed for their electro-optic and piezoelectric properties, demand precise fabrication techniques to ensure consistent device performance. Integrating new materials, material stacks, and designs is pivotal in advancing photonics and optoelectronics, but it requires new etching solutions. scia Systems’ advanced ion beam etching and trimming processes enable the manufacturing of three-dimensional optoelectronic microstructures for PICs.