Monday 20th April 2026 starting at 11:00 CET

11:00 AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register 18:00 Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)

Tuesday 21st April 2026 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis - Conference Chairs Foundations of PIC design: materials, devices and processes 09:00 Scaling Co-packaged Optics Requires a Fundamental Rethink of Fibre-to-chip Interconnects Presented by Dominic Sulway - Light Trace Photonics 09:15 Advances in PIC Testing: Challenges and Measurement Needs from R&D to Volume Production Presented by Marc-Andre Laliberte - APEX Technologies 09:30 CMOS Compatible TFLN Technology Presented by Steven Tan - Rapid Photonics 09:45 Presentation by Ansys Presented by Shin-Sung Kim - Ansys, part of Synopsys 10:00 Photonics Chip Level Test Strategies Overcoming Vibration Challenges in High Volume Production Environments Presented by Name to be advised - Physik 10:15 Glass-Integrated PICs: Shaping the Future of Photonics Presented by Giacomo Corrielli - Ephos 10:30 Presentation by Luceda Presented by Name to be advised - Luceda Photonics 10:45 Morning Break and Networking 11:15 From Design to Silicon: Foundry Solutions for Next-Gen Photonics ICs Presented by Bowen Wang - Tower Semiconductor 11:30 LN-based PICs: Novel techniques for structuring and yield improvements with ion beam etching Presented by Robert Metzner - scia Systems GmbH 11:45 TFLN for CPO and Beyond Presented by Hiroyuki Takanashi - Shincron Co. Ltd 12:00 New Materials for Enabling High-performance Photonic Devices and Emerging Applications Presented by Leili Shiramin - imec 12:15 How Co Packaged Optics Is Transforming Optical Test & Measurement Presented by Matt Adams - VIAVI Solutions 12:30 Next-Generation Ultra-Low-Loss Integrated Photonics: From Mode-Locked Lasers to Traveling-Wave Amplifiers Presented by Tobias Kippenberg - Swiss Federal Institute of Technology (EPFL) 12:45 Lunch Break and Networking 14:15 Startup Elevator Presentations Connectivity and scalability for secure, high-speed data networks 14:25 PIC-enabled Quantum-safe Cryptography Presented by Francesco Raffaelli - KETS Quantum Security 14:40 Building Scalable, Energy-Efficient TFLN PICs Through Industrial-Grade Manufacturing Presented by Hernán Furci - CCRAFT 14:55 Beyond the Chip: System-Scale Simulations for Next-Gen PICs Presented by Andrzej Połatynski - VPIphotonics 15:10 Optics in AI Clusters: Innovation Mixed with Expediency Presented by Roy Rubenstein - LightCounting 15:25 Afternoon Break and Networking 15:55 Integrated Optics in the Age of AI Presented by Yannick De Koninck - NVIDIA 16:10 Integrated Photonics from Opportunity to Mass Production for 50G+ Access Networks Presented by Name to be advised - PICadvanced 16:25 Presentation by Nokia Presented by Mehrdad Ziari - Nokia 16:40 Presentation #2 by imec Presented by Yoojin Ban - imec 16:55 PANEL SESSION Novel Startups in Photonic Integrated Circuits — From Concept to Deployment KETS Quantum Security, InSpek, and Uviquity Moderated by Jon Pugh, Director of PIC and Quantum Technologies at OPTICA 17:25 Closing Remarks 18:00 Networking Drinks / Dinner Reception

Wednesday 22nd April 2026 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis - Conference Chairs Future computing: PICs for photonic processing, quantum computers, and neural networks 09:00 PIC for Photonic Quantum Computing Presented by Nicolas Maring - Quandela 09:15 System-Level Simulation: Towards Hardware–Software Co-Design for Photonics-Enabled AI Accelerators Presented by Sébastien d'Herbais de Thun - Hewlett Packard Enterprise 09:30 Beyond Electronics with TFLN Photonic Integrated Circuits for Next-Generation Computing Presented by Sep Mohajerani - Quantum Computing Inc 09:45 AIM Photonics / NY Creates PIC and Packaging Foundry for an End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging Presented by David Harame - AIM Photonics 10:00 Morning Break and Networking Foundations of PIC design: materials, devices and processes 10:30 Enabling THz Bandwidth on-chip with Plasmonic Modulators Presented by Stephan Koch - Polariton Technologies AG 10:45 Advancing Scalable Photonic Integration: Heterogeneous Integration of Active Components for Next-Generation Applications Presented by Michael Geiselmann - LIGENTEC 11:00 Aligned 2-Photon Grayscale Lithography for Free Space Microoptical Coupling in Photonic Packaging Presented by Stephan Dottermusch - Nanoscribe 11:15 How Photonic Intelligent Manufacturing Enables Artificial Intelligence at Scale Presented by Lorenzo Mandelli - ficonTEC 11:30 Scaling Integrated Photonics by Advancing Wafer Uniformity via Vacuum Technologies Presented by Daniel de Sá Pereira - Buhler Group 11:45 Enabling Scalable Silicon Photonics Manufacturing Through Laser-Based Trimming and Cleaning Presented by Louis-Rafael Robichaud - Femtum 12:00 Presentation by Cadence Presented by Name to be advised - Cadence 12:15 Lunch Break and Networking Connectivity and scalability for secure, high-speed data networks 13:30 Advancing Photonic Packaging and Integration Through UV Nanoimprint Lithography Presented by Thomas Achleitner - EV Group 13:45 Industry Ready Photonic Integration using Photonic Wire Bonds and Facet-Attached Micro-Lenses Presented by Name to be advised - Vanguard Automation 14:00 Designing for Yield: Production-Grade PDKs for Ultra-high-speed TFLN Photonic Engines. Presented by Amir Ghadimi - Lightium 14:15 Photonic Integrated Circuits and Co-packaged Optics for HPC and AI Data Centers Presented by Mika Takahashi - IDTechEx 14:30 Afternoon Break and Networking Emerging applications: photonics for sensing, imaging and beyond 15:00 From Fab to Solving Real‑World Challenges: Delivering 11 Real‑World Proof Points by 2029 Presented by Peter van Arkel - PhotonDelta 15:15 Enabling Foundry Ready BaTiO₃ Photonics: Advances and 300 mm Wafer Manufacturing Presented by Sabina Hatch - DCA Instruments 15:30 All Glass Atomic-photonic Chips for Quantum Sensing and Metrology Presented by Gianvito Lucivero - University of Bari/QSensAto 15:45 Presentation #2 by imec Presented by Yoojin Ban - imec 16:00 Multi-Wavelength Laser Sources for Scaling Datacenter Capacity Presented by Amol Delmade - Pilot Photonics 16:15 Aluminum Nitride Photonic Integrated Circuits for Extending Nonlinear Photonics Applications to UV Spectrum Presented by Scott Burroughs - Uviquity 16:30 Closing Remarks