PIC International 2021 Agenda

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Tuesday 17th November 2020 starting at 08:00 GMT (09:00 BST / 10:00 CEST)
08:00 Registration and welcome refreshments.
08:50 Housekeeping by Michael Lebby and David Cheskis
PICs Today − Datacom, Sensing & LiDAR
09:00 PANEL SESSION
PICs for LIDAR
ommatidia lidar, EPIC, Ibeo Automotive Systems GmbH, Freedom Photonics, and Rockley Photonics
09:30 Sensors and Systems for Next Generation 3D Imaging & LiDAR Applications
Presented by Wade Appelman - ON Semiconductor
09:45 Silicon Photonics, beyond the tipping point!
Presented by Eric Mounier - Yole Développement
10:00 Presentation Title to be Confirmed
10:15 Novel electro-optical substrate enabling cost effective PIC assembly solutions for sensor and communication applications
Presented by Felix Betschon - Vario-optics
10:30 PICs for data-center interconnects
Presented by Benjamin Wohlfeil - ADVA Optical Networking
10:45 Integrated 4D Machine Vision
Presented by Mehdi Asghari - SiLC
11:00 Morning Break - Sponsored by Hewlett Packard Enterprise
11:30 Hybrid Photonic Integration for Sensing and Communications
Presented by Martin Schell - Fraunhofer HHI
11:45 Automotive, LiDAR & MedTech – Providing access & experiences gained
Presented by Ignazio Piacentini - ficonTEC
12:00 From Prototypes to Production: Compact packaging of miniaturized light sources
Presented by Ruth Houbertz - Multiphoton Optics
12:15 Silicon Photonics for automotive LIDAR applications
Presented by Robert Blum - Intel
12:30 An overview of a variety of cutting edge PICs for sensing applications
Presented by Paul Leisher - Freedom Photonics
12:45 Lunch Break - Sponsored by Hewlett Packard Enterprise
14:00 Plasmonics in CMOS foundries: a new toolkit for PICs
Presented by Nikos Pleros - Aristotle University of Thessaloniki
14:15 Presentation Title to be Confirmed - Synopsys
Presented by Twan Korthorst - Synopsys
PIC Manufacturing − TAP, Co-Packaging & Fab
14:30 Si-Based Photonic platform at CEA – Leti
Presented by Sergio Nicoletti - CEA-Leti
14:45 SiN goes thick enabling PIC applications
Presented by Michael Geiselmann - LIGENTEC
15:00 Silicon nitride based TriPleX™ modules with hybrid PIC integration
Presented by Arne Leinse - LioniX International
15:15 CORNERSTONE – The scalable rapid prototyping platform
Presented by Graham Reed - Cornerstone, University of Southampton
15:30 Scaling up photonic integration: validating designs, chips and assemblies
Presented by Iñigo Artundo - VLC Photonics
15:45 Spectral characterization: challenges, solutions and the future of PIC optical testing
Presented by François Couny - EXFO
16:00 Two Paths to Economic Packaging & Test
Presented by Scott Jordan - Physik Instrumente
16:15 PANEL SESSION
Does volume drive photonics integration?
Bill Ring, EFFECT Photonics, Yole Développement, AEPONYX inc, Luxtera, and Intel
17:05 Networking Drinks Reception
Wednesday 18th November 2020 starting at 08:00 GMT (09:00 BST / 10:00 CEST)
08:00 Registration and welcome refreshments.
08:50 Housekeeping by Michael Lebby and David Cheskis
PIC Technology − Solutions, Analysis & Research
09:00 Cost-effective high-power laser-on-silicon technology for LiDAR applications
Presented by Dongjae Shin - Samsung
09:15 Photonics Then & Now; Why Now But Not Then?
Presented by David Banas - Luminous Computing
09:30 Additive microfabrication for optical packaging
Presented by Jochen Zimmer - Nanoscribe
09:45 Innovations in fiber to chip connectivity
Presented by Scott Bickham - Corning Optical Communications
10:00 Design, modeling and simulation for the imperfections of real life
Presented by James Pond - Lumerical
10:15 Morning Break - Sponsored by Hewlett Packard Enterprise
10:45 Coherent vs. Direct-Detection: Market Forces Shaping PIC Technology Beyond 400 G
Presented by Vipul Bhatt - II-VI
11:00 Coping with the diversity of technologies and applications in CAD environments
Presented by André Richter - VPIphotonics
11:15 OptiSPICE Plugin: A SPICE Native Optical Model Library for Opto-Electronic Design Automation
Presented by Cem Bonfil - Optiwave
PICs Vision − Evolution and Revolution
11:30 AIM's role in developing next-gen PICs and TAP manufacturing expertise
Presented by Frank Tolic - AIM Photonics
11:45 Presentation Title to be Confirmed
12:00 InP PICs and their future network & market applications
Presented by Mehrdad Ziari - Infinera
12:15 Elenion Technologies - Presentation Title TBC
Presented by Michael Hochberg - Elenion Technologies
12:30 Lunch Break - Sponsored by Hewlett Packard Enterprise
13:45 Presentation Title to be Confirmed
14:00 Integrated photonics for neuromorphic computing
Presented by Bert Offrein - IBM
14:15 Optical transceiver manufacturing in the electronics ecosystem – lessons learned and the road ahead
Presented by Ted Schmidt - Juniper Networks
14:30 Increasing power efficiency with Electro-optic (EO) Polymers
Presented by Michael Lebby - Lightwave Logic Inc
14:45 Afternoon Break - Sponsored by Hewlett Packard Enterprise
PIC ROI − Quality Metrics & Scalability
15:00 Invest in your design flow
Presented by Martin Fiers - Luceda Photonics
15:15 Presentation Title to be Confirmed - Smart Photonics
Presented by Luc Augustin - Smart Photonics
15:30 Future and economics of PICs and PLCs in PON systems for data centre and mobile backhaul applications
Presented by Henk Bulthuis - Broadex Technologies
15:45 Assessing the long-term growth and market potential for PICs in datacom, transport and networks
Presented by Eric Higham - Strategy Analytics
16:00 Closing Remarks
Presentation times and order are subject to change. This agenda was last updated on 22 Sep 2020 at 3:25pm.