Electrooptic glass substrates are a potential candidate to solve emerging challenges in advanced photonic packaging of silicon-photonics-based integrated circuits. Chiplet-based approaches to lower the total power consumption are discussed as well as optical fan-in and fan-out substrates to manage the increasing optical shoreline bandwidth density at the edge of the chip and the package. Our design enables low-cost assembly methods like pick-and-place alignment of optical components and provides fiber optics connectivity with low-profile mechanical transfer (MT) ferrule-based fiber connectors.
Dr. Andreas Matiss has received his PhD in 2008 in the field of Semiconductor Technologies and Optoelectronics from the University of Duisburg-Essen in Germany. After his PhD he worked for u2t photonics (now Coherent) where he has led the development of compound semiconductor based optoelectronic technologies for coherent long-haul optical communication components. In 2012, Andreas joined Corning Optical Communications in Berlin, Germany. Currently, he is responsible for the Optical Components and Integration group in the Technology division and leading the development of Corning glass substrates for advanced photonic packaging. Andreas has over 15 years of experience in the field of optical communications, fiber optics connectivity, semiconductors technologies, photonic packaging and microelectronics. He has a deep understanding of the industry and has played a leading role in the development of cutting-edge optical technologies for optical communication systems.