PRESENTATION

Breaking the Bottleneck: High-Volume Manufacturing of TFLN PICs for Telecom & Datacom

As demand for AI, cloud computing, and data-intensive applications are increasing exponentially, the demand for faster, more efficient data optical interconnects skyrockets. Traditional silicon or III-V semiconductor-based transceivers are hitting an upper physical limit, creating critical bottlenecks in telecom and datacom infrastructure. Thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) have emerged as a new platform to offer a breakthrough—combining ultra-high performance such as 400G/lane with lower power consumption. However, scaling the manufacturing of this game-changing technology for high-volume production hasn’t happened yet. In this talk, Lightium's CEO, Dr. Amir Ghadimi, will explore the challenges and opportunities of the TFLN platform, from material processing to CMOS-compatible fabrication and Lightium's journey to set up a production-grade foundry for the TFLN platform in a 200mm commercial silicon line. Learn how cutting-edge advancements in production are paving the way for the next generation of high-speed, energy-efficient optical networks.