PRESENTATION
Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer
Dr. Suresh Venkatesan will present a unique hybrid integration platform for wafer scale passive assembly of electronics and photonics devices using a CMOS based optical interposer. The POET Optical Interposer enables seamless communications between electronics and photonics chips that are assembled on standard 200 or 300mm silicon wafers using visually assisted passive flip chip bonding techniques. This unique integration platform is the first such platform in the industry adapted to directly modulated lasers and enables the world’s smallest single chip Transmit/Receive Optical engine for 100G-400G optical engines.
Suresh Venkatesan
POET Technologies
Dr. Suresh Venkatesan is currently the Chairman & Chief Executive Officer of POET Technologies, Inc. Prior to joining POET Technologies in 2015, Dr. Venkatesan was SVP and CTO at GlobalFoundries, where he grew the 28nm business from zero to $2B, and set the foundation for its 14nm technology strategy. His 20+ years of semiconductor experience included many director of technology development and foundry roles within Freescale and Motorola. While at Motorola, he received three High Impact Technology awards and was inducted into the Scientific Advisory Board Associates (SABA). At Freescale, he was nominated as a Freescale Fellow. In 2017, he received the Outstanding Alumni award from Purdue University’s Electrical Engineering department for his contributions to the field of Semiconductor Technology. Dr. Venkatesan holds over 50 U.S. patents, and has co-authored over 50 technical papers. He has a Bachelor’s of Technology in Electrical Engineering degree from the Indian Institute of Technology (1987), and an MSEE (1988) and PhD (1992), both from Purdue University.