PRESENTATION


Advanced Automated Assembly Platforms for High-Precision PIC Packaging and Integration

Packaging remains a critical bottleneck in PIC commercialisation. This presentation explores automated assembly solutions enabling sub-micron alignment, repeatable coupling efficiency and scalable production. Attendees will discover how advanced micro-assembly and integration platforms improve throughput, reduce costs and unlock reliable volume manufacturing of complex photonic integrated circuits.

Lorenzo Mandelli

ficonTEC


My journey in the tech world started in 2014 when I joined the European Sci-Tech Challenge sponsored by ExxonMobil in Rome. After winning the first challenge I have been given the chance to participate in the final phase at the McLaren Technology Center in London. The year after, I joined the Beam Line for School competition, sponsored by CERN and INFN. Right after awarding my high school diploma in 2016 I won a scholarship offered by OFFICINE TERENZIO which payed my university studies in Sapienza, University of Rome. My university career started in 2016 with a bachelor of engineering in automation and computer science and ended in 2022 with a MsC in Artificial Intelligence and Robotics. During the last months of my university career I have taken a step toward the research and development world, joining research projects sponsored by Sapienza, majorly dealing with Neuroscience, Neuroimaging, Robotics and AI. Since November 2021 I have been living in Bremen, Germany. Here I have produced my MsC thesis together with ficonTEC. On November 2022 I joined the 38th PhD programme in Engineering in Computer Science, held by Sapienza, university of Rome, winning a scholarship sponsored by ficonTEC. I live and work at my PhD in Bremen, now developing data driven solutions for PICs manufacturing systems' performance optimization. I now principally deal with real data acquisition processes and subsequently, the modeling by means of Machine Learning and Deep Learning, which goal is to make complex production scenarios, smarter.