PRESENTATION

Process Integration in Redistribution Layer Manufacturing

The packaging area includes a large number of different process steps. The creation of a redistribution layer is only one example, and it is not a single simple process. It consists of several steps such as lithography, development, metal etching, photoresist stripping, and cleaning. Each of these steps typically requires dedicated equipment, which increases complexity, footprint, and cost in the fab. With Siconnex, multiple process steps can be integrated into one system, with a strong focus on metal etching and photoresist strip. This integration reduces the need for separate tools and supports higher productivity and efficiency in semiconductor packaging manufacturing.