PRESENTATION

Hybrid Photonic Integration for Sensing and Communications

Hybrid PICs offer great design flexibility and enabling optical functionalities that cannot be realized efficiently in monolithic photonic integration platforms. Examples from the PolyBoard platform of Fraunhofer HHI are multilayer waveguide structures for 3D photonic integrated crossing-free switching matrices and optical phased arrays for 3D beam steering in LiDAR applications. By integrating non-reciprocal or nonlinear optical crystals in on-chip free-space sections, isolators and circulators as well as visible light sources for sensing applications can be realized efficiently and cost-effective. Automated assembly processes ensure the scalability of the developed hybrid PICs from single prototypes towards production.

Martin Schell

Fraunhofer HHI

Martin Schell is chair for Optic and Optoelectronic Integration at the Technical University of Berlin, and Executive Director of the Fraunhofer Heinrich Hertz Institute, Berlin, Germany. He also is a board member of the European Photonics Industry Consortium (EPIC), of OptecBB (Competence Network for Optical Technologies in Berlin/Brandenburg, Germany), and member of the Photonics21 Board of Stakeholders. Prior to Fraunhofer, he worked for Infineon Fiber optics as head of production and product line manager FTTH, and at The Boston Consulting Group.