PRESENTATION

SiN goes thick enabling PIC applications

Silicon nitride photonic integrated circuits offer new possibilities for existing and emerging applications. Application such as Beamforming, Communication, Quantum, Microwave Photonics and Bio-sensing benefit from a transparency window from the visible to the Mid-Infrared, the ultra-low losses in those wavelength ranges and good power handling of cw and pulsed laser. LIGENTEC's fabrication process is based on the all-nitride-core technology and designed from the bottom up for photonics and modularity. In the all-nitride-core, most of the optical mode energy is in the waveguide material, which reduces loss and makes small bending radii possible. Latest developments on further integration of active elements and modules are presented.