In this talk we will look into the specific requirements for passive chips for mux and demux functions in CWDM 400Gb datacenter application, DWDM Datacenter interconnects and 5G backhaul and fronthaul applications. New products that emerge for these new application areas are ultra wide band AWGs and low loss AWGs. Design and fabrication challenges will be discussed.
Henk Bulthuis is director of the R&D group of Broadex Technologies UK, formerly Kaiam Europe, Gemfire Europe, Avanex, Alcatel Optronics and Kymata. He co-founded BBV software BV and BBV design BV which were acquired by Kymata in 2000. Close to 800 mask reticles and 2000 of his PLC/PIC designs were simulated, layed out fabricated and tested. Most of the designs were made in glass or silicon technologies.