PRESENTATION

PIC Testing – Technologies to Characterize Devices Faster and More Completely

Successful test strategies for photonic integrated circuits involve optimizing the speed and performance of both the measurement of critical parameters and the optical interface or access to wafers and dies. This talk will illustrate how optical testing technologies based on swept-wavelength interferometry overcome the inherent limitations of traditional optical component testers and deliver greater test coverage of more optical parameters in less time, as well as the unique capability to “see inside” integrated photonic components. By integrating this measurement technology with high-performance probing technology from Maple Leaf Photonics, the versatile automated test system delivers valuable answers and insights in less time.