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PIC International
12-14 April 2027Brussels, Belgium
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12-14 April 2027 / Brussels, Belgium

2027 Abstracts

PIC International 2027 Presentation Abstracts

Detailed abstracts for every 2027 presentation, grouped by theme. Click a speaker to see their full bio.

Industrialisation and Global Scaling of PIC Manufacturing

How can PIC manufacturing transition from innovation-led development to high-volume, globally competitive production?

  1. Heterogenous Integration: From Idea to Volume

    To meet the demands of next-generation optical networks, this presentation introduces LIGENTEC’s advanced heterogeneous PIC platform. We demonstrate the integration of TFLN for ultra-high-speed (>120GHz), low-voltage modulation alongside high-speed photodetectors (PD) directly onto our low-loss (dB/m) silicon nitride (SiN) waveguide core. The low-loss platform enables tunable lasers, comb lasers and excellent optical interconnect between fibers and PICs. By transitioning this complex heterogeneous process to a high-volume automotive-qualified foundry, LIGENTEC bridges the gap between high-performance prototypes and cost-effective industrial scaling for optical sensing, communication, and computing markets.

  2. To Be Confirmed

    Abstract for this presentation is being finalised.

  3. To Be Confirmed

    Abstract for this presentation is being finalised.

  4. To Be Confirmed

    Abstract for this presentation is being finalised.

  5. To Be Confirmed

    Abstract for this presentation is being finalised.

  6. To Be Confirmed

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  7. To Be Confirmed

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  8. To Be Confirmed

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  9. To Be Confirmed

    Abstract for this presentation is being finalised.

Bridging the Gap Between Innovation and Adoption

What is preventing PIC technologies from moving from technical innovation to widespread commercial deployment?

  1. To Be Confirmed

    Abstract for this presentation is being finalised.

  2. To Be Confirmed

    Abstract for this presentation is being finalised.

  3. To Be Confirmed

    Abstract for this presentation is being finalised.

PICs as an Enabling Platform Across Industries

How can PICs deliver measurable system-level value across diverse industries and become a foundational technology?

  1. To Be Confirmed

    Abstract for this presentation is being finalised.

  2. To Be Confirmed

    Abstract for this presentation is being finalised.

Evolution of the PIC Value Chain and Manufacturing Ecosystem

How must the PIC value chain evolve to support scalable manufacturing, stronger partnerships and global market growth?

  1. To Be Confirmed

    Abstract for this presentation is being finalised.

  2. To Be Confirmed

    Abstract for this presentation is being finalised.

Defining Standards, Reliability, and Commercial Readiness

What standards, qualification methods and reliability benchmarks are needed to accelerate trusted PIC deployment at scale?

  1. To Be Confirmed

    Abstract for this presentation is being finalised.

  2. To Be Confirmed

    Abstract for this presentation is being finalised.

  3. Closing the PIC testing bottleneck: from wafer to commercial scale

    Optical testing remains one of the largest cost and time bottlenecks in PIC manufacturing, with tighter tolerances than electrical testing making it disproportionately expensive at scale. This session will explore how automated, repeatable wafer-level testing methods can support the qualification standards and reliability benchmarks needed to move PICs from lab to trusted commercial deployment.

  4. To Be Confirmed

    Abstract for this presentation is being finalised.