Silicon carbide wafers are utilized in electronic devices like power diodes, MOSFETs, high-power microwave devices, and RF transistors, enabling efficient energy conversion and power management. SiC wafers and substrates also find use in automotive electronics, aerospace systems, and renewable energy technologies. Silicon carbide wafer contributes to about 30-40% cost of the total die cost. Hence any progress made in reducing the cost of the SiC wafer, will help in reduction of costs downstream in the value chain and the adoption of SiC wafers. The current process of SiC wafers is wire saw slicing, diamond metal polish (DMP) and then CMP, which is the most adopted process currently. An alternative process also exists which is laser slicing, coarse grinding and fine grinding followed by CMP. In either process pathway, the cost of ownership is key to reduction of the wafer costs. The current presentation speaks of a NEW process. This process uses a composite pad in combination with a diamond slurry to rapid thinning of the wafer before it goes into the CMP step. The overall cost of ownership (CoO) is lower than the existing processes and hence making SiC wafers cost lower.
Dr. Ravi Bollina, an accomplished professional in material science technologies, holds a Ph.D. in Engineering Science and Mechanics from Penn State University. Passionate about advancing semiconductor applications, he specializes in Silicon Carbide, Gallium Nitride, and wide band gap semiconductors. Dr. Bollina expertise extends to semiconductor fabrication, diamond powders processing and solutions. As Chief Sales Officer at Pureon and executive board member, he excels in precision surface processing solutions for semiconductor wafer processing. His prior experience in materials development for Formula one racing has been an industry breakthrough in thermal management of power electronic modules. Dr. Ravi's leadership extends to creating high-performing teams, fostering a culture of learning, and challenging the status quo. Proficient in English, German, Hindi, and Telugu, he possesses strategic sales and negotiation skills.