Monday 17th April 2023 starting at 18:30 CET

18:30 Pre-conference networking drinks reception sponsored by EPIC

Tuesday 18th April 2023 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis, Conference Chairs Hybrid PICs - Sponsored by Vanguard Automation 09:00 Heterogeneous photonic integration of InP on silicon Presented by Martijn Heck - Eindhoven University of Technology 09:15 Advancements of 3D printed opto-mechanical structures for optical coupling using Two-Photon Polymerization Presented by Jörg Smolenski - Nanoscribe 09:30 Tricks to mix PICs: How to realize hybrid Photonic IC design Presented by Ronald Broeke - Bright Photonics 09:45 Enabling next Generation Photonic Integration and Packaging Solutions with Photonic Wire Bonding and Facet-Attached Micro-Lenses Presented by Sebastian Skacel - Vanguard Automation 10:00 Hybrid integration and fiber-pigtailing for 3 µm SOI PICs Presented by Timo Aalto - VTT 10:15 Morning Break - Sponsored by Lightwave Logic Inc. 10:45 High-volume scalability in cavity enhanced MEMS-PIC inertial sensors Presented by Lia Li - Zero Point Motion (in collaboration with CORNERSTONE/Uni of Southampton) 11:00 Photonic IC Modules Outside the Telecom Window Presented by Arne Leinse - LioniX International Chip-scale packaging 11:15 Micro-optics for PICs…with Advanced Optomechanical Features Presented by Wilfried Noell - SUSS MicroOptics SA 11:30 Scaling 3D laser lithography-based packaging of hybrid multi-chip assemblies from prototyping to volume production Presented by Thorsten Mayer - Vanguard Automation 11:45 Novel fiber array alignment with core-based positioning control Presented by Simone Cardarelli - MicroAlign 12:00 High yield & throughput in optical assembly by self-adaptive production Presented by Colin Dankwart - ficonTEC 12:15 Lunch Break - Sponsored by Lightwave Logic Inc. PIC Vision: Revolution and evolution - Sponsored by OPTICA 13:30 Technology & industrial leadership in PICs for Europe: Collective approach Presented by Dr. Nilufar Bulut - PhotonDelta 13:45 Accelerating the path to integrated photonics-based quantum computers via EPDA Presented by Ahsan Alam - Ansys 14:00 Energy-efficient integrated photonics for next-generation computing Presented by Thomas Van Vaerenbergh - Hewlett Packard Enterprise 14:15 Photonic neuromorphic computing, prospects and requirements (Video presentation) Presented by Bert Offrein - IBM 14:30 Next generation communication chips made from Pockels-enhanced PICs Presented by Stefan Abel - Lumiphase 14:45 Afternoon Break - Sponsored by Lightwave Logic Inc. 15:15 Quantum Dot Lasers on Silicon for Highly Parallel Data Transmission Presented by Michael Davenport - Quintessent 15:30 Quantum computing, a strategic technology enabled by photonics Presented by Amin Abbasi - imec 15:45 Plasmonic PICs: Believe in Your Silicon Photonics Platform But Never Stop Improving Presented by Claudia Hössbacher - Polariton Technologies AG Optimising PICs for optical wireless opportunities 16:00 Producing an integrated silicon photonics transceiver for 100Gbit/s transmission over 20km Presented by Peter De Dobbelaere - Cisco 16:15 The Needs of Automotive and LiDAR for PICs Presented by Bill Ring - Voyant Photonics 16:30 Photonic integrated circuits for solid-state LiDAR Presented by Marcus Dahlem - imec 16:45 Closing Remarks 16:50 Networking Drinks / Dinner Reception - Sponsored by Lightwave Logic Inc.

Wednesday 19th April 2023 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis, Conference Chairs Scaling PICs in volume using foundries 09:00 Perspectives on silicon photonics foundry: a new era Presented by Anthony Yu - GlobalFoundries 09:15 Low loss PICs: From fast prototyping to high volumes Presented by Michael Geiselmann - LIGENTEC 09:30 Positioning electro-optic polymer modulators as an optical engine to extend data rate and low power performance for optical networking Presented by Michael Lebby - Lightwave Logic Inc 09:45 Doing More with Less as a Photonics Manufacturing Strategy Presented by Scott Jordan - Physik Instrumente 10:00 Flexibility and shorter changeover times in packaging Presented by Niels Jansen - Etteplan 10:15 Integrated Photonic Packaging from prototype to production scale up Presented by Jeroen Duis - PHIX 10:30 Morning Break - Sponsored by Lightwave Logic Inc. 11:00 Accelerating time-to-market through functional verification of PICs Presented by Martin Fiers - Luceda Photonics 11:15 Nanoimprint Lithography (NIL) – How to apply for PIC manufacturing and packaging? Presented by Bernd Dielacher - EV Group 11:30 Application-specific PIC design – Acceleration and adaptation to custom processes Presented by Andrzej Połatyński - VPIphotonics 11:45 Silicon Photonics Process Technologies Considerations for High Volume and Flexibility Presented by Bowen Wang - Tower Semiconductor 12:00 Supporting Si Photonics versatility through application specific PDKs Presented by Franck Ernult - Advanced Micro Foundry 12:15 Faster Development and Higher Production Output by Smart PIC Assembly and Test Automation Presented by Kurt Hensen - Averna 12:30 PANEL SESSION State-of-the-art and future of Hybrid Silicon Photonic Foundries GlobalFoundries, Tower Semiconductor, and VTT Moderated by Jose Pozo 13:00 Lunch Break - Sponsored by Lightwave Logic Inc. Driving deployment in established markets 14:00 PIC testing optimization as a crucial step for PIC technology deployment Presented by Daria Lavrova - Keysight Technologies 14:15 Integrated Photonics in Precision Farming Presented by Carol de Vries - PhotonDelta 14:30 Design of 3D heterogenous chips and systems for optical datacom and I/O Presented by Twan Korthorst - Synopsys 14:45 Can PICs fit into access networks? Presented by António Teixeira - PICadvanced 15:00 Afternoon Break - Sponsored by Lightwave Logic Inc. 15:30 Advancements in Optical Engines Based on Monolithically Integrated InP Photonic Chips Presented by Mehrdad Ziari - Infinera 15:45 Accelerating high-speed electro-optical interconnects utilizing Silicon-organic electro-optic modulators Presented by Adrian Mertens - SilOrix 16:00 Optical Interconnects for Advanced Packaging Glass Substrates Presented by Andreas Matiss - Corning 16:15 Market and technologies trends for PICs Presented by Eric Mounier - Yole Group 16:30 Closing Remarks