Matthias Lauermann studied Electrical Engineering and Communication at Karlsruhe Institute of Technology (KIT), where he earned his PhD with a focus on integrated optics. After completing his doctoral studies in 2015, he moved to Silicon Valley to work at Infinera Corp in Sunnyvale, CA, continuing his research in integrated optics. In 2017, Matthias returned to Karlsruhe and joined Vanguard Automation shortly after its founding, where he currently heads the R&D department.”
Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of compact optical integration platforms in advanced photonics packaging. Here we will address the critical aspects of progressing photonic integration of PICs to scalable, high-volume production: broad compatibility with various material platforms, reproducibility, long-term reliability in Telcordia testing and seamless integration with existing packaging technologies.