Two days, five themes, over 30 inspiring presentations

The presentations will be grouped into five key themes which collectively provide complete coverage of the integrated photonics industry.

The PIC International conference has attracted industry leading experts from all the major companies involved in the photonic integrated circuit industry.

If you are interested in speaking at PIC International 2019, please contact or call +44 (0)24 76718970.

Speakers Include

Michael Liehr
Ronald Broeke
Martin Guy
Graham Reed
Jose Pozo
Martijn Heck
John Magan
Katharine Schmidtke
Speaker Name TBC
Martin Zirngibl
Di Liang
Kei May Lau
Mehrdad Ziari
Thomas Liljeberg
Speaker Name TBC
Dirk Van Den Borne
Henk Bulthuis
Michael Geiselmann
Pauline Rigby
Michael Lebby
Arne Leinse
Speaker Name TBC
Speaker Name TBC
Ruth Houbertz
Jochen Zimmer
Nicolas Psaila
Albert Hasper
Ewit Roos
Scott Jordan
Speaker Name TBC
Eric Higham
Speaker Name TBC
Speaker Name TBC
Peter O'Brien
Speaker Name TBC

 Conference Chair

Michael Lebby, Chair in Optoelectronics at Glyndŵr University, CEO at Lightwave Logic Inc

Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.

  PICs Today − Datacom, Imaging and Transport

The future and economics of PICs and PLCs in data center applications

Henk Bulthuis - Kaiam Corporation

Awaiting abstract.

Presentation TBC

Ewit Roos - Photon Delta

Awaiting abstract.

Large scale PICs, integration with InP lasers and PICs across future networks and markets

Mehrdad Ziari - Infinera

Awaiting abstract.

Achieving high quality 100G data center PIC Integration

Katharine Schmidtke - Facebook

Awaiting abstract.

Device prototyping using the CORNERSTONE platform

Graham Reed - Cornerstone, University of Southampton

As the market adoption of silicon photonics technologies continues to rise, and ever more fabless companies enter the market, there is a clear need for a flexible device prototyping foundry service that retains the ability for device level innovation, and also offers a clear path for up-scaling. The CORNERSTONE platform offers a low cost multi-project-wafer (MPW) service that enables a degree of customisation, which may not be accessible at other foundries. Through the use of projection lithography, fabrication processes can be easily transferred to other foundries for mass production. Additionally, the ability to exploit high resolution e-beam lithography mimics more advanced technology nodes for certain layers, should this be deemed necessary. This talk gives an overview of the CORNERSTONE platform.

AIM Photonics’ role in developing next generations of PICs and TAP manufacturing expertise

Michael Liehr - American Institute for Manufacturing Photonics

AIM Photonics is a Manufacturing USA institute whose mission is to provide cost-effective and easy-to-use access to state-of-the-art silicon photonics processing. AIM Photonics is providing access to a Multi-Project-Wafer program enabled with a highly competitive component library and offers Assembly and Packaging services starting 2019. AIM is supporting consortium projects with the intent to enable new manufacturing technology for reduced assembly cost, but is also developing custom processes in support of industry or government funded PIC products. AIM has a Si Photonics process available at SUNY Poly and an InP offering at Infinera and potential application examples will be discussed.

  PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation Title TBC

Martijn Heck - ePIXfab – European Silicon Photonics Alliance

Awaiting abstract.

Where next for VCSELs in 3D sensing applications?"

Speaker Name TBC - IQE

Awaiting abstract.

Rethinking the photonics IC design flow to make high-quality PIC design easier, cheaper and faster

Ronald Broeke - BRIGHT Photonics

Awaiting abstract.

The Emergence of Non-Position Positioning in Fast Manufacturing Automation

Scott Jordan - Physik Instrumente

Requirements have escalated for perfect relative positioning of manufactured components. Examples: In Silicon Photonics, orientation of components to extreme tolerances is needed in multiple test and assembly steps. In Smartphone camera manufacturing, more elements are assembled to tighter tolerances with each generation.   Previously this demanded exceptional dimensional control and fixturing, or painstaking positioning. But a new branch of intelligent control now provides fast, automatic, nanoscale-accurate orientation optimization in test and assembly. This improves process economics and yield by eliminating time-consuming steps and decoupling alignment from position metrology. The key is leveraging device optimization physics to reduce dependence on position commandability. A universal implementation is now commercially available and fab-proven. Process cost reductions of 99% are seen. 

Large scale assembly and packaging foundry for PICs

Albert Hasper - Phix

PHIX mission is to become world leader foundry in packaging and assembly of Photonic Integrated Circuits (PIC’s) by supplying PIC based components and modules in scalable production volumes. PHIX photonics assembly is a new initiative to facilitate our customers in the assembly of all packaging challenges for PICs including product design for manufacturing. The talk will highlight the roadmap from pilot line production towards HVM-production. Key is to have the right capabilities and capacities needed to serve our customers. Further, automated tools and machines are needed to address the future needs, this will also be discussed

  PICs Reimagined − Hybrids and Materials Innovation

Additive manufacturing by two-photon-polymerization for photonic integration

Jochen Zimmer - Nanoscribe

Two-photon-polymerization can be used for the direct printing of complex micro- and mesoscale 3D parts. These parts can be transparent, have optical-quality surfaces, and be printed on pre-structured surfaces such as PICs. Each part can be printed with parameters optimized for the individual assembly it is printed on. Thus, this technology offers an interesting way to integrate components from different sources.

Vertical integration in SiN based foundry enables new applications

Arne Leinse - LioniX International

The integration of Photonic Integrated Circuits (PICs) in functional modules enables endusers to use PICs in a variety of applications. Due to the hybrid integration of multiple platforms in a single module a variety of new applications can be addressed. For the silicon nitride based TriPleX platform these range from 5G to virtual reality and sensing. The main benefit is in the low loss properties over a large wavelength range enabling these different applications. In this talk we will show the capabilities of these modules and the necessity for vertical integration. It is all about module functionality and not about PICs.

Polymer PIC opportunities in Applications Beyond 100G

Michael Lebby - Lightwave Logic

Awaiting abstract.

New advances in Silicon Nitride (siN) PIC Applications

Michael Geiselmann - LIGENTEC

Awaiting abstract.

  PIC ROI − Show Me the Money

Coherent DWDM router interfaces: Opportunities for photonic integration

Dirk Van Den Borne - Juniper

Awaiting abstract.

Innovative device and material technologies for large scale integrated photonics

Kei May Lau - Hong Kong University of Science & Technology

Awaiting abstract.

Assessing the long-term growth and market potential for PIC devices in datacom, transport and networks

Eric Higham - Strategy Analytics

Historically, growth of optical markets was sinusoidal; periods of sharp contraction followed times of booming expansion in a repeating pattern. While the past was not for the faint of heart, recent performance shows that the optical market has gotten far less volatile, with a strong upward growth trajectory. This presentation will explore the shift in drivers for optical market growth and the trends for the future. It will also address the advantages and disadvantages of Photonic Integrated Circuits (PIC), their most likely applications and the use of compound semiconductor technologies in PICs, as well as the broader optical market.

  PICs Beyond 100G − Evolution and Revolution

New VCSEL opportunities in 3D sensing and beyond

Pauline Rigby - Lightcounting

Awaiting abstract.

The role of PICs in Tb/s datacenter environments: Is pluggability dead?

Martin Zirngibl - Finisar

Awaiting abstract.

The benefits of low-barrier access to new production services for PICs today and tomorrow

Jose Pozo - EPIC

The requirement for new technologies able to support faster, more efficient and less consuming devices has triggered the adoption of Photonic Integrated Circuits (PICs) for many different applications. The Pilot Lines in Photonics provide a fast service for prototyping and low-volume production of Photonic Integrated Circuits (PIC)-based products helping companies to reduce the time-to-market. The Pilot Lines, PIXAPP – for packaging and assembly PICs, MIRPHAB – for developing QCLs based chemical sensors, and PIX4LIFE – Si3N4 PICs for life sciences cover a wide range of applications from telecom to healthcare, including environmental monitoring and industrial sensing.

PIC Challenges for High Capacity Systems

Martin Guy - Ciena Corporation

Awaiting abstract.

The critical role that EC support for photonics and PIC devices plays in our manufacturing future.

John Magan - European Commission Photonics Unit

Recognising the importance of photonics and PICs, the EU’s ICT research programme has worked with the photonics industry and research community to run a series of actions to build up a technology base in Europe, particularly in PIC manufacturing. This presentation will review these actions, consider the lessons learned, and look to further opportunities for support and the next research programme beyond 2020: Horizon Europe.

Presentation Title TBC

Nicolas Psaila - Optoscribe

Integrated Silicon Photonics for future Datacenter Applications

Thomas Liljeberg - Intel

Awaiting abstract.

  Theme To Be Decided

Presentation Title TBC

Speaker Name TBC - Lumerical

Awaiting abstract.

Presentation Title TBC

Speaker Name TBC - Ficontec

Awaiting abstract.

Presentation Title TBC

Speaker Name TBC - Luceda Photonics

Awaiting abstract.

Presentation Title TBC

Ruth Houbertz - Multiphoton Optics

Awaiting abstract.

Presentation Title TBC

Awaiting abstract.

Presentation Title TBC

Speaker Name TBC - Synopsys

Awaiting abstract.

Presentation Title TBC

Speaker Name TBC - Smart Photonics

Awaiting abstract.

Tyndall Presentation - Title TBC

Peter O'Brien - Tyndall


Presentation TBC - HPE

Di Liang - Hewlett Packard Enterprise

Awaiting abstract.

Presentation Title TBC

Speaker Name TBC - Teem Photonics

Awaiting abstract.

Presentation Title TBC

Speaker Name TBC - VPIphotonics

Awaiting abstract.

*All speakers and presentations are subject to change.

Book your place today for 2019 - 3 events, 2 days, 1 ticket
The must attend conference for all professionals involved within the integrated photonics industry.