Recent developments in advanced heterogeneous 3D integration at the wafer level

Jean-Charles Souriau

CEA Leti

Jean-Charles Souriau is a scientific leader in wafer-level packaging with over 20 years' experience at CEA-Leti in Grenoble, France. He has worked at the French Atomic Energy Commission's Electronics and Information Technology Laboratory's Micro and Nanotechnologies Campus. He received his PhD in Physics from the University of Grenoble (France) in 1993. His areas of expertise include wafer-level packaging, heterogeneous integration, and 3D integration. He is a senior member of the IEEE and chair of the French chapter of the IEEE Electronic Packaging Society. He is also on the French board of IMAPS France. He has published over 50 papers at conferences and in scientific journals, and has 24 patents pending.