Monday 7th April 2025 starting at 18:00 CET

18:00 Pre-conference networking drinks reception

Tuesday 8th April 2025 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis - Conference Chairs Optimising materials and architectures to progress PICs 09:00 Germanium Electro-Absorption Modulators: Fast, Compact and Energy-efficient Presented by Daniel Steckler - IHP Microelectronics 09:15 UV Photonics and Rare-earth Doped Amplifiers with Sputter-deposited Aluminium Oxide Waveguides Presented by Dawson Bonneville - University of Twente 09:30 Two-Photon Grayscale Lithography: An Enabling Technology for Scalable Fabrication of Aligned Micro-Optics Presented by Tobias Hoose - Nanoscribe 09:45 IMEC’s Agile Photonics Platforms Presented by Leili Shiramin - imec 10:00 Photonic Integrated Circuit Packaging Presented by Liam Moroney - Alter Technology 10:15 Morning Break 10:55 Comparing PIC Platforms: What’s the Best Fit? Presented by Sam Dale - IDTechEx 11:10 Structuring and Uniformity Improvement of Thin Film LN and other Waveguide Materials Presented by Philipp Böttger - scia Systems GmbH 11:25 Advancing towards 50G PON with Flexible Multi-Tech PICs Presented by Antonio Teixeira - PICadvanced 11:40 Industry Ready Photonic Integration using Photonic Wire Bonds & Facet-Attached Micro-Lenses Presented by Matthias Lauermann - Vanguard Automation 11:55 The Future Role of Bonding in Photonic Integrated Circuits and Co-Packaged Optics Presented by Dr. Bernd Dielacher - EV Group 12:10 Lunch Break Delivering more data: AI, machine learning and tomorrow's computing Sponsored by OPTICA 13:40 The Evolving Role of Optics in AI Clusters Presented by Vlad Kozlov - LightCounting 13:55 Integrated Neuromorphic Photonics and Optical Computing Accelerators Presented by Matěj Hejda - Hewlett Packard Enterprise 14:10 Accelerating Photonic Design for Next Generation Computing with Multiphysics Simulation Presented by Dylan McGuire - Ansys 14:25 Driving Functional Test Closer to the Chip Presented by Matt Adams - VIAVI Solutions 14:40 Serving Reliable and Robust Test and Measurement Needs Presented by Kazuo Yamaguchi - Keysight Technologies 14:55 Custom PDK Framework for PIC Design and Simulation of Datacenter Interconnects Presented by Andrzej Połatynski - VPIphotonics 15:10 Afternoon Break 15:50 Optical Interconnects for Next Generation of AI Systems Presented by Ana González - iPronics 16:05 Modular System Concepts for Photonics Packaging and Testing Presented by Andon Bano - ficonTEC 16:20 Breaking the Bottleneck: High-Volume Manufacturing of TFLN PICs for Telecom & Datacom Presented by Amir Ghadimi - Lightium 16:35 The Future of Optical Interconnects is 3D Printed Freeform Optics Presented by Dr. Laura Horan - Vanguard Automation 16:50 Bridging the gap between PIC Designer and Foundries Presented by Martin Fiers - Luceda Photonics 17:05 Thin film lithium niobate: the ideal material for scalable high-performance photonic components and PICs Presented by Pouya Dianat - Quantum Computing 17:20 Merging Photonic Design and Test Towards Scalable Product Development Presented by Iñigo Artundo - VLC Photonics 17:35 Closing Remarks 18:00 Networking Drinks / Dinner Reception

Wednesday 9th April 2025 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis - Conference Chairs Optimising materials and architectures to progress PICs 09:00 Advancing TFLN PICs to Meet Market Demand and Scale Production Presented by Hamed Sattari - CCRAFT 09:15 Enabling Increasingly Dense fiber-to-chip Connections in Datacenters Presented by Benoit Fleury - Corning 09:30 InP PIC Platform and Architectures for Data-Center Applications Presented by Mehrdad Ziari - Nokia 09:45 What about the PIC Manufacturing Sweet Spot? Presented by Twan Korthorst - New Origin 10:00 Advanced Photonic Integrated Circuit Testing: APEX Technologies’ Solution for Next-Generation Optical Devices Presented by Marc-Andre Laliberte - APEX Technologies 10:15 Morning Break 10:55 Leveraging Opportunity: Test and Assembly as Fulcrum for Scaling Presented by Scott Jordan - Physik Instrumente 11:10 Sputtered Thin-Film Aluminum Nitride on Insulator for Integrated Photonics: a Scalable Approach and Application Potential Presented by Thang Duy Dao - Silicon Austria Labs (SAL) 11:25 PANEL SESSION Accelerating the Adoption of Advanced Photonic Integrated Circuits Using Design Standardisation in PIC Packaging ficonTEC, PHIX, imec, and Photonics Foundry Moderated by Jon Pugh, Director of PIC and Quantum Technologies at OPTICA 11:55 Lunch Break Harnessing PICs in healthcare, autonomous vehicles and beyond Sponsored by PhotonDelta 13:25 Scaling up LiDAR with Silicon Photonics Presented by François Simoens - SteerLight 13:40 Aluminum Oxide PICs for UV Microscopy and Sensing Presented by Nicolas Le Thomas - Ghent University 13:55 The Future of PICs in Agrifood, Healthcare & Industrial Sensing Presented by Peter van Arkel - PhotonDelta 14:10 Silicon Photonics for Enabling Chip-based Solid-state Automotive FMCW LiDAR Presented by Marcus Dahlem - imec 14:25 SiN PICs for Optical Coherence Tomography Presented by Rainer Hainberger - AIT Austrian Institute of Technology GmbH 14:40 Industrial BioChemical Detection with On-chip Raman Technology Presented by Ivan-Lazar Bundalo - InSpek 14:55 Afternoon Break Advancing quantum 2.0 technologies with PICs 15:35 Advancing Quantum Communications with PICs Presented by Taofiq K. Paraïso - Toshiba Europe Limited 15:50 How Photonics Can Support Quantum Innovation in Different Applications Presented by Eric Mounier - Yole Group 16:05 Modular, Fibre-Interconnected Architectures for Photonic Quantum Computers Presented by Thien-An Nguyen - Orca Computing 16:20 Closing Remarks