Two days, five themes, over 30 inspiring presentations

The presentations will be grouped into five key themes which collectively provide complete coverage of the integrated photonics industry.

The PIC International conference has attracted industry leading experts from all the major companies involved in the photonic integrated circuit industry.

If you are interested in speaking at PIC International 2019, please contact [email protected] or call +44 (0)24 76718970.


Speakers Include

Michael Liehr
Martin Guy
Jose Pozo
Martijn Heck
John Magan
Martin Zirngibl
Kei May Lau
Mehrdad Ziari
Dirk Van Den Borne
Henk Bulthuis
Michael Geiselmann
Pauline Rigby
Michael Lebby
Ruth Houbertz
Ewit Roos
TBC
Eric Higham
Peter O'Brien


 Conference Chair


Michael Lebby, Chair in Optoelectronics at Glyndŵr University, CEO at Lightwave Logic Inc

Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.



  PICs Today − Datacom, Imaging and Transport


The future and economics of PICs and PLCs in data center applications

Henk Bulthuis - Kaiam Corporation

Awaiting abstract.



Presentation TBC

Ewit Roos - Photon Delta

Awaiting abstract.



Large scale PICs, integration with InP lasers and PICs across future networks and markets

Mehrdad Ziari - Infinera

Awaiting abstract.



AIM Photonics’ role in developing next generations of PICs and TAP manufacturing expertise

Michael Liehr - American Institute for Manufacturing Photonics

AIM Photonics is a Manufacturing USA institute whose mission is to provide cost-effective and easy-to-use access to state-of-the-art silicon photonics processing. AIM Photonics is providing access to a Multi-Project-Wafer program enabled with a highly competitive component library and offers Assembly and Packaging services starting 2019. AIM is supporting consortium projects with the intent to enable new manufacturing technology for reduced assembly cost, but is also developing custom processes in support of industry or government funded PIC products. AIM has a Si Photonics process available at SUNY Poly and an InP offering at Infinera and potential application examples will be discussed.


  PIC Innovation − EPDA, TAP & PICs Beyond Datacom


Presentation Title TBC

Martijn Heck - ePIXfab – European Silicon Photonics Alliance

Awaiting abstract.



Where next for VCSELs in 3D sensing applications?"

- IQE

Awaiting abstract.


  PICs Reimagined − Hybrids and Materials Innovation


Polymer PIC opportunities in Applications Beyond 100G

Michael Lebby - Lightwave Logic

Awaiting abstract.



New advances in Silicon Nitride (siN) PIC Applications

Michael Geiselmann - LIGENTEC

Awaiting abstract.


  PIC ROI − Show Me the Money


Coherent DWDM router interfaces: Opportunities for photonic integration

Dirk Van Den Borne - Juniper

Awaiting abstract.



Innovative device and material technologies for large scale integrated photonics

Kei May Lau - Hong Kong University of Science & Technology

Awaiting abstract.



Assessing the long-term growth and market potential for PIC devices in datacom, transport and networks

Eric Higham - Strategy Analytics

Historically, growth of optical markets was sinusoidal; periods of sharp contraction followed times of booming expansion in a repeating pattern. While the past was not for the faint of heart, recent performance shows that the optical market has gotten far less volatile, with a strong upward growth trajectory. This presentation will explore the shift in drivers for optical market growth and the trends for the future. It will also address the advantages and disadvantages of Photonic Integrated Circuits (PIC), their most likely applications and the use of compound semiconductor technologies in PICs, as well as the broader optical market.


  PICs Beyond 100G − Evolution and Revolution


New VCSEL opportunities in 3D sensing and beyond

Pauline Rigby - Lightcounting

Awaiting abstract.



The role of PICs in Tb/s datacenter environments: Is pluggability dead?

Martin Zirngibl - Finisar

Awaiting abstract.



The benefits of low-barrier access to new production services for PICs today and tomorrow

Jose Pozo - EPIC

The requirement for new technologies able to support faster, more efficient and less consuming devices has triggered the adoption of Photonic Integrated Circuits (PICs) for many different applications. The Pilot Lines in Photonics provide a fast service for prototyping and low-volume production of Photonic Integrated Circuits (PIC)-based products helping companies to reduce the time-to-market. The Pilot Lines, PIXAPP – for packaging and assembly PICs, MIRPHAB – for developing QCLs based chemical sensors, and PIX4LIFE – Si3N4 PICs for life sciences cover a wide range of applications from telecom to healthcare, including environmental monitoring and industrial sensing.



PIC Challenges for High Capacity Systems

Martin Guy - Ciena Corporation

Awaiting abstract.



The critical roles that photonics and PIC devices play in our manufacturing future: Horizon Europe

John Magan - European Commission Photonics Unit

Awaiting abstract.


  Theme To Be Decided


Presentation Title TBC

- Cornerstone

Awaiting abstract.



Presentation Title TBC

- Ficontec

Awaiting abstract.



Presentation Title TBC

- Luceda Photonics

Awaiting abstract.



Presentation Title TBC

Ruth Houbertz - Multiphoton Optics

Awaiting abstract.



Presentation Title TBC

- Nanoscribe

Awaiting abstract.



Presentation Title TBC

- Synopsys

Awaiting abstract.



Presentation Title TBC

- Smart Photonics

Awaiting abstract.



Tyndall Presentation - Title TBC

Peter O'Brien - Tyndall

TBC



Physik Instrumente - Presentation title TBC

TBC - Physik Instrumente

Awaiting abstract.



Presentation Title TBC

- Teem Photonics

Awaiting abstract.



Presentation Title TBC

- VPIphotonics

Awaiting abstract.


*All speakers and presentations are subject to change.

Book your place today for 2019 - 3 events, 2 days, 1 ticket
The must attend conference for all professionals involved within the integrated photonics industry.