PRESENTATION

Photonics Chip Level Test Strategies Overcoming Vibration Challenges in High Volume Production Environments

The adoption of co-packaged optics using silicon integrated photonic circuits has created a new paradigm of automated solutions for wafer and chip level test and assembly at scale. The addition of photonics probe to conventional electrical test, comes with a variety of challenges for coupling strategies that address sub-micron spatial tolerances that enable consistent, repeatable, and stable coupling in high-vibration production environments. Here we present on direct fiber array to fiber array-based measurements and analysis to understand the impact of vibration sources on photonics alignment automation systems and mitigation strategies to prevent insertion loss from direct and indirect disturbances. Our findings demonstrate how to enhance efficiency and enable large-scale implementation in photonic device manufacturing. This work integrates precision automation with photonic testing and probing, bridging the gap between research and scalable, high-volume production.