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Presentations at PIC International 2024 are grouped into 7 key themes which collectively provide complete coverage of the global photonics industry.
Hybrid PICs combine different material platforms, such as silicon and III-V semiconductors, to enable integration of diverse functionalities. They offer advantages in terms of performance, flexibility, and compatibility, expanding the capabilities of integrated photonics for various applications.
Packaging PICs involves the assembly and encapsulation of the PIC devices for integration into larger systems. Packaging ensures protection, reliability, and efficient coupling of light in and out of the PICs, facilitating their integration into practical applications such as communication networks and sensing systems.
Quantum photonic integrated circuits (QPICs) combine quantum optics and integrated photonics on a chip to control quantum properties of light. They offer potential applications in quantum communication and computing, but challenges in scalability and noise must be addressed for practical implementation.
Scaling PICs in volume can be achieved by leveraging foundries, which offer standardized and high-volume manufacturing processes. Foundries provide economies of scale, cost-effectiveness, and access to advanced fabrication technologies, enabling mass production of PICs and fostering their integration into various industries, including telecommunications and data centers.
The deployment of PICs in established markets, such as telecommunications and data centers, offers significant benefits. PICs enable higher data rates, improved energy efficiency, and compact form factors, resulting in enhanced performance, cost savings, and increased capacity in existing infrastructure. This drives the adoption and integration of PIC technology in these markets.
The size of photonic integrated circuits (PICs) plays a crucial role in their practical implementation. By leveraging advanced simulation techniques, designers can optimize the size of PICs, ensuring efficient use of space while maintaining desired functionality. Simulation tools enable accurate modeling, analysis, and refinement of PIC designs, ultimately enhancing design efficiency and performance.
Power consumption PICs can be reduced through strategies such as efficient component design, advanced materials, on-chip integration, energy-efficient modulation schemes, power management techniques, and system-level optimization, enabling their integration into power-sensitive applications.