In this presentation we demonstrate an innovative alignment and bonding method that utilizes the transparency of silicon in the near-infrared spectral region. The approach integrates near-infrared microscopy into the machine vision referencing system to provide visibility of the LD through and from below the PIC, enabling ‘through-silicon’ live monitoring of the positions of the optical features like laser facet and waveguide termination of the PIC. With this technique relative positional changes of the LD with step sizes down to 100 nm have been observed. By supplementing the through-silicon NIR alignment system with a laser soldering unit, sub-micrometer alignment through the silicon chip followed by laser soldering bonding was achieved, and light was successfully coupled from the LD into the PIC. The technique additionally allows a direct verification of the post-bond alignment as well as of the solder reflow after bonding, hence enabling an unseen level of process control.
Moritz holds a Master’s degree from Heriot-Watt University in Edinburgh, UK, a diploma degree from the Karlsruhe Institute of Technology (KIT), Germany, as well as a Ph.D. from Bremen University, Germany, all in the field of semiconductor optics. He has spent most of the last twelve years working in the field of organic and inorganic semiconductor optics, ranging from basic research of light-matter interaction phenomenon to photonics product assembly.Moritz joined ficonTEC Service in 2012 and since 2014 is the Manager of the ficonTEC R&D center, located within ficonTEC HQ in Achim, Germany.”