08:00
|
Registration and welcome refreshments.
|
08:50
|
Housekeeping by Conference Chair
|
Refining and streamlining PIC production
|
|
|
09:00
|
The value of the fab in the PIC industry
Presented by Eric Higham - Strategy Analytics
|
|
09:20
|
Fully integrating lasers, modulators, and photodetectors with standard silicon photonic fabrication
Presented by Sylvie Menezo - Scintil Photonics
|
|
09:40
|
The role of PICs in the data communication roadmap
Presented by Jim Theodoras - HG Genuine
|
|
10:00
|
Wafer-level Nanoimprint Technology for Innovative Packaging of Photonic Integrated Circuits
Presented by Andrea Kneidinger - EV Group
|
|
10:20
|
Perspectives on the future of Silicon Photonics
Presented by Eric Mounier - Yole Développement
|
|
10:40
|
|
Morning Break - Sponsored by Synopsys
|
11:10
|
Seamless PIC testing capability: moving from lab to production
Presented by François Couny - EXFO
|
|
11:30
|
Edge coupled electro-optical PIC testing on wafer level
Presented by Moritz Seyfried - ficonTEC
|
|
11:50
|
Integrating chip design and simulation environment for photonic integrated circuits
Presented by Cem Bonfil - Optiwave
|
|
12:10
|
Interoperable Software Tools for the Photonic Design Workflow
Presented by André Richter - VPIphotonics
|
|
12:30
|
|
Lunch Break - Sponsored by Synopsys
|
13:45
|
Photonics Design IP: Challenges & Opportunities
Presented by Martin Fiers - Luceda Photonics
|
|
14:05
|
Yield improvement techniques in the manufacturing of AWG (cascade) PLC
Presented by Henk Bulthuis - Broadex Technologies
|
|
14:25
|
State-of-the-Art Electronic-Photonic Design Automation
Presented by Xu Wang - Ansys
|
|
14:45
|
Photonics Design IP: Challenges & Opportunities
Presented by Martin Fiers - Luceda Photonics
|
|
|
Optimising the architecture
|
|
|
15:05
|
Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer
Presented by Suresh Venkatesan - POET Technologies
|
|
15:25
|
Advancing SOI technology for datacentre transceivers and sensing applications
Presented by Corrado Sciancalepore - Soitec
|
|
15:45
|
|
Afternoon Break - Sponsored by Synopsys
|
16:15
|
Targeting emerging markets with the CORNERSTONE platform
Presented by Graham Reed - Cornerstone, University of Southampton, and Lia Li - Zero Point Motion
|
|
16:35
|
Improving optical coupling in PIC and Hybrid Photonic Packaging with Aligned Two-Photon Lithography
Presented by Joerg Smolenski - Nanoscribe
|
|
16:55
|
Low Loss Photonic Integrated Circuits: Every Photon Counts
Presented by Michael Geiselmann - Ligentec
|
|
17:15
|
Enabling lower power consumption optical networking using high speed, low power polymer modulators
Presented by Michael Lebby - Lightwave Logic Inc
|
|
17:35
|
TBA
Presented by Name to be advised - Ayarlabs
|
|
17:55
|
Ramping production capacity of low-loss lithium niobate on insulator PICs for electro-optic and nonlinear applications
Presented by Amir H. Ghadimi - CSEM
|
|
18:20
|
Networking Drinks / Dinner Reception sponsored by Synopsys
|
|
|