PIC International 2021 Agenda

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Monday 8th November 2021 starting at 14:00 CET
14:00 PIC Pilot Lines Conference (Click to view)
18:30 Pre-event Networking reception supported by IQE and EPIC. This is open to all delegates, speakers and sponsors of the PIC Pilot Lines, CS International, PIC International and Sensors International conference. Nibbles, drinks and refreshments will be provided.
Tuesday 9th November 2021 starting at 08:00 CET
08:00 Registration and welcome refreshments.
08:50 Housekeeping by Michael Lebby and David Cheskis
PICs Today − Datacom, Sensing & LiDAR Sponsored by Axetris
09:00 PANEL SESSION
PICs for LIDAR
ommatidia lidar, EPIC, Freedom Photonics, and Intel
09:25 Simplifying the LiDAR User Experience with SiPM Evaluation Kits and Reference Designs
Presented by Bahman Hadji - ON Semiconductor
09:45 Beyond communication, silicon photonics is penetrating consumer and automotive
Presented by Eric Mounier - Yole Développement
10:05 Novel electro-optical substrate enabling cost effective PIC assembly solutions for sensor and communication applications
Presented by Nikolaus Floery - Vario-optics
10:25 Morning Break - Sponsored by Hewlett Packard Enterprise
10:55 Hybrid Photonic Integration for Sensing and Communications
Presented by Martin Schell - Fraunhofer HHI
11:15 IR assisted sub-micrometer through-silicon alignment
Presented by Moritz Seyfried - ficonTEC
11:35 Silicon Photonics for automotive LIDAR and other sensing applications
Presented by Robert Blum - Intel
11:55 An overview of a variety of cutting edge PICs for sensing applications
Presented by Paul Leisher - Freedom Photonics
12:15 Unified E/O co-design for Datacom, Sensing & LiDAR
Presented by Twan Korthorst - Synopsys
12:35 Integrated Photonics for quantum applications: Si & SiN photonics
Presented by Christian Haffner - Imec
12:55 PICs for data-center interconnects
Presented by Benjamin Wohlfeil - ADVA Optical Networking
13:15 Lunch Break - Sponsored by Hewlett Packard Enterprise
PIC Manufacturing − TAP, Co-Packaging & Fab
14:30 Si-Based Photonic platform at CEA – Leti
Presented by Sergio Nicoletti - CEA-Leti
14:50 Low loss PICs: from fast prototyping to high volumes!
Presented by Michael Geiselmann - LIGENTEC
15:10 Silicon nitride based TriPleX™ modules with hybrid PIC integration
Presented by Arne Leinse - LioniX International
15:30 Afternoon Break - Sponsored by Hewlett Packard Enterprise
15:55 CORNERSTONE – The scalable rapid prototyping platform
Presented by Graham Reed - Cornerstone, University of Southampton
16:15 The new positioning stage for multi-fiber micro-alignment
Presented by Simone Cardarelli - MicroAlign
16:35 Scaling up photonic integration: validating designs, chips and assemblies
Presented by Iñigo Artundo - VLC Photonics
16:55 Spectral characterization: challenges, solutions and the future of PIC optical testing
Presented by François Couny - EXFO
17:15 Indium Phosphide light sources for Silicon Photonics Integrated Circuits
Presented by Andrew McKee - Sivers Photonics
17:35 5 Critical Factors for Successful PIC Testing
Presented by Wajih Daab - Luna Inc
17:55 PANEL SESSION
Does volume drive photonics integration?
Sivers Photonics, Bill Ring, EFFECT Photonics, VLC Photonics, LIGENTEC, and Intel
18:20 Closing remarks
18:25 Networking Drinks / Dinner Reception
Wednesday 10th November 2021 starting at 08:00 CET
08:00 Registration and welcome refreshments.
08:50 Housekeeping by Michael Lebby and David Cheskis
PIC Technology − Solutions, Analysis & Research Sponsored by HyperLight
09:00 Cost-effective high-power laser-on-silicon technology for LiDAR applications
Presented by Dongjae Shin - Samsung
09:20 Photonics Then & Now; Why Now But Not Then?
Presented by David Banas - Luminous Computing
09:40 Additive microfabrication for optical packaging
Presented by Jochen Zimmer - Nanoscribe
10:00 Design, modeling and simulation for the imperfections of real life
Presented by Greg Baethge - Ansys Lumerical
10:20 Market Forces Shaping PIC Technology Beyond 400G
Presented by Vipul Bhatt - II-VI
10:40 Morning Break - Sponsored by Hewlett Packard Enterprise
11:10 Coping with the diversity of technologies and applications in CAD environments
Presented by André Richter - VPIphotonics
11:30 New Photonics Applications, New Challenges, Old Patterns
Presented by Scott Jordan - Physik Instrumente
11:50 Integrated Photonic Design
Presented by Pete Davy - Mentor
PICs Vision − Evolution and Revolution
12:10 Integrated photonics for neuromorphic computing
Presented by Bert Offrein - IBM
12:30 Programmable photonics: Inventing the future of integrated optics
Presented by Jose Capmany - iPronics Programable Photonics, S.L.
12:50 Ecosystem for integrated photonics… “in a new world”.
Presented by Ewit Roos - PhotonDelta
13:10 Lunch Break - Sponsored by Hewlett Packard Enterprise
14:25 The role of integrated photonics in next generation access networks
Presented by Francisco Rodrigues - PICAdvanced
14:45 Increasing power efficiency with Electro-optic (EO) Polymers
Presented by Michael Lebby - Lightwave Logic Inc
15:05 The Thrilling Opportunities of Plasmonics in Optical Communications
Presented by Claudia Hössbacher - Polariton Technologies AG
15:25 Afternoon Break - Sponsored by Hewlett Packard Enterprise
PIC ROI − Quality Metrics & Scalability
15:55 Photonics design IP
Presented by Martin Fiers - Luceda Photonics
16:15 Scalable and versatile photonic integrated circuits using generic platform
Presented by Luc Augustin - Smart Photonics
16:35 Future and economics of PICs and PLCs in PON systems for data centre and mobile backhaul applications
Presented by Henk Bulthuis - Broadex Technologies
16:55 Assessing the long-term growth and market potential for PICs in datacom, transport and networks
Presented by Eric Higham - Strategy Analytics
17:15 Closing Remarks
Presentation times and order are subject to change. This agenda was last updated on 08 Dec 2021 at 4:12pm.