Michael Lebby, Chair in Optoelectronics at Glyndŵr University, CEO at Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Noori Nourshargh, , N2Scientific
Noori graduated in Electrical Engineering in 1976 from Imperial College London followed by a PhD in fibre optics from the same university.
He worked for GEC-Marconi for 20 years as a research scientist focussing on photonic devices, optical fibres, thin films, sensors, multi-chip modules and interconnects. He then became Director of Engineering at Optical Micro Devices responsible for 8" silicon wafer processing of integrated optical devices. He now runs his own technical consultancy and undertakes some part time teaching on nano-technology and microfabrication.
Conference Programme Manager
James Tyrrell, Conference Programme Manager
James is the Editor of PIC International magazine and Conference Programme Manager for PIC International. He is a science and technology writer with more than 10 years of experience in covering research breakthroughs, emerging applications and their impact on the market. Previously, James has held editorial positions on a number of industry publications, including titles focusing on photonics, nanotechology and the commercialization of advanced materials. Before hanging up his lab coat for a career in journalism, he worked as a medical device engineer in the UK, measured the properties of nanobubbles in Australia, and built equipment in Germany that used part of a digital watch to look for faults in computer chips.
Panel: Has silicon photonics got the required scalability to displace InP?
Silicon photonics has attracted the interest of many in large corporations, SMEs, and academics as a potential replacement to the incumbent PIC technology InP. SiP offers natural electronics and photonics integration but can’t source laser light unless custom techniques of packaging, bonding etc are utilized with InP based sources. Also, given that SiP may well be on 200mm and 300mm wafers, it is also not clear if the volume requirements are at a level to attract serious attention in large scale fabs. Given these conditions, the question remains to ask if SiP can be truly scalable towards $1/Gbps at 400Gbps data rates and above (for any distance)?
Panel: High volume transceiver opportunities for PICs
Will transceivers ever achieve super high volumes to allow scalability in cost and performance, and if so, what would be the common large volume platforms, and more specifically, what would be the transceiver format/form factor. Will these volumes be in the 50m or 100m or 200m level? What percentage of transceivers in a decade will contain PICs, and if so where would you expect to see a PIC being used in a transceiver. Will PICs in transceivers will be three chip, two chip, or one chip (OEIC) solutions? Lastly, will transceivers ever go away or evolve to new designs, especially with COBO and other non-pluggble innovations?
Moving the data: PICs for cloud computing and telecoms
PIC opportunities for datacentres
Vincent Zeng - Facebook
The growth in network bandwidth at Mega Data-Centers is putting pressure on the photonic technologies to rapidly deliver high-bandwidth interconnects at high volume. In this talk, we will describe Facebook’s scale and some of the trends that are fueling this bandwidth growth. This bandwidth growth will fuel innovation not only in technology, but also in manufacturing processes as traditional technologies struggle to meet the volume challenge. This will change the optics development and commercialization process and open the door for Photonic Integrated Circuits as yield management drives improvements in the wafer-level and advanced photonics packaging with scaled manufacturability and automation.
Big data analysis - a golden opportunity for silicon photonics
Yuichi Nakamura - NEC
Today, information and communication technology (ICT) systems make a valuable contribution to solving social problems, with techniques such as big data analysis able to enrich our daily life in many ways. Evolution in processing architecture puts faster performance in reach, but only if innovation in interface architecture among servers can be achieved to avoid the bottleneck of data communication. One solution is optical communication among the servers, and to share our thoughts on the topic we will examine the latest trends in silicon photonics as a way forwards, as well as looking ahead at the advantages of optical connection further into the future.
Silicon Photonics for Distributed data centre interconnects
Radha Nagarajan - Inphi
Modern day data centre interconnects are not limited by distances. Although the data centres themselves are physical locations, limited in land area, the optical interconnects between them could span anywhere from 10’s km of terrestrial distances to 1000’s of km subsea routes. In this talk, we will focus on the application of Silicon photonics to regional, latency limited data centre interconnects. The discussion will be on low power, high speed, switch pluggable modules that allow for the physical disaggregation of the data centre locations, thus enabling highly redundant and distributed data centre architectures.
Data centre technology - the big PICture, opportunities for energy efficient photonics
Eric Mounier - Yole Développement
The Zettabyte is not enough: Volume handling for InP, silicon photonics, and hybrid photonic integration
Martin Schell - Fraunhofer HHI
Cisco with its Visual Networking Index has announced the Zettabyte era, as in 2016 the annual run rate for global IP traffic was 1.2 ZB per year. On the other hand, a single InP 3” wafer with lasers or detectors supports some 30,000 devices @ 50Gbit/sec each, equating to roughly 5 ZB per year, when operated continuously. Hence, the success of a particular integration platform relies on its capability of either being able to deal with rather low wafer numbers, or adding (senseful) functionality to increase the per-device-area, or to radically increase the market by going outside telecom/datacom. The presentation will compare InP monolithic, Silicon Photonics, and polymer based hybrid photonic integration with respect to this regard.
III-V photonic integrated circuits for telecoms and beyond
Weiming Yao - JePPIX/PITC
The generic foundry approach to photonic integrated circuits (PIC) has enabled easy access to PIC technology by lowering its entry and prototyping costs, leading to the wider adoption of optical chips across many application areas. We focus here on the recent progress and the challenges of high-capacity WDM transmitters on III-V material for data and telecom that have been fabricated in such generic integration platforms. Furthermore, we outline the platform architecture of the next generation PICs that support extended scaling in device footprint and performance and at the same time assure a more intimate integration with electronics.
Massive array integration and the need for a holistic digital/analog optics/electronics co-design
Peter Winzer - Nokia Bell Labs
The need for 10-Tb/s interfaces operating in 1-Pb/s systems and networks asks for massive array integration across both wavelength and spatial domains. While being accompanied by a series of new device and packaging challenges, the close integration of massive opto-electronic arrays also bears a wealth of opportunities arising from a holistic view of a fully integrated digital-electronics/analog-optics communications engine. Options include the mitigation of integration-induced array impairments using powerful digital signal processing, and the ample use of comb sources as external optical power supplies. This talk will discuss challenges and solution paths towards a 10-Tb/s optics-in/optics-out digital communications engines.
Quo Vadis – Industrial High Precision 3D Printing
Driven by IoT, Industry 4.0, and social media the amount of data to be transferred is tremendously increasing, pushing the need for energy-efficient device concepts for a vast variety of products. Low energy data transfer can be achieved by optical interconnects, or by introducing optical elements such as specially designed microlenses into semiconductor laser packaging using High Precision 3D Printing. This allows to significantly reduce process steps independently of the packaging task. Scalability and high throughput with fabrication times from seconds for optical waveguides and single microlenses to only a few minutes for more complex lens systems are demonstrated.
Quo Vadis – Industrial High Precision 3D Printing
Ruth Houbertz - Multiphoton Optics
Driven by IoT, Industry 4.0, and social media - the amount of data to be transferred is increasing tremendously, pushing the need for energy-efficient device concepts for a vast variety of products. Low energy data transfer can be achieved by optical interconnects, or by introducing optical elements such as specially designed microlenses into semiconductor laser packaging using High Precision 3D Printing. This allows device makers to significantly reduce process steps independently of the packaging task. Scalability and high throughput with fabrication times from seconds (for optical waveguides and single microlenses) to only a few minutes (for more complex lens systems) are explored as part of the presentation.
Refining the PIC: achieving the next milestone in performance
Scalable PIC platforms: The impact of using polymer PICs for 100 and 400Gbps datacom applications
Michael Lebby - Lightwave Logic
The explosive growth of integrated photonics both in datacenters, telecom as well as non-communications applications, especially from a market standpoint are opening new doors for scalable PIC platforms. Polymer based PICs offer scalability with increased data-rates as well as lower cost structures and provide an excellent vehicle to address the 'purple brick walls’ (cost/performance) that have appeared in photonics roadmaps.
Programmable photonic ICs: making optical devices more versatile
Wim Bogaerts - Ghent University/imec
Most of today’s photonic ICs are designed for a specific purpose and targeted at a specific application, in that they resemble an electronic application-specific integrated circuit (ASIC). But with PIC technologies and design processes now starting to support larger-scale integration, this opens the door to more generic photonics ICs that can be reconfigured or programmed for diverse applications, resembling electronic FPGAs. Such circuits can implement programmable wavelength filters for WDM or microwave photonics, tunable delay lines, multi-format transceivers or optical information processors. In our talk, we will discuss the current state of this new field in PICs, and the future challenges and applications.
Coupling electronics and photonics – promising paths for device-makers to explore
Tan Yong Tsong - Institute of Microelectronics
Silicon photonics packaging is a crucial technology for the commercialisation of photonic integrated circuits (PICs) - especially with the drive towards small form-factor and lower cost modules. Comprehensive capabilities have been established in device libraries and associated tool boxes to enable the integration of electronic chips, low cost lateral optical fibre assembly and automated laser diode assembly. Further innovation in the areas of optical packaging, electronic-photonic integrated circuit (EPIC) full co-design will lead to a more integrated solution for enabling optimal performance and cost effectiveness. These developments will help to achieve the next milestones in Si-Photonics and contribute to addressing overall system requirements - boosting the deployment of products in the market.
Novel Heterogeneous Integrated Photonic Platforms on Silicon
Sasan Fathpour - CREOL, The College of Optics & Photonics
Silicon photonics owes its success to the versatile and high-quality silicon-on-insulator (SOI) wafers. However, the SOI technology has several limitations for some important applications, such as integrated nonlinear optics and mid-infrared photonics. We have been developing several novel heterogeneous integrated photonic platforms and has demonstrated various high-performance devices and circuits on them. Example heterogeneous platforms developed for the first time by our team at CREOL are lithium niobate on silicon, silicon on lithium niobate, silicon on nitride, and all-silicon membranes. The novel approaches, their fabrication methods, and performances of the fabricated devices and circuits will be presented and discussed.
Integrating photonic building blocks towards complete electro-optical computing
Yvain Thonnart - CEA-Leti
Efficient data transfer between IOs, memories and cores is a key element of high-performance computing. The trend for massively parallel architectures increases the communication needs, at the cost of increasing latency and power consumption. To overcome this, we are investigating the potential of optical communication on large silicon interposers, to stack and connect computing and memory chiplets together. In this talk, we present recent developments at CEA-Leti considering the architectural, design and fabrication aspects of optical interposers, from digital and high-speed analog elements, to the optical devices, in view of the power and thermal constraints. In addition, we share our insight on the integration of these building blocks in a complete electro-optical computing module.
III-V membrane lasers on silicon for datacom and computercom applications
Shinji Matsuo - NTT
Lasers on silicon substrate are expected to fabricate large-scale PICs with low cost because they can be heterogeneously integrated with low-cost Si photonics devices. In addition to the cost issue, reducing the power consumption of laser is quite important because it limits the integration density of PIC. For this purpose, we have developed membrane lasers on SiO2/Si substrate, in which large optical confinement factor enables us to enhance the modulation efficiency of directly modulated laser. We employ epitaxial regrowth to fabricate buried heterostructure on directly bonded III-V layers on SiO2/Si substrate, which allows us to employ large-scale Si substrate for fabricating lasers.
Delivering the goods: advances in PIC manufacturing
Silicon nitride based TriPleX PIC modules in a broad range of applications
Arne Leinse - LioniX
The silicon nitride based waveguide technology (TriPleX™) of LioniX International enables new applications due to its unique properties. The ultra-low loss over a broad wavelength range (from 405-2350 nm), the ability to create spot size converters, the integration of low power phase shifters and the hybrid integration with other platforms. Supplying PIC based modules instead of PICs only moved the mature PIC platform from technology push to market pull. Fully assembled plug and play modules lower the access barrier for the development of new applications and the hybrid combination with for instance InP enables unique functionalities. In this presentation application examples of PIC based modules will be described in more detail and an outlook will be given to future technology developments.
Vertical integration: bringing key elements together to match PICs to the market
Henk Bulthuis - Kaiam Corporation
At PIC International 2018, we'll be discussing planar lightwave circuits and free space coupling techniques, highlighting functions for various commercial transceiver configurations targeting data centre and telecoms applications.
Inline wafer-scale photonic testing to boost PIC manufacturing efficiency
Jessie Rosenberg - IBM
Meeting the challenge of producing PICs at high-volume
Jack Xu - Finisar
99% Alignment Cost Reduction through Novel Parallel Technology— An Enabler for SiP Production Economics
Scott Jordan - Physik Instrumente
We are confronted with many challenges for economical, repetitive manufacturing of Silicon Photonics devices. One universal challenge that has only recently been addressed is for fast, nanoscale alignment of optical fibers, micro-optical elements and active and passive photonic devices in multi-channel, arrayed formats. Since these needs begin with probing at the wafer level and recur through final packaging, the benefits of higher-throughput alignment are profound for cost and yield. Legacy alignment technologies are problematic for the multiple, interacting inputs and outputs commonly encountered in today’s SiP devices. With these older technologies, time-consuming, costly, repetitive alignment loops were required to achieve global alignment, leading to unacceptable production economics as quantities scale. These challenges have led to the broad adoption of a novel, parallel alignment technology with native multi-channel and multi-element simultaneous-optimization capabilities which we discuss in depth. It can perform global optimization across the inputs and outputs of complex photonic and optoelectronic devices, in multiple degrees of freedom, in one rapid step. Its high throughput addresses multiple emerging process pain-points from wafer test to packaging and chip test. This new alignment technology has by now been integrated into wafer probers and volume packaging and chip-test systems. It is facilitating testing and packaging operations with high throughput and yield. Throughput improvements have exceeded two orders of magnitude versus traditional approaches.
Silicon nitride for new PIC applications
Michael Geiselmann - LIGENTEC
Low loss waveguide technology based on stoichiometric silicon nitride together with low bending losses enabled through thick film nitride is opening the door to a variety of PIC applications. Such a platform can support the fabrication of complex designs at the smallest footprint, and is ideal for application areas from the visible to the mid-infrared, including high optical power scenarios. Markets include telecoms, quantum optics, bio-sensing and phase-array opportunities. Topics covered in the talk include examples of silicon nitride core technology, ranging from nonlinear integrated optics to linear low loss PIC operations.
CORNERSTONE: Silicon photonics fabrication capability based on DUV lithography
Graham Reed - CORNERSTONE
With the demand for silicon photonics on the rise, there is a clear need for flexible and affordable fabrication capabilities, suitable for device prototyping, using processing techniques that are compatible with the major industrial foundries. CORNERSTONE, headed up by Professor Graham Reed at the University of Southampton, offers such a capability via a multi-project-wafer (MPW) service, with up to 6 passive calls and 2 active calls per year on various silicon photonics platforms. In this talk, we outline our fabrication capabilities including our recently installed deep-UV Scanner, present our early data, and discuss upcoming MPW calls.
Photonics on Glass : The ioNext PIC Platform
Florent Gardillou - Teem Photonics
Teem Photonics ion-exchange technology (ioNext) on glass brings unique features for innovative photonic integrated circuits. ioNext enables a flexible 2.5D waveguide engineering (mode conversion, waveguide depth transition) while keeping a robust and collective photomasking-based approach. ioNext cicuits benefit from the intrinsic glass transparency to provide ultra low propagation loss from 400 to 2000 nm. Teem Photonics platform offers solutions from design to packaging, from prototyping to larger series manufacturing with a short turn around time. The talk will give an overview of the technology and its applications, from silicon chip-to-fiber interfacing to innovative sensors.
PIC Design, simulation and packaging: a blueprint for future success
From schematic to layout – overcoming today’s PIC design challenges
Christopher Cone - Mentor Graphics
Scalable design of integrated photonic and optoelectronic circuits
André Richter - VPIphotonics
Efficient and convenient solutions for electronic photonic design automation (EPDA) present fundamental prerequisites for the fast and innovative development of next generation integrated photonic and optoelectronic circuits. To highlight progress in this area, we will demonstrate how a layout-aware schematic-driven methodology enables the rapid prototyping of new design concepts, including parameter optimization of photonic and electronic parts, analysis of manufacturing tolerances, and comparison of technology and integration alternatives.
PIXAPP – Open Access Opportunities for Advanced PIC Packaging’
Peter O'Brien - Tyndall
PIC Design: From Concept to Manufacture
Robert Scarmozzino - Synopsys
The emerging photonic foundry industry needs flexible design tools in order to expand support for commercial applications. Designers need tools that work both out of and outside the box to creatively and inexpensively explore new applications before committing to costly prototyping. The Synopsys design flow meets this need through tightly integrated concept development at both the circuit and component levels. Design starts at the schematic level using foundry-specific or custom PDK components to create PICs, proceeds to system-level simulation, and ultimately concludes with automated layout for manufacture. Custom PDK components are automatically generated using the industry’s widest range of available simulation methods for passive and active photonic devices.
PIC horizons: new and emerging applications for integrated photonics
Low size, weight and power (SWaP) instruments for sensing applications - cutting edge PICs
Milan Mashanovitch - Freedom Photonics
Adding the ‘tech’ to biotech - opportunities for photonic integrated circuits
Sascha Geidel - Fraunhofer ENAS
Biochemical analytics and diagnostics are pushing forward into areas outside the laboratory and towards mobile and stand-alone field applications. Efficient diagnostic devices are easy to use, lightweight and provide reliable results. The focus of applied research is to validate the efficient selection of technologies and enable their smooth integration into small packages. Photonic integrated circuits have a key role to play in driving performance and contributing to a compact final device, and -- to highlight these elements -- this talk presents the transformation of a PIC into a biosensor. To allow automated biochemical process execution, the PIC is combined with a fluidic circuit. The system application targets explanatory exploration missions in terms of a wet chemical payload - for example, on board a Mars-rover. Nevertheless, the development procedure can also be transferred to other decentralized diagnostic applications on earth.
Lidar for Autonomous Driving: Key Technological Opportunities
Andrew Sparks - Analog Devices
Autonomous driving will be enabled by three types of sensors: radar, vision, and lidar (light detection and ranging). Lidar employs lasers, beam steering elements, and photodetectors, along with substantial electronic functions, to create 3D maps with angular resolution superior to radar and range resolution superior to cameras. Some analysts project lidar to grow to a US$80B market in 2035.
Forward-looking lidar systems are expected to see 200 m and operate uner challenging shock, vibration, and temperature conditions. Potential enabling technologies will be discussed, including Analog Devices’ liquid crystal electro-optic beam steering technology.