Monday 8th November 2021 starting at 14:00 CET

14:00 PIC Pilot Lines Conference (Click to view) 18:30 Pre-event Networking reception supported by IQE and EPIC. This is open to all delegates, speakers and sponsors of the PIC Pilot Lines, CS International, PIC International and Sensors International conference. Nibbles, drinks and refreshments will be provided.

Tuesday 9th November 2021 starting at 08:00 CET

08:00 Registration and welcome refreshments. 08:50 Housekeeping by Michael Lebby and David Cheskis PICs Today − Datacom, Sensing & LiDAR Sponsored by Axetris 09:00 PANEL SESSION PICs for LIDAR ommatidia lidar, EPIC, Freedom Photonics, and Intel 09:25 Simplifying the LiDAR User Experience with SiPM Evaluation Kits and Reference Designs Presented by Bahman Hadji - ON Semiconductor 09:45 Beyond communication, silicon photonics is penetrating consumer and automotive Presented by Eric Mounier - Yole Développement 10:05 Novel electro-optical substrate enabling cost effective PIC assembly solutions for sensor and communication applications Presented by Nikolaus Floery - Vario-optics 10:25 Morning Break - Sponsored by Hewlett Packard Enterprise 10:55 Hybrid Photonic Integration for Sensing and Communications Presented by Martin Schell - Fraunhofer HHI 11:15 IR assisted sub-micrometer through-silicon alignment Presented by Moritz Seyfried - ficonTEC 11:35 Silicon Photonics for automotive LIDAR and other sensing applications Presented by Robert Blum - Intel 11:55 An overview of a variety of cutting edge PICs for sensing applications Presented by Paul Leisher - Freedom Photonics 12:15 Unified E/O co-design for Datacom, Sensing & LiDAR Presented by Twan Korthorst - Synopsys 12:35 Integrated Photonics for quantum applications: Si & SiN photonics Presented by Christian Haffner - Imec 12:55 PICs for data-center interconnects Presented by Benjamin Wohlfeil - ADVA Optical Networking 13:15 Lunch Break - Sponsored by Hewlett Packard Enterprise PIC Manufacturing − TAP, Co-Packaging & Fab 14:30 Si-Based Photonic platform at CEA – Leti Presented by Sergio Nicoletti - CEA-Leti 14:50 Low loss PICs: from fast prototyping to high volumes! Presented by Michael Geiselmann - LIGENTEC 15:10 Silicon nitride based TriPleX™ modules with hybrid PIC integration Presented by Arne Leinse - LioniX International 15:30 Afternoon Break - Sponsored by Hewlett Packard Enterprise 15:55 CORNERSTONE – The scalable rapid prototyping platform Presented by Graham Reed - Cornerstone, University of Southampton 16:15 The new positioning stage for multi-fiber micro-alignment Presented by Simone Cardarelli - MicroAlign 16:35 Scaling up photonic integration: validating designs, chips and assemblies Presented by Iñigo Artundo - VLC Photonics 16:55 Spectral characterization: challenges, solutions and the future of PIC optical testing Presented by François Couny - EXFO 17:15 Indium Phosphide light sources for Silicon Photonics Integrated Circuits Presented by Andrew McKee - Sivers Photonics 17:35 5 Critical Factors for Successful PIC Testing Presented by Wajih Daab - Luna Inc 17:55 PANEL SESSION Does volume drive photonics integration? Sivers Photonics, Bill Ring, EFFECT Photonics, VLC Photonics, LIGENTEC, and Intel 18:20 Closing remarks 18:25 Networking Drinks / Dinner Reception

Wednesday 10th November 2021 starting at 08:00 CET

08:00 Registration and welcome refreshments. 08:50 Housekeeping by Michael Lebby and David Cheskis PIC Technology − Solutions, Analysis & Research Sponsored by HyperLight 09:00 Cost-effective high-power laser-on-silicon technology for LiDAR applications Presented by Dongjae Shin - Samsung 09:20 Photonics Then & Now; Why Now But Not Then? Presented by David Banas - Luminous Computing 09:40 Additive microfabrication for optical packaging Presented by Jochen Zimmer - Nanoscribe 10:00 Design, modeling and simulation for the imperfections of real life Presented by Greg Baethge - Ansys Lumerical 10:20 Market Forces Shaping PIC Technology Beyond 400G Presented by Vipul Bhatt - II-VI 10:40 Morning Break - Sponsored by Hewlett Packard Enterprise 11:10 Coping with the diversity of technologies and applications in CAD environments Presented by André Richter - VPIphotonics 11:30 New Photonics Applications, New Challenges, Old Patterns Presented by Scott Jordan - Physik Instrumente 11:50 Integrated Photonic Design Presented by Pete Davy - Mentor PICs Vision − Evolution and Revolution 12:10 Integrated photonics for neuromorphic computing Presented by Bert Offrein - IBM 12:30 Programmable photonics: Inventing the future of integrated optics Presented by Jose Capmany - iPronics Programable Photonics, S.L. 12:50 Ecosystem for integrated photonics… “in a new world”. Presented by Ewit Roos - PhotonDelta 13:10 Lunch Break - Sponsored by Hewlett Packard Enterprise 14:25 The role of integrated photonics in next generation access networks Presented by Francisco Rodrigues - PICAdvanced 14:45 Increasing power efficiency with Electro-optic (EO) Polymers Presented by Michael Lebby - Lightwave Logic Inc 15:05 The Thrilling Opportunities of Plasmonics in Optical Communications Presented by Claudia Hössbacher - Polariton Technologies AG 15:25 Afternoon Break - Sponsored by Hewlett Packard Enterprise PIC ROI − Quality Metrics & Scalability 15:55 Photonics design IP Presented by Martin Fiers - Luceda Photonics 16:15 Scalable and versatile photonic integrated circuits using generic platform Presented by Luc Augustin - Smart Photonics 16:35 Future and economics of PICs and PLCs in PON systems for data centre and mobile backhaul applications Presented by Henk Bulthuis - Broadex Technologies 16:55 Assessing the long-term growth and market potential for PICs in datacom, transport and networks Presented by Eric Higham - Strategy Analytics 17:15 Closing Remarks