Two days, 7 themes, over 30 inspiring presentations

Presentations at PIC International 2024 are grouped into 7 key themes which collectively provide complete coverage of the global photonics industry.

If you are interested in speaking at PIC International 2024, please contact or call +44 (0)2476 718 970.

Hybrid PICs: Pioneering New Frontiers in Photonic Integration

Hybrid PICs combine different material platforms, such as silicon and III-V semiconductors, to enable integration of diverse functionalities. They offer advantages in terms of performance, flexibility, and compatibility, expanding the capabilities of integrated photonics for various applications.

PIC Packaging: Securing Optimal Integration and Performance

Packaging PICs involves the assembly and encapsulation of the PIC devices for integration into larger systems. Packaging ensures protection, reliability, and efficient coupling of light in and out of the PICs, facilitating their integration into practical applications such as communication networks and sensing systems.

Quantum Era: Unleashing PICs' Boundless Potential

Quantum photonic integrated circuits (QPICs) combine quantum optics and integrated photonics on a chip to control quantum properties of light. They offer potential applications in quantum communication and computing, but challenges in scalability and noise must be addressed for practical implementation.

Rapid Scaling: Foundries Fueling PICs' Mass Production

Scaling PICs in volume can be achieved by leveraging foundries, which offer standardized and high-volume manufacturing processes. Foundries provide economies of scale, cost-effectiveness, and access to advanced fabrication technologies, enabling mass production of PICs and fostering their integration into various industries, including telecommunications and data centers.

Accelerating PIC Adoption in Established Markets

The deployment of PICs in established markets, such as telecommunications and data centers, offers significant benefits. PICs enable higher data rates, improved energy efficiency, and compact form factors, resulting in enhanced performance, cost savings, and increased capacity in existing infrastructure. This drives the adoption and integration of PIC technology in these markets.

PIC Size and Simulation: Enhancing Design Efficiency

The size of photonic integrated circuits (PICs) plays a crucial role in their practical implementation. By leveraging advanced simulation techniques, designers can optimize the size of PICs, ensuring efficient use of space while maintaining desired functionality. Simulation tools enable accurate modeling, analysis, and refinement of PIC designs, ultimately enhancing design efficiency and performance.

Power Efficiency: Minimizing Consumption in PICs

Power consumption PICs can be reduced through strategies such as efficient component design, advanced materials, on-chip integration, energy-efficient modulation schemes, power management techniques, and system-level optimization, enabling their integration into power-sensitive applications.