PRESENTATION

Wafer-level Nanoimprint Technology for Innovative Packaging of Photonic Integrated Circuits

The rapidly growing demand in optical connectivity to enable high-speed data transfers in data centers, telecom networks, sensors and emerging applications in advanced computing for artificial intelligence (AI) requires innovative and more efficient photonic packaging solutions. This is driving the importance of developing standard semiconductor manufacturing processes in silicon photonics, to enable simple and reliable interface connections of silicon photonics chips to optical fibers. Consequently wafer-level nanoimprint lithography (NIL) has come into industry focus as manufacturing technology of choice. It provides an innovative synergy between micro optics and silicon photonics manufacturing. In this talk we will show, how NIL and wafer level optics help solve this key challenge of connecting fibers to silicon chips and allowing cost-efficient wafer level packaging.