What we do and a brief company history

ficonTEC is an innovative high-tech company that has rapidly established itself in a highly-specialized market. With continued growth and innovative development since 2001, we are the recognized market leader when it comes to automated assembly and testing of opto-electronic components and (hybrid) photonic devices.

The core team at ficonTEC consists primarily of development engineers from the specialist fields of optics and photonics, from electrical, mechanical and mechatronic engineering, as well as from software development. These developers are supported by experienced technicians possessing a wide variety of skills.

Our technical competence, global customer base, and – importantly – the will to understand our customer’s needs and to find individual and optimum solutions, together make us a competent business and development partner.

LIGENTEC is a B2B company manufacturing Photonic Integrated Circuits (PIC) for customers in high-tech areas such as communication on ground and space, Quantum technologies, LiDAR and Biosensors. LIGENTEC commercialises the all-nitride-core technology. With the all-nitride-core technology LIGENTEC enables the customers to develop their products in the industrial revolution 4.0.

At Luceda Photonics, we enable photonic IC designers to enjoy the same power as electronic IC designers.

We automate and integrate the complete photonic design flow. Our Python-based platform enables design teams to easily share and reuse their photonic design IP using a standard language.

We leverage more than 50 years of photonic experience to help our customers create manufacturable designs. Our design products bundle our expertise to enable our customers to quickly achieve their first tape-out and get their design right the first time.

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge, or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.

As the pioneer and market leader in high-precision additive manufacturing, we are your reliable partner for microfabrication systems, software, and solutions. Our 3D Microfabrication technology with high-precision alignment capabilities is driving photonic packaging by auto-aligned printing freeform microoptics directly onto optical fibers or photonic chips. Founded in 2007 as a spin-off of the Karlsruhe Institute of Technology (KIT), we are a vibrant, award-winning company and part of the BICO Group since June 2021. With our field-proven systems, straightforward 3D printing workflows and all-in-one solutions, our more than 3,000 system users are driving future-shaping applications that are published in over 1,300 peer-reviewed journals. 

PI (Physik Instrumente), headquartered in Karlsruhe, is the market and technology leader for high-precision motion and positioning technology and piezo applications in the semiconductor industry, life sciences, photonics, and in industrial automation. In close cooperation with customers from all over the world and for more than 50 years now, PI's specialists (approx. 1,400) have been pushing, again and again, the boundaries of what is technically possible and developing customized solutions from scratch. More than 400 granted and pending patents underline the company's claim to innovation. PI has nine production sites and 15 sales and service offices in Europe, North America, and Asia.

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. We are accelerating the adoption of photonic IC technologies with industry's first unified platform, which includes the OptoCompiler™ electro-optical IC design solution, the OptSim™ signal level simulation solution, and Photonic Device Compiler for photonic device design and PDK development. With this seamless and unified design platform Synopsys supports IC designers and photonic engineers to develop and manufacture photonic ICs and systems for consumer, health, and industrial applications. We have 35 years of leadership in electronic design automation, combined with a legacy of photonics innovations for 25+ years. Learn more at https://www.synopsys.com/photonic-solutions.html.

VPIphotonics provides professional design software and services for integrated photonics, optoeletronics and fiber-based components, optical transmission systems and networks. VPIphotonics off-the-shelf and customized solutions are valued for their powerful and comprehensive simulation capabilities and high degree of flexibility. They are applied in research and development, product design and marketing by hundreds of companies, and for teaching and research at over 160 academic institutions worldwide.

Vanguard Automation (VA) combines a decade of research in integrated photonics with 20 years of experience in building high-precision assembly machinery to propel photonic integration and packaging. Headquartered in Karlsruhe, Germany, VA develops process technology and machines for creating low-loss photonic connections between passive and active optical components leveraging its unique IP portfolio for Photonic Wire Bonding and facet-attached micro-optics. Augmenting nano-print technology, VA’s solutions enable high packaging density, increased design flexibility and fabrication throughput.

With the exponential rise of PICs, VA serves a growing global customer base helping to solve next generation photonic integration and packaging challenges.

SMART Photonics is a pure play foundry offering production services for InP based photonic components. We use our extensive knowledge of both discrete as well as integrated photonics and our many years’ experience to produce, with our dedicated toolset, the photonic components designed by our customers. We offer the full production process from Epitaxial growth, re-growth and processing up to the thinning and dicing of the wafers. Contact: e-mail: info@smartphotonics.nl tel. +31(0)40 247 54 53

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design™ strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com

EPIC is the industry association that promotes the sustainable development of organisations working in the field of photonics in Europe. We foster a vibrant photonics ecosystem by maintaining a strong network and acting as a catalyst and facilitator for technological and commercial advancement. EPIC publishes market and technology reports, organizes technical workshops and B2B roundtables, coordinates EU funding proposals, advocacy and lobbying, education and training activities, standards and roadmaps and pavilions at exhibitions.

Fraunhofer HHI does research on communications since nearly 90 years. Nowadays, about every second bit transported in the internet touches HHI technology on its way to the receiver. With a strong focus on InP, we also develop polymer waveguide based hybrid integration and silicon photonics. We focus on Telecom and Datacom, with strongly increasing activities in sensor systems. HHI offers foundry services with or without design support in InP, and custom designed Polymer Hybrid PICs.

SUSS MicroOptics produces high-quality refractive and diffractive micro-optics for fiber coupling, collimation and beam homogenizing based on extensive experience in optical design, engineering, wafer-level manufacturing, metrology and packaging. SUSS MicroOptics is automotive qualified and key supplier for innovative photonic solutions in telecom, datacom, life science, laser, semiconductor equipment and automotive lighting.

Axetris is a leading manufacturer of customized micro-optics and diffractive optical elements used in high-speed data/telecom transceivers/switches, 3D sensing and Lidar, both in discrete and integrated photonics approaches. We also offer wafer-level micro-fabrication and MEMS processes, which allow to add features for assembly and integration or as post-processing on customer CMOS wafers. We will support you with highest quality from prototypes to high volumes out of our own fab in Switzerland.

Brolis Sensor Technology develops unique GaSb/Si based spectroscopic sensor technology for a large variety of real-time sensing applications for industrial, biochemical, biomedical, agriculture and consumer applications. We develop both final sensor solutions as well as OEM spectrometers on chip. Our products feature in-house made all-semiconductor tunable laser technology based spectroscopic platform on-chip with a footprint of < 1 mm^2 for 1800-2500 nm spectral band. Our technology includes laser sources, photodetectors and photonic integrated circuit technology.

Based in France, SET is a world leading supplier of Flip-Chip Bonders excelling in high-end, demanding applications.

Since 1975, we have accompanied laboratories and industries, which look for a high precision and an important reliability in the assembly of their components. We accelerate their developments of the chips of future thanks to our robust and precise Flip-Chip Bonders.

With Flip-Chip Bonders installed worldwide, we are globally renowned for the high post-bond sub-micron accuracy and the high flexibility of our equipment.

Ranging from manual loading version to fully automated version, our systems cover a wide range of applications and offer the unique ability to handle both fragile and small components onto substrates and wafers up to 300 mm.