PRESENTATION
The Future Role of Bonding in Photonic Integrated Circuits and Co-Packaged Optics
The rapid advancement of photonic integrated circuits (PICs) and co-packaged optics (CPO) is revolutionizing data transmission and optical communication. This presentation delves into the role of cutting-edge wafer bonding technologies in these domains. It highlights how low-temperature and oxide-free bonding facilitate the seamless integration of III-V materials with mature silicon technology, ensuring high-quality optical interfaces for transceivers and optical engines. Additionally, it explores the challenges and future directions of wafer bonding in enhancing the performance, efficiency, and scalability of optical interconnects in CPO, aiming for high-bandwidth, low latency communication links.
Dr. Bernd Dielacher
EV Group
Dr. Bernd Dielacher is business development manager at EV Group (EVG) where he evaluates global market trends and develops growth opportunities for EVG's bonding, lithography and nanoimprint businesses with a particular focus on the MEMS, biomedical technology and power device market. Bernd holds a master’s degree in Microelectronics from Vienna University of Technology and received a PhD in Biomedical Engineering from ETH Zurich.