Silicon-on-insulator (SOI) substrate technology has been the defining foundation of silicon photonics integrated circuits over the last 20+ years, fostering its commercial deployment in the datacenter by promoting widespread adoption of high-speed optical transceiver products. By first providing an overview of market trends driving silicon photonics application space recent expansion from datacenter interconnects into sensing devices and computing technologies, the talk will then focus on the technological advances in the Photonics-SOI Smart-Cut process. Specifically, these are benchmarked on silicon photonics multi-project wafer (MPW) process runs, where an extensive set of optical devices and circuits are fabricated, with optical characterization data and device performance supporting the ultimate choice of substrate technology for silicon photonics on thin-SOI platforms.
Corrado Sciancalepore, Ph.D., is a Technical Marketing Manager within the Specialty-SOI Business Unit at Soitec. He received the M.Sc. degree in engineering physics from Politecnico di Torino, Italy, in 2009, and the Ph.D. degree in optical and electrical engineering from the École Centrale de Lyon, France, in 2012. From 2013 until 2020, he was with the CEA-LETI, based in Grenoble, France, as a permanent researcher in Silicon Photonics within the optics and photonics division. In 2020, he was hired by SOITEC, based in Bernin, France. Dr. Sciancalepore is the author of more than 110 journal articles and international conference proceedings on cutting-edge silicon photonics circuits, III-V optoelectronics, and VCSEL photonics.