PRESENTATION

Driving Functional Test Closer to the Chip

Silicon photonic advances have been critical to delivery of the 800Gb/s and 1.6Tb/s modules driving todays AI infrastructure, traditional datacenter, and coherent transport. As processes mature, expectations grow driving increased complexity and new levels of functional integration. Test philosophies will need to adapt. Bringing functional test closer to the chip is one potential outcome with test systems aligning to the specific requirements of the design. The session will review the impacts on both wafer and packaging test and review the potential benefits such as the reduction in test cases, and the identification of issues earlier in the transformation process. Easily adjustable and rapidly adaptable modular test platforms will become much more critical.