Packaging remains a critical bottleneck in PIC commercialisation. This presentation explores automated assembly solutions enabling sub-micron alignment, repeatable coupling efficiency and scalable production. Attendees will discover how advanced micro-assembly and integration platforms improve throughput, reduce costs and unlock reliable volume manufacturing of complex photonic integrated circuits.
My journey in the tech world started in 2014 when I joined the European Sci-Tech Challenge sponsored by ExxonMobil in Rome. After winning the first challenge I have been given the chance to participate in the final phase at the McLaren Technology Center in London. The year after, I joined the Beam Line for School competition, sponsored by CERN and INFN. Right after awarding my high school diploma in 2016 I won a scholarship offered by OFFICINE TERENZIO which payed my university studies in Sapienza, University of Rome. My university career started in 2016 with a bachelor of engineering in automation and computer science and ended in 2022 with a MsC in Artificial Intelligence and Robotics. During the last months of my university career I have taken a step toward the research and development world, joining research projects sponsored by Sapienza, majorly dealing with Neuroscience, Neuroimaging, Robotics and AI. Since November 2021 I have been living in Bremen, Germany. Here I have produced my MsC thesis together with ficonTEC. On November 2022 I joined the 38th PhD programme in Engineering in Computer Science, held by Sapienza, university of Rome, winning a scholarship sponsored by ficonTEC. I live and work at my PhD in Bremen, now developing data driven solutions for PICs manufacturing systems' performance optimization. I now principally deal with real data acquisition processes and subsequently, the modeling by means of Machine Learning and Deep Learning, which goal is to make complex production scenarios, smarter.