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08:00
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Registration and welcome refreshments
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08:50
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Housekeeping by Michael Lebby and David Cheskis - Conference Chairs
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Foundations of PIC design: materials, devices and processes
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09:00
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Scaling Co-packaged Optics Requires a Fundamental Rethink of Fibre-to-chip Interconnects
Presented by Dominic Sulway - Light Trace Photonics
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09:15
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Enabling THz Bandwidth on-chip with Plasmonic Modulators
Presented by Stephan Koch - Polariton Technologies AG
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09:30
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Presentation by APEX Technolgies
Presented by Name to be advised - APEX Technolgies
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09:45
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Advancing Scalable Photonic Integration: Heterogeneous Integration of Active Components for Next-Generation Applications
Presented by Michael Geiselmann - LIGENTEC
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10:00
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Presentation by Nanoscribe
Presented by Name to be advised - Nanoscribe
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10:15
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CMOS Compatible TFLN Technology
Presented by Steven Tan - Rapid Photonics
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10:30
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Morning Break and Networking
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11:00
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Glass-Integrated PICs: Shaping the Future of Photonics
Presented by Giacomo Corrielli - Ephos
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11:15
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Simulation-Driven PIC Design – Accelerating Performance, Reliability and Time-to-Market
Presented by Name to be advised - Ansys, part of Synopsys
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11:30
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Advanced Automated Assembly Platforms for High-Precision PIC Packaging and Integration
Presented by Lorenzo Mandelli - ficonTEC
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11:45
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Bringing PIC Design Automation to the Forefront of Photonic Innovation
Presented by Name to be advised - Luceda Photonics
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12:00
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Photonics Chip Level Test Strategies Overcoming Vibration Challenges in High Volume Production Environments
Presented by Name to be advised - Physik
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12:15
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Presentation by EPFL
Presented by Tobias Kippenberg - EPFL
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12:30
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Lunch Break and Networking
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14:00
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Presentation by Tower Semiconductor
Presented by Bowen Wang - Tower Semiconductor
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14:15
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Presentation #1 by imec
Presented by Leili Shiramin - imec
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Connectivity and scalability for secure, high-speed data networks
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14:30
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PIC-enabled Quantum-safe Cryptography
Presented by Francesco Raffaelli - KETS Quantum Security
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14:45
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Presentation by Vanguard Automation
Presented by Name to be advised - Vanguard Automation
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15:00
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Building Scalable, Energy-Efficient TFLN PICs Through Industrial-Grade Manufacturing
Presented by Hernán Furci - CCRAFT
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15:15
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Beyond the Chip: System-Scale Simulations for Next-Gen PICs
Presented by Name to be advised - VPIphotonics
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15:30
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Designing for Yield: Production-Grade PDKs for Ultra-high-speed TFLN Photonic Engines.
Presented by Name to be advised - Lightium
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15:45
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Optical Interconnects for AI Clusters: Markets and Technologies
Presented by Roy Rubenstein - LightCounting
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16:00
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Afternoon Break and Networking
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16:30
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PANEL SESSION
Novel Startups in Photonic Integrated Circuits — From Concept to Deployment
Moderated by Jon Pugh, Director of PIC and Quantum Technologies at OPTICA
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17:00
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Presentation by EV Group
Presented by Thomas Achleitner - EV Group
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17:15
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Integrated Photonics from Opportunity to Mass Production for 50G+ Access Networks
Presented by Name to be advised - PICadvanced
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17:30
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Presentation #2 by imec
Presented by Name to be advised - imec
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17:45
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Presentation by Nokia
Presented by Mehrdad Ziari - Nokia
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18:00
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Photonic Integrated Circuits and Co-packaged Optics for HPC and AI Data Centers
Presented by Mika Takahashi - IDTechEx
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18:15
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Networking Drinks / Dinner Reception
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