Sabina Hatch


Sales Director

DCA Instruments

Sabina Hatch is the Sales Director at DCA Instruments, leading global engagement in advanced thin film deposition technologies and emerging materials platforms. She brings a broad technical background spanning III–V optoelectronic device fabrication, II–VI nanostructured sensor development, and oxide on silicon integration.

She earned her PhD at Queen Mary University of London, developing nanostructured ZnO based optoelectronic and sensor technologies, establishing her expertise in II–VI semiconductors. She then expanded into III–V materials during her postdoctoral research at University College London, where she worked on fabricating optoelectronic devices using III–V nanostructures grown on silicon.

At DCA Instruments, Sabina has contributed to advancing hybrid MBE processes for high quality BaTiO₃ (BTO) films on 300 mm silicon wafers, supporting next generation photonic and electro optic device manufacturing. With cross disciplinary expertise across III–V, II–VI, and functional oxide materials—and deep familiarity with industrial UHV and MBE workflows—she is well positioned to guide the adoption of cutting edge material technologies for emerging photonic, sensing, and quantum scale applications.

Presentations


Emerging applications: photonics for sensing, imaging and beyond

Enabling Foundry Ready BaTiO₃ Photonics: Advances and 300 mm Wafer Manufacturing

Barium titanate (BaTiO₃, BTO) is rapidly transitioning into an industrially viable platform for high performance electro optic modulators, driven by its strong Pockels response and seamless integration with established photonic manufacturing workflows. DCA Instruments is enabling this shift by delivering fully foundry compatible 12″ (300 mm) BTO production platforms designed for high uptime, process stability, and volume scalability. This talk outlines recent advances in producing uniform, high quality BTO films across 300 mm wafers using solid state MBE, hybrid MBE, and UHV sputtering. Key emphasis is placed on process reliability, wafer level uniformity, and integration readiness essential for commercial photonic and quantum photonic device manufacturing.