To meet the needs of the networking industry, optical transceiver manufacturing needs to be capable of scaling in both cost and performance. To address this challenge, Juniper Networks’ silicon photonics targets manufacturing optical transceivers in the electronics ecosystem, leveraging design, wafer manufacturing, packaging, and test infrastructure and methodologies from the ecosystem. The ability to incorporate all optical components within a single, common silicon die is a key enabler of the approach, fundamentally changing and simplifying how an optical transceiver can be assembled and tested. We will review lessons learned to date and provide a preview of the road ahead.
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