Michael Lebby, Chair in Optoelectronics at Glyndŵr University, CEO at Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Noori Nourshargh, , N2Scientific
Noori graduated in Electrical Engineering in 1976 from Imperial College London followed by a PhD in fibre optics from the same university.
He worked for GEC-Marconi for 20 years as a research scientist focussing on photonic devices, optical fibres, thin films, sensors, multi-chip modules and interconnects. He then became Director of Engineering at Optical Micro Devices responsible for 8" silicon wafer processing of integrated optical devices. He now runs his own technical consultancy and undertakes some part time teaching on nano-technology and microfabrication.
Conference Programme Manager
James Tyrrell, Conference Programme Manager
James is the Editor of PIC International magazine and Conference Programme Manager for PIC International. He is a science and technology writer with more than 10 years of experience in covering research breakthroughs, emerging applications and their impact on the market. Previously, James has held editorial positions on a number of industry publications, including titles focusing on photonics, nanotechology and the commercialization of advanced materials. Before hanging up his lab coat for a career in journalism, he worked as a medical device engineer in the UK, measured the properties of nanobubbles in Australia, and built equipment in Germany that used part of a digital watch to look for faults in computer chips.
Panel: Has silicon photonics got the required scalability to displace InP?
Silicon photonics has attracted the interest of many in large corporations, SMEs, and academics as a potential replacement to the incumbent PIC technology InP. SiP offers natural electronics and photonics integration but can’t source laser light unless custom techniques of packaging, bonding etc are utilized with InP based sources. Also, given that SiP may well be on 200mm and 300mm wafers, it is also not clear if the volume requirements are at a level to attract serious attention in large scale fabs. Given these conditions, the question remains to ask if SiP can be truly scalable towards $1/Gbps at 400Gbps data rates and above (for any distance)?
Panel: High volume transceiver opportunities for PICs
Will transceivers ever achieve super high volumes to allow scalability in cost and performance, and if so, what would be the common large volume platforms, and more specifically, what would be the transceiver format/form factor. Will these volumes be in the 50m or 100m or 200m level? What percentage of transceivers in a decade will contain PICs, and if so where would you expect to see a PIC being used in a transceiver. Will PICs in transceivers will be three chip, two chip, or one chip (OEIC) solutions? Lastly, will transceivers ever go away or evolve to new designs, especially with COBO and other non-pluggble innovations?
Moving the data: PICs for cloud computing and telecoms
PIC opportunities for datacentres
Vincent Zeng - Facebook
Big data analysis - a golden opportunity for silicon photonics
Yuichi Nakamura - NEC
Today, information and communication technology (ICT) systems make a valuable contribution to solving social problems, with techniques such as big data analysis able to enrich our daily life in many ways. Evolution in processing architecture puts faster performance in reach, but only if innovation in interface architecture among servers can be achieved to avoid the bottleneck of data communication. One solution is optical communication among the servers, and to share our thoughts on the topic we will examine the latest trends in silicon photonics as a way forwards, as well as looking ahead at the advantages of optical connection further into the future.
Data centre technology - the big PICture, opportunities for energy efficient photonics
Eric Mounier - Yole Développement
The Zettabyte is not enough: Volume handling for InP, silicon photonics, and hybrid photonic integration
Martin Schell - Fraunhofer HHI
Cisco with its Visual Networking Index has announced the Zettabyte era, as in 2016 the annual run rate for global IP traffic was 1.2 ZB per year. On the other hand, a single InP 3” wafer with lasers or detectors supports some 30,000 devices @ 50Gbit/sec each, equating to roughly 5 ZB per year, when operated continuously. Hence, the success of a particular integration platform relies on its capability of either being able to deal with rather low wafer numbers, or adding (senseful) functionality to increase the per-device-area, or to radically increase the market by going outside telecom/datacom. The presentation will compare InP monolithic, Silicon Photonics, and polymer based hybrid photonic integration with respect to this regard.
III-V photonic integrated circuits for telecoms and beyond
Weiming Yao - JePPIX/PITC
The generic foundry approach to photonic integrated circuits (PIC) has enabled easy access to PIC technology by lowering its entry and prototyping costs, leading to the wider adoption of optical chips across many application areas. We focus here on the recent progress and the challenges of high-capacity WDM transmitters on III-V material for data and telecom that have been fabricated in such generic integration platforms. Furthermore, we outline the platform architecture of the next generation PICs that support extended scaling in device footprint and performance and at the same time assure a more intimate integration with electronics.
Massive array integration and the need for a holistic digital/analog optics/electronics co-design
Peter Winzer - Nokia Bell Labs
The need for 10-Tb/s interfaces operating in 1-Pb/s systems and networks asks for massive array integration across both wavelength and spatial domains. While being accompanied by a series of new device and packaging challenges, the close integration of massive opto-electronic arrays also bears a wealth of opportunities arising from a holistic view of a fully integrated digital-electronics/analog-optics communications engine. Options include the mitigation of integration-induced array impairments using powerful digital signal processing, and the ample use of comb sources as external optical power supplies. This talk will discuss challenges and solution paths towards a 10-Tb/s optics-in/optics-out digital communications engines.
Refining the PIC: achieving the next milestone in performance
Scalable PIC platforms: The impact of using polymer PICs for 100 and 400Gbps datacom applications
Michael Lebby - Lightwave Logic
The explosive growth of integrated photonics both in datacenters, telecom as well as non-communications applications, especially from a market standpoint are opening new doors for scalable PIC platforms. Polymer based PICs offer scalability with increased data-rates as well as lower cost structures and provide an excellent vehicle to address the 'purple brick walls’ (cost/performance) that have appeared in photonics roadmaps.
Programmable photonic ICs: making optical devices more versatile
Wim Bogaerts - Ghent University/imec
Most of today’s photonic ICs are designed for a specific purpose and targeted at a specific application, in that they resemble an electronic application-specific integrated circuit (ASIC). But with PIC technologies and design processes now starting to support larger-scale integration, this opens the door to more generic photonics ICs that can be reconfigured or programmed for diverse applications, resembling electronic FPGAs. Such circuits can implement programmable wavelength filters for WDM or microwave photonics, tunable delay lines, multi-format transceivers or optical information processors. In our talk, we will discuss the current state of this new field in PICs, and the future challenges and applications.
Converging photonics and microelectronics: applying advanced technologies to ramp up PIC performance
Luis Henrique Hecker de Carvalho - BrPhotonics
The increase in data transmission rates in optical communication systems are directly related to industry-wide advances in photonic components and technology. Highly-reliable and scalable wafer processing techniques well-established in the microelectronics sector play a key role in integrated photonics evolution as witnessed by the manufacturing of lasers, modulators and receivers. Other talking points include convergence with microelectronic ASICs through advanced packaging, and monolithic integration processes targeting optical communications applications.
Coupling electronics and photonics – promising paths for device-makers to explore
Tan Yong Tsong - Institute of Microelectronics
Silicon photonics packaging is a crucial technology for the commercialisation of photonic integrated circuits (PICs) - especially with the drive towards small form-factor and lower cost modules. Comprehensive capabilities have been established in device libraries and associated tool boxes to enable the integration of electronic chips, low cost lateral optical fibre assembly and automated laser diode assembly. Further innovation in the areas of optical packaging, electronic-photonic integrated circuit (EPIC) full co-design will lead to a more integrated solution for enabling optimal performance and cost effectiveness. These developments will help to achieve the next milestones in Si-Photonics and contribute to addressing overall system requirements - boosting the deployment of products in the market.
Highly integrated silicon photonics to push PICs to the next level
Radha Nagarajan - Inphi
Silicon photonics beyond silicon-on-insulator - emerging solutions for integrated photonics
Sasan Fathpour - CREOL, The College of Optics & Photonics
Integrating photonic building blocks towards complete electro-optical computing
Yvain Thonnart - CEA-Leti
Efficient data transfer between IOs, memories and cores is a key element of high-performance computing. The trend for massively parallel architectures increases the communication needs, at the cost of increasing latency and power consumption. To overcome this, we are investigating the potential of optical communication on large silicon interposers, to stack and connect computing and memory chiplets together. In this talk, we present recent developments at CEA-Leti considering the architectural, design and fabrication aspects of optical interposers, from digital and high-speed analog elements, to the optical devices, in view of the power and thermal constraints. In addition, we share our insight on the integration of these building blocks in a complete electro-optical computing module.
III-V membrane lasers on silicon for datacom and computercom applications
Shinji Matsuo - NTT
Lasers on silicon substrate are expected to fabricate large-scale PICs with low cost because they can be heterogeneously integrated with low-cost Si photonics devices. In addition to the cost issue, reducing the power consumption of laser is quite important because it limits the integration density of PIC. For this purpose, we have developed membrane lasers on SiO2/Si substrate, in which large optical confinement factor enables us to enhance the modulation efficiency of directly modulated laser. We employ epitaxial regrowth to fabricate buried heterostructure on directly bonded III-V layers on SiO2/Si substrate, which allows us to employ large-scale Si substrate for fabricating lasers.
Delivering the goods: advances in PIC manufacturing
Silicon nitride based TriPleX PIC modules in a broad range of applications
Arne Leinse - LioniX
The silicon nitride based waveguide technology (TriPleX™) of LioniX International enables new applications due to its unique properties. The ultra-low loss over a broad wavelength range (from 405-2350 nm), the ability to create spot size converters, the integration of low power phase shifters and the hybrid integration with other platforms. Supplying PIC based modules instead of PICs only moved the mature PIC platform from technology push to market pull. Fully assembled plug and play modules lower the access barrier for the development of new applications and the hybrid combination with for instance InP enables unique functionalities. In this presentation application examples of PIC based modules will be described in more detail and an outlook will be given to future technology developments.
Vertical integration: bringing key elements together to match PICs to the market
Henk Bulthuis - Kaiam Corporation
At PIC International 2018, we'll be discussing planar lightwave circuits and free space coupling techniques, highlighting functions for various commercial transceiver configurations targeting data centre and telecoms applications.
Inline wafer-scale photonic testing to boost PIC manufacturing efficiency
Jessie Rosenberg - IBM
Meeting the challenge of producing PICs at high-volume
Jack Xu - Finisar
Presentation title to be confirmed.
Scott Jordan - Physik Instrumente
PIC Design, simulation and packaging: a blueprint for future success
From schematic to layout – overcoming today’s PIC design challenges
Christopher Cone - Mentor Graphics
Scalable design of integrated photonic and optoelectronic circuits
André Richter - VPIphotonics
Efficient and convenient solutions for electronic photonic design automation (EPDA) present fundamental prerequisites for the fast and innovative development of next generation integrated photonic and optoelectronic circuits. To highlight progress in this area, we will demonstrate how a layout-aware schematic-driven methodology enables the rapid prototyping of new design concepts, including parameter optimization of photonic and electronic parts, analysis of manufacturing tolerances, and comparison of technology and integration alternatives.
PIXAPP – Open Access Opportunities for Advanced PIC Packaging’
Peter O'Brien - Tyndall
PIC horizons: new and emerging applications for integrated photonics
Low size, weight and power (SWaP) instruments for sensing applications - cutting edge PICs
Milan Mashanovitch - Freedom Photonics
Adding the ‘tech’ to biotech - opportunities for photonic integrated circuits
Sascha Geidel - Fraunhofer ENAS
Biochemical analytics and diagnostics are pushing forward into areas outside the laboratory and towards mobile and stand-alone field applications. Efficient diagnostic devices are easy to use, lightweight and provide reliable results. The focus of applied research is to validate the efficient selection of technologies and enable their smooth integration into small packages. Photonic integrated circuits have a key role to play in driving performance and contributing to a compact final device, and -- to highlight these elements -- this talk presents the transformation of a PIC into a biosensor. To allow automated biochemical process execution, the PIC is combined with a fluidic circuit. The system application targets explanatory exploration missions in terms of a wet chemical payload - for example, on board a Mars-rover. Nevertheless, the development procedure can also be transferred to other decentralized diagnostic applications on earth.
Lidar for autonomous driving: opportunities for liquid crystal beam steering and other photonic technologies
Andrew Sparks - Analog Devices
Autonomous driving will be enabled by three types of sensors: radar, vision, and lidar (light detection and ranging). Lidar employs lasers, beam steering elements, and photodetectors, along with substantial electronic functions, to create 3D maps with angular resolution superior to radar and range resolution superior to cameras. Some analysts project lidar to grow to a US$80B market in 2035.
Most vehicle manufacturers expect forward-looking lidar systems to see 200 m and to be insensitive to shock and vibration. To achieve this level of performance, Analog Devices is developing electro-optic beam steering technology using liquid crystals. The benefits of this technology will be discussed in addition to the requirements of other photonic components in the lidar module and opportunities for photonic integration.