Mehrdad Ziari
Senior Vice President of the Optical Module Group
Nokia
Mehrdad Ziari joined Infinera, now part of Nokia, in 2002 and is currently Senior Vice President of the Optical Module Group and responsible for technology and product development of PICs, ASICs and optical packaging. Prior to joining Infinera, he was a member of the R&D team at SDL Inc. where worked on various laser diode and optical component technologies and led InP R&D activities and development of Raman pump laser products. He has received his Bachelor of Science with Suma Cum Laude honors, MS and Ph.D. degrees in Electrical Engineering in 1986, 1987 and 1992 respectively from the University of Southern California in Los Angeles, CA. He has published over 100 papers, two book chapters and is named on over 70 patents.
Presentations
Enabling Network Scalability through Advanced Photonic Integration
As data volumes continue to surge, the interconnect capacity and reach become increasingly limited by power dissipation and physical density, creating a significant bottleneck. This paper will explore how photonic integrated circuits (PICs) are emerging as a critical hardware enabler for the next generation of scalable, high-speed data networks. We’ll highlight how PICs are redefining optical connectivity—offering solutions that are both cost and energy efficient—while supporting bandwidth scaling across a range of applications.