Abstracts

Two days, 6 themes, over 30 inspiring presentations

Presentations at PIC International 2023 are grouped into 6 key themes which collectively provide complete coverage of the photonic integrated circuits industry.

If you are interested in speaking at PIC International 2023, please contact info@pic-international.net or call +44 (0)24 7671 8970.

2023 Speakers Include

Ansys
Bright Photonics
Cisco
Eindhoven University of Technology
ficonTEC
Hewlett Packard Enterprise
IBM
LIGENTEC
Luceda Photonics
Lumiphase
Nanoscribe
PHIX
Physik Instrumente
Quintessent
SilOrix
Synopsys
SÜSS MicroOptics
Vanguard Automation
Voyant Photonics
VPI Photonics
VTT

2023 Presentation Abstracts

Hybrid PICs

Heterogeneous photonic integration of InP on silicon

Presented by Martijn Heck, Professor at Eindhoven University of Technology, Scientific Director Eindhoven Hendrik Casimir Institute, Eindhoven University of Technology

Now photonic integrated circuits are maturing and being commercially implemented, the bottleneck for further scaling in performance and production becomes clear. While InP PICs have supperior performance in terms of component bandwidth and availability of efficient native-substrate sources, their manufacturability is limited by dedicated fabrication flows. Silicon photonics, on the other hand, lacks native sources and had limited-efficiency modulators, but benefits from a mature fabrication and assembly infrastructure. Further scaling of PICs will require a form of heterogeneous integration of InP on silicon. I will discuss the various techniques.

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Presented by Name to be advised, TBA, Vanguard Automation

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Presented by Jörg Smolenski, Business Development Manager, Nanoscribe

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Presented by Ronald Broeke, General Manager, Bright Photonics

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Realising laser integration on a monolithic silicon photonic platform

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Scaling PICs in volume using foundries

Low loss PICs: From fast prototyping to high volumes

Presented by Michael Geiselmann, President & CCO, LIGENTEC

Propagation losses in PICs are very important to have energy efficient on chip routing and are especially crucial if already very few photons are there to start with. In this talk we will give an overview of LIGENTEC’s low loss PICs based on silicon nitride and application areas in telecom/datacom, LiDAR, Quantum and sensing. Reliability and uniformity are of critical importance and are addressed with statistical process control in our 100mm and 200mm wafer fabrication.

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Presented by Jeroen Duis, Chief Commercial Officer, PHIX

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Optimising PICs for optical wireless opportunities

Producing an integrated silicon photonics transceiver for 100Gbit/s transmission over 20km

Presented by Matt Traverso, Engineer, Cisco

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Driving deployment in established markets

Accelerating high-speed electro-optical interconnects utilizing Silicon-organic electro-optic modulators

Presented by Adrian Mertens, CEO and Co-Founder, SilOrix

The development of faster ethernet transceivers with data rates of 800 Gbit/s and beyond has become one of the major challenges in order to cope with the continuously growing global data sphere. By combining established silicon photonics with tailor-made, high-efficient organic materials in the so called “Silicon-Organic-Hybrid” (SOH) approach, electro-optic modulators with single lane-speeds above 130 GBd and sub-volt drive-voltages have been realized. Utilizing novel material concepts, SOH-devices do not only exhibit an unmatched performance, but also feature long-term stability, rendering this technology perfectly suited for next generation ethernet transceivers.

 
PIC Vision: Revolution and evolution

Energy-efficient integrated photonics for next-generation computing

Presented by Bassem Tossoun, Research Scientist, Hewlett Packard Enterprise

New machine learning algorithms such as deep neural networks and the availability of large datasets have created a large drive towards new types of hardware capable of executing these algorithms with higher energy-efficiency. Recently, silicon photonics has emerged as a promising hardware platform for neuromorphic computing due to its inherent capability to process linear and non-linear operations and transmit a high bandwidth of data in parallel. At Hewlett Packard Labs, an energy-efficient dense-wavelength division multiplexing (DWDM) silicon photonics platform has been developed as the underlying foundation for innovative neuromorphic computing architectures. The latest research on our silicon photonic neuromorphic platform will be presented and discussed.

Integrated optics for neuromorphic computing

Presented by Bert Offrein, Principal Research Staff Member, IBM

Awaiting presentation abstract.

Next generation communication chips made from Pockels-enhanced PICs

Presented by Stefan Abel, Co-Founder and Co-CEO, Lumiphase

Controlling light with electrical signals is a critical function in photonic integrated circuits for optical communication, sensors, and switches. Lumiphase develops and manufactures photonic chips based on a unique BTO Pockels technology. The superior materials performances translate into electro-optical modulation functionalities with benefits in cost, speed, transparency, power-consumption, and footprint compared to standard silicon solutions. The Pockels-enhanced chips enable next-generation transceivers, both for coherent as well as direct-detect data transmission schemes, as well as for a wide range of photonic applications ranging such as sensing, data processing, or switching, where large numbers of ultra-efficient, integrated phase shifters are needed.

Quantum Dot Lasers on Silicon for Highly Parallel Data Transmission

Presented by Michael Davenport, Photonics Design Lead, Quintessent

Quantum dot lasers offer a variety of useful characteristics as light sources in integrated highly parallel data transmission links. These properties include low threshold, high efficiency, resilience to unintentional optical feedback, high reliability, and broad wavelength spectral emission. The combination of these lasers with sophisticated silicon photonics components presents a variety of circuit architectures for highly compact, high bandwidth, and highly efficient photonic transmitters with low power consumption which are fabricated in a low cost and high volume commercial foundry. This presentation will provide an overview of the laser and circuit designs enabled by this platform.

 
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Presented by Name to be advised, TBA, Ansys

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Presented by Name to be advised, TBA, ficonTEC

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Presented by Martin Fiers, Co-founder and product manager, Luceda Photonics

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Presented by Name to be advised, TBA, Physik Instrumente

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Presented by Name to be advised, TBA, Synopsys

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Presented by Name to be advised, TBA, VPI Photonics

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Presented by Name to be advised, TBA, VTT

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The Needs of Automotive and LiDAR for PICs

Presented by Bill Ring, VP of Light Source Development, Voyant Photonics

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Presented by Name to be advised, SÜSS MicroOptics

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