THEMES

PIC International 2019 saw a record number of delegates and sponsors attend the event and the fifth annual PIC International conference will be looking to grow this even further and build on the success of the previous events.

The Five Key Themes of 2021

If you are interested in speaking at PIC International 2021, please contact info@picinternational.net or call us on +44 (0)24 76718970.

PICs Today − Datacom, Sensing & LiDAR

Datacom remains today’s largest PIC opportunity. We will explore progress in PICs for data switching / transmission along with the potential for PICs in emerging sensing applications including LiDAR, digital imaging, fibre optic sensors and bio-photonics.

PIC Manufacturing − TAP, Co-Packaging & Fab

As early generations of PICs are moving into commercial applications the need for automated test, assembly and packaging (TAP) is paramount to ensure long-term reliability. Opportunities for co-packaging hold promise while foundry consolidation and applications beyond datacom have implications for substrate suppliers, EDA/EPDA and many others across the supply chain.

PIC Technology − Solutions, Analysis & Research

The rapidly evolving nature of photonic integration, silicon photonics (SiP), optical computing and automotive SoCs tied to PICs offers new manufacturing opportunities. We will explore programmable PICs, the coherent vs. incoherent debate, quantum encryption and the latest integration/hybridization approaches for light sources and other PIC devices.

PIC ROI − Quality Metrics & Scalability

Scalability is a key manufacturing interest as pilot lines set the stage for volume manufacturing. What metrics can best be applied to design and manufacturing as the industry pivots to higher production levels? Is a total quality management (TQM) approach vital to long-term vitality? We'll explore TAP within a quality matrix and how today's systems can be readied for long-term scalability and margin growth.

PICs Vision − Evolution and Revolution

As PICs move from 100G to 400G, the future will require 800/1600G devices − can we set the stage today for a smooth transition? We will explore leading pathways to a PIC-enabled future and what needs to be initiated in the short-term to satisfy long-term requirements. What role might quantum technologies play to increase performance, reduce power consumption and improve quality?