As evident from the recent standardization activities, the I/O interconnects in hyperscale data centers and high-performance computing infrastructure are in a major architectural overhaul. The business imperatives of boosting energy and spectral efficiencies while continuing to push for reduced foot-print make co-packaged optics a more near-term necessity than thought just a couple of years ago. The success of rapid development and subsequent deployment of new interconnect designs hinges on (i) photonic integration, (ii) customization of IP in the optical module, and (iii) simulation to ensure end-to-end electrical-optical-electrical interoperability. In our view, the time is now for the photonic designers to consider all of these three aspects holistically in the product development cycle. In this presentation, we demonstrate a Synopsys design flow for the E-O-E co-design using customizable IP.
Twan Korthorst is Director of Photonic Solutions at Synopsys. He has been active in the field of chip design and fabrication for non-traditional semiconductor micro and nano technologies for over 25 years. After roles in product engineering and fabrication, he joined PhoeniX Software in 2007 and developed the company into a leading supplier of design solutions for photonic ICs in his role as CEO. In February 2018, Synopsys, the world largest electronic design automation company, acquired PhoeniX Software, bringing together the industry’s widest portfolio of solutions for designing and manufacturing optical imaging and illumination systems, photonic devices and systems, and photonic integrated circuits (PICs) within one organization. Twan leads the PIC Solutions and Services activities and continues to advocate for integrated photonics technologies around the world. Synopsys offers a seamless design flow from concept to manufacturable PIC design, supported by photonics experts, to help customers design the next generation of communications, sensing, and imaging solutions.