PRESENTATION

From Design to Silicon: Foundry Solutions for Next-Gen Photonics ICs

Tower Semiconductor offers a comprehensive photonic technology portfolio spanning silicon photonics (SiPho), indium phosphide (InP), and thin-film lithium niobate (TFLN) to enable next-generation co-packaged optics (CPO). By enabling CMOS-compatible SiPho platforms with InP-based chips and ultra-high-speed, low-loss TFLN modulators, Tower Semiconductor supports advanced integration optimized for bandwidth, power efficiency, and scalability. These technologies address the growing demands of AI and data-center interconnects, enabling optical engines tightly integrated with compute platforms. This presentation reviews Tower Semiconductor’s multi-material photonic platforms, integration strategies, and their role in accelerating CPO adoption.

Bowen Wang

Tower Semiconductor

Bowen Wang joined Tower Semiconductor as a Fab Process Dev SiPho Integration Engineer, Sr Staff in June 2022 and focuses on photonic integration in in high-volume production. Prior to that, he was a senior application engineer in Synopsys and worked on the photonic design automation (PDA). He has 15+ years experience of photonic integrated circuit design, fabrication and characterzation. He received his Ph.D. in Physics from Eindhoven University of Technology, The Netherlands in 2011.