Industrialisation and Global Scaling of PIC Manufacturing
How can PIC manufacturing transition from innovation-led development to high-volume, globally competitive production?
Heterogenous Integration: From Idea to Volume
To meet the demands of next-generation optical networks, this presentation introduces LIGENTEC’s advanced heterogeneous PIC platform. We demonstrate the integration of TFLN for ultra-high-speed (>120GHz), low-voltage modulation alongside high-speed photodetectors (PD) directly onto our low-loss (dB/m) silicon nitride (SiN) waveguide core. The low-loss platform enables tunable lasers, comb lasers and excellent optical interconnect between fibers and PICs. By transitioning this complex heterogeneous process to a high-volume automotive-qualified foundry, LIGENTEC bridges the gap between high-performance prototypes and cost-effective industrial scaling for optical sensing, communication, and computing markets.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
Scaling photonic interconnects for next-generation cloud infrastructure
This session will explore how photonic interconnect technology can be engineered to meet the escalating bandwidth and efficiency demands of next-generation cloud infrastructure. It will consider the manufacturing and integration challenges involved in moving from prototype to volume production, and what this means for data centre architectures at scale.