Presentations at PIC International 2026 are grouped into 4 key themes which collectively provide complete coverage of the compound semiconductor industry.
If you are interested in speaking at PIC International 2026, please contact info@picinternational.net or call +44 (0)24 7671 8970.
Packaging remains a critical bottleneck in PIC commercialisation. This presentation explores automated assembly solutions enabling sub-micron alignment, repeatable coupling efficiency and scalable production. Attendees will discover how advanced micro-assembly and integration platforms improve throughput, reduce costs and unlock reliable volume manufacturing of complex photonic integrated circuits.
Design complexity remains a major challenge in photonics integration. This presentation explores how advanced PIC design automation empowers designers to accelerate development cycles, improve layout accuracy and ensure fabrication readiness. Attendees will learn how streamlined design workflows reduce risk and support commercial scalability across diverse photonic applications.
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Glass is the material powering the next generation of photonic integrated circuits. Advanced glass processing lets us create complex 3D PICs with record-low losses, full 3D design flexibility, and new possibilities for advanced packaging. This talk will highlight the technology, the breakthroughs it enables, and how Ephos transforms these innovations into practical, real-world photonic solutions.
The adoption of co-packaged optics using silicon integrated photonic circuits has created a new paradigm of automated solutions for wafer and chip level test and assembly at scale. The addition of photonics probe to conventional electrical test, comes with a variety of challenges for coupling strategies that address sub-micron spatial tolerances that enable consistent, repeatable, and stable coupling in high-vibration production environments. Here we present on direct fiber array to fiber array-based measurements and analysis to understand the impact of vibration sources on photonics alignment automation systems and mitigation strategies to prevent insertion loss from direct and indirect disturbances. Our findings demonstrate how to enhance efficiency and enable large-scale implementation in photonic device manufacturing. This work integrates precision automation with photonic testing and probing, bridging the gap between research and scalable, high-volume production.
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As photonic integration grows in complexity, simulation accuracy becomes critical. This presentation explores how multi-physics simulation enables precise modelling of optical, thermal and electrical interactions within PICs. Attendees will learn how design optimisation and virtual prototyping reduce development cycles, improve device performance and support reliable scaling of next-generation photonic platforms.
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As PICs grow in size and complexity, their performance must be evaluated not only as isolated components but also within the full system. This presentation highlights how system-level validation can help to overcome impairments and architectural bottlenecks, enabling more reliable, scalable, and efficient PIC designs for next-generation high-speed data networks.
Next-generation data networks require PICs that combine speed, energy efficiency and scalable manufacturability. This presentation shows how advances in thin-film lithium niobate processes are moving TFLN PIC manufacturing toward greater reliability and reproducibility. We illustrate how design choices gain real impact only when supported by stable, scalable fabrication delivering low-power, high-density interconnects.
As network security and bandwidth demands intensify, integrated photonics plays a pivotal role in delivering robust solutions. This presentation explores how Lightium’s photonic integration strategies enable secure, high-speed data transmission with improved stability and efficiency. Attendees will gain insight into scalable architectures supporting next-generation optical communication networks.
PICadvanced accelerates the evolution of high-speed access networks through photonics, connecting the opportunity with R&D innovation stack and scalable production. This presentation showcases cost-efficient 50G and beyond optoelectronic platforms, merging optics and electronics for next-gen fiber access. Attendees will see how the full-stack integration and manufacturing support enable faster, more reliable, and future-proof network upgrades.
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Aluminum nitride (AlN) has emerged as a promising photonic material mainly due to its broad transparency window and remarkable nonlinear optical properties. Recently, we have developed low-loss photonic integrated circuits (PICs) based on an AlN-on-sapphire platform that enables various on-chip nonlinear photonic processes such as second harmonic generation (SHG), frequency conversion, and electro-optic modulation which are scalable from the infrared to the visible/ultraviolet (UV) part of the spectrum. As an eminent example, this work will discuss our recent progress on solid-state far-UVC emitters based on our AlN PICs via SHG. With further heterogeneous integration of GaN pump lasers, our AlN PICs can offer tremendous reduction in cost, size, weight, and power (C-SWaP), which shows great potential for numerous applications ranging from human-safe germicidal disinfection and water purification to spectroscopy, frequency metrology, and quantum computing and sensing.
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This presentation demonstrates how advanced PIC platforms enable breakthroughs in sensing and biomedical diagnostics. IMEC will highlight innovations in integrated spectrometry, bio-photonics and environmental monitoring, outlining how scalable photonic integration is transforming compact, high-sensitivity sensing solutions across healthcare, automotive and environmental applications.
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IMEC presents its vision for integrating photonics into next-generation computing architectures. This talk explores silicon photonics platforms enabling optical computing, AI acceleration and neuromorphic architectures. Attendees will gain insight into device innovations, scalable fabrication approaches and system-level integration strategies shaping future photonic computing ecosystems.
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