Panel: Has silicon photonics got the required scalability to displace InP?
Silicon photonics has attracted the interest of many in large corporations, SMEs, and academics as a potential replacement to the incumbent PIC technology InP. SiP offers natural electronics and photonics integration but can’t source laser light unless custom techniques of packaging, bonding etc are utilized with InP based sources. Also, given that SiP may well be on 200mm and 300mm wafers, it is also not clear if the volume requirements are at a level to attract serious attention in large scale fabs. Given these conditions, the question remains to ask if SiP can be truly scalable towards $1/Gbps at 400Gbps data rates and above (for any distance)?
Panel: High volume transceiver opportunities for PICs
Will transceivers ever achieve super high volumes to allow scalability in cost and performance, and if so, what would be the common large volume platforms, and more specifically, what would be the transceiver format/form factor. Will these volumes be in the 50m or 100m or 200m level? What percentage of transceivers in a decade will contain PICs, and if so where would you expect to see a PIC being used in a transceiver. Will PICs in transceivers will be three chip, two chip, or one chip (OEIC) solutions? Lastly, will transceivers ever go away or evolve to new designs, especially with COBO and other non-pluggble innovations?
Additional panel speakers to be confirmed.
Moving the data: PICs for cloud computing and telecoms
PIC opportunities for datacentres
Katharine Schmidtke - Facebook
Big data analysis - a golden opportunity for silicon photonics
Yuichi Nakamura - NEC
Today, information and communication technology (ICT) systems make a valuable contribution to solving social problems, with techniques such as big data analysis able to enrich our daily life in many ways. Evolution in processing architecture puts faster performance in reach, but only if innovation in interface architecture among servers can be achieved to avoid the bottleneck of data communication. One solution is optical communication among the servers, and to share our thoughts on the topic we will examine the latest trends in silicon photonics as a way forwards, as well as looking ahead at the advantages of optical connection further into the future.
Data centre technology - the big PICture, opportunities for energy efficient photonics
Eric Mounier - Yole Développement
PIC evolution in fibre communications: Incumbent InP verses new platforms of polymer and silicon for 100 and 400G data rates
Martin Schell - Fraunhofer HHI
III-V photonic integrated circuits for telecoms and beyond
Weiming Yao - JePPIX/PITC
The generic foundry approach to photonic integrated circuits (PIC) has enabled easy access to PIC technology by lowering its entry and prototyping costs, leading to the wider adoption of optical chips across many application areas. We focus here on the recent progress and the challenges of high-capacity WDM transmitters on III-V material for data and telecom that have been fabricated in such generic integration platforms. Furthermore, we outline the platform architecture of the next generation PICs that support extended scaling in device footprint and performance and at the same time assure a more intimate integration with electronics.
Massive array integration and the need for a holistic digital/analog optics/electronics co-design
Peter Winzer - Nokia Bell Labs
Refining the PIC: achieving the next milestone in performance
Scalable PIC platforms: The impact of using polymer PICs for 100 and 400Gbps datacom applications
Michael Lebby - Lightwave Logic
The explosive growth of integrated photonics both in datacenters, telecom as well as non-communications applications, especially from a market standpoint are opening new doors for scalable PIC platforms. Polymer based PICs offer scalability with increased data-rates as well as lower cost structures and provide an excellent vehicle to address the 'purple brick walls’ (cost/performance) that have appeared in photonics roadmaps.
Programmable photonic ICs: making optical devices more versatile
Wim Bogaerts - Ghent University/imec
Most of today’s photonic ICs are designed for a specific purpose and targeted at a specific application, in that they resemble an electronic application-specific integrated circuit (ASIC). But with PIC technologies and design processes now starting to support larger-scale integration, this opens the door to more generic photonics ICs that can be reconfigured or programmed for diverse applications, resembling electronic FPGAs. Such circuits can implement programmable wavelength filters for WDM or microwave photonics, tunable delay lines, multi-format transceivers or optical information processors. In our talk, we will discuss the current state of this new field in PICs, and the future challenges and applications.
Coupling electronics and photonics – promising paths for device-makers to explore
Tan Yong Tsong - Institute of Microelectronics
Silicon photonics packaging is a crucial technology for the commercialisation of photonic integrated circuits (PICs) - especially with the drive towards small form-factor and lower cost modules. Comprehensive capabilities have been established in device libraries and associated tool boxes to enable the integration of electronic chips, low cost lateral optical fibre assembly and automated laser diode assembly. Further innovation in the areas of optical packaging, electronic-photonic integrated circuit (EPIC) full co-design will lead to a more integrated solution for enabling optimal performance and cost effectiveness. These developments will help to achieve the next milestones in Si-Photonics and contribute to addressing overall system requirements - boosting the deployment of products in the market.
Highly integrated silicon photonics to push PICs to the next level
Radha Nagarajan - Inphi
Silicon photonics beyond silicon-on-insulator - emerging solutions for integrated photonics
Sasan Fathpour - CREOL, The College of Optics & Photonics
Integrating photonic building blocks towards complete electro-optical computing
Yvain Thonnart - CEA-Leti
Efficient data transfer between IOs, memories and cores is a key element of high-performance computing. The trend for massively parallel architectures increases the communication needs, at the cost of increasing latency and power consumption. To overcome this, we are investigating the potential of optical communication on large silicon interposers, to stack and connect computing and memory chiplets together. In this talk, we present recent developments at CEA-Leti considering the architectural, design and fabrication aspects of optical interposers, from digital and high-speed analog elements, to the optical devices, in view of the power and thermal constraints. In addition, we share our insight on the integration of these building blocks in a complete electro-optical computing module.
III-V membrane lasers on silicon for datacom and computercom applications
Shinji Matsuo - NTT
Delivering the goods: advances in PIC manufacturing
Vertical integration: bringing key elements together to match PICs to the market
Henk Bulthuis - Kaiam Corporation
At PIC International 2018, we'll be discussing planar lightwave circuits and free space coupling techniques, highlighting functions for various commercial transceiver configurations targeting data centre and telecoms applications.
Inline wafer-scale photonic testing to boost PIC manufacturing efficiency
Jessie Rosenberg - IBM
Meeting the challenge of producing PICs at high-volume
Jack Xu - Finisar
PIC Design, simulation and packaging: a blueprint for future success
From schematic to layout – overcoming today’s PIC design challenges
Christopher Cone - Mentor Graphics
Scalable design of integrated photonic and optoelectronic circuits
André Richter - VPIphotonics
Efficient and convenient solutions for electronic photonic design automation (EPDA) present fundamental prerequisites for the fast and innovative development of next generation integrated photonic and optoelectronic circuits. To highlight progress in this area, we will demonstrate how a layout-aware schematic-driven methodology enables the rapid prototyping of new design concepts, including parameter optimization of photonic and electronic parts, analysis of manufacturing tolerances, and comparison of technology and integration alternatives.
PIXAPP – Open Access Opportunities for Advanced PIC Packaging’
Peter O'Brien - Tyndall
PIC horizons: new and emerging applications for integrated photonics
Low size, weight and power (SWaP) instruments for sensing applications - cutting edge PICs
Milan Mashanovitch - Freedom Photonics
Adding the ‘tech’ to biotech - opportunities for photonic integrated circuits
Sascha Geidel - Fraunhofer ENAS
Putting liquid crystal waveguides in the fast lane automotive applications for PICs
Andrew Sparks - Analog Devices