Liam Moroney is the business development manager for photonic packaging and test at Alter Technology UK, he has an electronic engineering undergrad degree and a master’s degree in photonics from Heriot-Watt University. Liam has held engineering and commercial positions at Alter Technology UK, Bay Photonics and Gooch & Housego.
Alter Technology UK, a European OSAT (Out-sourced assembly and test) for photonic and microelectronic devices presents the development work on a standard PIC packaging platform designed to reduce barriers to innovation, enabling the cost-effective PIC packaging from dedicated and MPW (Multi-project wafer) runs. We present the capability and rationale behind our platform, highlight the workflow which includes an assembly design kit, and discuss common errors that lead to spiraling packaging costs.