PRESENTATION

Enabling Scalable Silicon Photonics Manufacturing Through Laser-Based Trimming and Cleaning

Silicon photonics is facing growing manufacturing challenges driven by AI-scale bandwidth demands, advanced packaging, and the adoption of new materials. Yield loss, low throughput, and post-fabrication variability remain major barriers to high-volume, cost-effective production. Femtum introduces its patented pulsed fiber-laser platform for wafer-level photonic integrated circuit (PIC) trimming and assembly cleaning. The solution enables permanent, lossless phase correction and highly selective, non-contact cleaning compatible with in-line test and assembly tools. Demonstrated on silicon and silicon nitride platforms, these laser-based processes significantly improve yield, throughput, and power efficiency, enabling scalable manufacturing of next-generation PIC and co-packaged optics technologies.