PICs continue to scale in bandwidth and enable large scale deployment in a wide range of connectivity applications in optical networks and data-centers. We will review recent advances in InP PICs in scaling bandwidth, reach and power efficiency and share examples across various applications.
Mehrdad Ziari joined Infinera in 2002 and is currently Senior Vice President of the Optical Module Group and responsible for technology and product development of PICs, ASICs and optical packaging. Prior to joining Infinera, he was a member of the R&D team at SDL Inc. where worked on various laser diode and optical component technologies and led InP R&D activities and development of Raman pump laser products. He has received his Bachelor of Science with Suma Cum Laude honors, MS and Ph.D. degrees in Electrical Engineering in 1986, 1987 and 1992 respectively from the University of Southern California in Los Angeles, CA. He has published over 100 papers, two book chapters and is named on over 70 patents.