A key technical challenge for photonic integration and packaging of hybrid multi-chip modules is to realize low-loss, reproducible, and reliable optical connections with fast production cycles. Addressing these integration and packaging challenges is crucial for industrial mass production of hybrid multi-chip modules. Vanguard Automation’s additive 3D nano-printing solution utilizes a unique IP portfolio of photonic wire bonds and facet-attached micro-lenses for optical connectivity. The technique relies on highly precise direct-write 3D laser lithography to print freeform optics between optical modules, realizing fully automated mass production without the need for active alignment. Vanguard Automation’s 3D printed freeform structures have shown high reliability and yield for photonic packaging and integration. They are proven to pass strict industry reliability testing and have demonstrated reproducible low-loss coupling while accommodating up to 30µm of alignment offsets.
As Head of Applications Engineering, Support and Services, Sebastian oversees all of Vanguard Automation’ customer engagements including technical demonstrations, delivery of products and solutions as well as customer success. In this role he also spearheads many of Vanguard’s business development and strategic marketing efforts. Prior to joining Vanguard Sebastian worked in academia as well as in the automotive industry (Harman International) in Germany, the United Kingdom, Italy, and Russia. Sebastian holds a PhD (Dr. rer. nat.) degree in Physics from the Karlsruhe Institute of Technologies for which he was granted a scholarship of the Heinrich Böll Foundation. His research background is in superconducting quantum circuits such as qubits. Sebastian contributes extensive experience in nanofabrication, high frequency applications, project management, leadership, and quality testing. Sebastian serves voluntarily as member of the selection committee for new scholars of the Heinrich Böll Foundation.