PICs Today − Datacom, Imaging and Transport

Presentation

Integration of InP PICs Across Future Networks and Markets

This presentation's abstract will be available shortly.

Speaker

Mehrdad Ziari

VP at Infinera

Mehrdad Ziari joined Infinera in 2002 and is currently Vice President of Product Development and responsible for technology and product development of PICs and ASICs. Prior to joining Infinera, he was a member of the R&D team at SDL Inc. where worked on various laser diode and optical component technologies and led InP R&D activities and development of Raman pump laser products. He has received his Bachelor of Science with Suma Cum Laude honors, MS and Ph.D. degrees in Electrical Engineering in 1986, 1987 and 1992 respectively from the University of Southern California in Los Angeles, CA. He has published over 100 papers, two book chapters and is named on over 30 patents.

PICs Today − Datacom, Imaging and Transport

Presentation

Achieving high quality 100G data center PIC Integration

This presentation's abstract will be available shortly.

Speaker

Katharine Schmidtke

Strategic Sourcing Optical Technology at Facebook

From subsea fiber cables to short-reach switch interconnects, photonics is a key technology for hyperscale data center networks. Integration is key to delivering high performance and quality at hyperscale. This talk will describe how the scale of data-bandwidth growth has challenged what is possible with traditional manufacturing techniques and where the next opportunities for integration lie.

PICs Today − Datacom, Imaging and Transport

Presentation

A unified silicon photonics platform for communications, imaging and sensing

This presentation's abstract will be available shortly.

Speaker

Andrew Rickman

Rockley Photonics

Andrew is a leading proponent of silicon photonics and has led innovation in many aspects of photonics technologies. He was previously founder, chief executive and chairman of Bookham Technology and grew the company to become a FTSE100 business. In 1988, Bookham, renamed Oclaro, became one of the world’s largest fiber optics telecom component producers. Oclaro is now part of Lumentum. More recently, Andrew was chairman of Kotura Inc., a leader in the field of silicon photonics for fiber optic communications. He was instrumental in Kotura’s development and its sale to Mellanox Technologies Ltd. in 2013.  Andrew has a mechanical engineering degree from Imperial College, London; a PhD in silicon photonics from Surrey University, an MBA from Cranfield University and honorary doctorates from Surrey, Edinburgh Napier and Kingston Universities. He is a chartered engineer and a Fellow of the Royal Academy of Engineering and the Institute of Physics. He was awarded an OBE in the Queen’s Millennium Honours list for services to the telecommunications industry and is a winner of the prestigious Royal Academy of Engineering Silver medal for his outstanding contribution to British Engineering 

PICs Today − Datacom, Imaging and Transport

Presentation

AIM Photonics’ role in developing next generations of PICs and TAP manufacturing expertise

AIM Photonics is a Manufacturing USA institute whose mission is to provide cost-effective and easy-to-use access to state-of-the-art silicon photonics processing. AIM Photonics is providing access to a Multi-Project-Wafer program enabled with a highly competitive component library and offers Assembly and Packaging services starting 2019. AIM is supporting consortium projects with the intent to enable new manufacturing technology for reduced assembly cost, but is also developing custom processes in support of industry or government funded PIC products. AIM has a Si Photonics process available at SUNY Poly and an InP offering at Infinera and potential application examples will be discussed.

Speaker

Michael Liehr

CEO at American Institute for Manufacturing Photonics

Michael Liehr is the Chief Executive Officer of the American Institute for Manufacturing (AIM) Photonics. Michael focuses on the creation of new AIM business opportunities, and is responsible for the effective and efficient operation of AIM’s programs including SUNY Poly’s strategic 300mm integrated photonic semiconductor and 3D packaging. He is also SUNY Polytechnic Institute’s Vice President for Research and Executive Vice President for Technology and Innovation. Prior to this assignment, he led the Global 450mm Consortium through the start-up phase as the General Manager and was an IBM Distinguished Engineer.

PICs Today − Datacom, Imaging and Transport

Presentation

New VCSEL opportunities in 3D sensing and beyond

Vertical-cavity surface emitting lasers (VCSELs) have been the workhorse of datacom networks for several decades – lighting up multimode fibres at wavelengths around 850nm – but new opportunities in consumer markets require product volumes that are orders of magnitude greater - with visible effects on the revenues reported by key components vendors. Apple pioneered 3D sensors for facial recognition in smartphones and world-facing 3D sensors to enable AR/VR will be next. New opportunities for lasers in lidar systems for autonomous driving are also on the horizon.

Speaker

Pauline Rigby

Lightcounting

Pauline has 20 years’ experience writing about optical components for the telecom and datacom industries. She started as technology reporter and eventually became editor of Fibre Systems magazine and remains as a consulting editor on the title. Pauline has a degree in engineering and a doctorate in optoelectronics from the University of Oxford, where she studied the properties of photonic bandgap materials.

PICs Today − Datacom, Imaging and Transport

Presentation

Device prototyping using the CORNERSTONE platform

As the market adoption of silicon photonics technologies continues to rise, and ever more fabless companies enter the market, there is a clear need for a flexible device prototyping foundry service that retains the ability for device level innovation, and also offers a clear path for up-scaling. The CORNERSTONE platform offers a low cost multi-project-wafer (MPW) service that enables a degree of customisation, which may not be accessible at other foundries. Through the use of projection lithography, fabrication processes can be easily transferred to other foundries for mass production. Additionally, the ability to exploit high resolution e-beam lithography mimics more advanced technology nodes for certain layers, should this be deemed necessary. This talk gives an overview of the CORNERSTONE platform.

Speaker

Callum Littlejohns

Cornerstone, University of Southampton

Dr Callum Littlejohns completed his PhD in the field of Silicon Photonics at the Optoelectronics Research Centre, University of Southampton in March 2015, having previously obtained a First-Class Honours degree in Electronic Engineering at the University of Surrey. He is now part of the CORNERSTONE team in the Silicon Photonics Group at the University of Southampton, working on rapid prototyping of silicon photonics devices. He has a track record of excellence, having received multiple awards throughout his academic life, including the Information Overload category winner at the 2015 EPSRC ICT Pioneers Awards. Callum has published a book chapter, over 25 papers in peer-reviewed journals, and over 80 international conference papers, including a prestigious post-deadline paper at the 2014 IEEE Group IV Photonics conference, in the field of silicon photonics. The work completed during Callum’s PhD has been protected by two separate patents, both fully supported by the University of Southampton. He has twice served as the conference chairman at the Enlighten conference as part of the Photonex Europe exhibition.

PICs Today − Datacom, Imaging and Transport

Presentation

PhotonDelta: Gateway to Indium Phosphide, TripleX and PIC Solutions

This presentation's abstract will be available shortly.

Speaker

René Penning de Vries

Photon Delta

René Penning de Vries, PhD, has been employed by Royal Philips NV and subsequently NXP Semiconductors as Chief Technology Officer and as CEO of NXP Netherlands.  Since 2012 René has taken up various public sector roles with the aim of fostering of innovation.  René acts as Chairman Dutch Digital Delta (https://www.dutchdigitaldelta.nl/) , which is an initiative from the Dutch Ministry of Economical Affairs to facilitate public-private partnerships in the area of ICT.  In addition, René is chairing the Health Valley foundation (https://www.healthvalley.nl)  

that aims to accelerate innovation by bringing together expertise in healthcare and high tech or ICT.  Furthermore, René is advising the Dutch National Science Council NWO, is chairman of the board of the BOM, a regional development agency (250MEuro) and chairman of the St Maartenskliniek, a specialized clinic for posture and movement. Since early 2018, René is leading PhotonDelta, which oversees the national initiative on Integrated Photonics. 

PICs Today − Datacom, Imaging and Transport

Presentation

PIC differentiation, emerging markets, and common modular platforms for assembly and test.

Differentiation in the assembly and test process requirements between photonic devices in emerging markets has consequences for automated production equipment. Modularity in the approach to system layout provides the tools for addressing these differences, where both common application-specific platforms and custom configurations become the norm. But the benefits don’t end there.

Speaker

Ignazio Piacentini

Director of Business Development at ficonTEC

Ignazio Piacentini has recently taken up the position of Director of Business Development at ficonTEC GmbH in Achim, Germany, after heading the Photonics Devices Assembly Business Unit at PI miCos GmbH (PI Group).

Previous to that, he directed ImagingLab Srl, in Lodi (Italy) an engineering / consulting company specialized in machine vision and advanced robotics. He held the position of Business Development Manager Europe for imaging and motion of National Instruments (Austin, TX) from 1999 to 2003.
He has a B.Sc. in Nuclear Engineering (Milan, Italy, 1975) and a M.Sc. degree in Digital Systems and Instrumentation (Polytechnic of Central London, UK, 1987).

Before joining the machine vision industry in the early nineties, he has spent many years working for the European Commission (Euratom) designing control and data acquisition systems for the thermonuclear fusion research community, with a long spell at the JET project (Culham Labs, UK). In more recent years he was selected as an 'external expert' consultant for ITER (a large scale thermonuclear experimental project) working on Remote Handling Control System issues, Viewing equipment, Virtual and Augmented Reality, and 3D Vision and Metrology.

He has served two consecutive mandates as a member of the Board of Directors of EMVA (European Machine Vision Association).

PICs Today − Datacom, Imaging and Transport

Presentation

The future and economics of PICs and PLCs in data center applications

This presentation's abstract will be available shortly.

Speaker

Henk Bulthuis

Broadex Technologies

Henk Bulthuis is director of the R&D group of Broadex Technologies UK, formerly Kaiam Europe, Gemfire Europe, Avanex, Alcatel Optronics and Kymata.  He co-founded BBV software BV and BBV design BV which were acquired by Kymata in 2000. Close to 800 mask reticles and 2000 of his PLC/PIC designs were simulated, layed out fabricated and tested. Most of the designs were made in glass or silicon technologies. 

Panel Session

How does the PIC industry deliver on the promises of size, speed, and economy with high quality?

PIC devices offer size, performance and energy advantages that have enabled rapid growth among optical component manufacturers while encouraging entrants offering new and novel insights. End users need high levels of consistent quality--the hallmarks of CMOS device fabrication--while process tool, assembly and test automation experts strive to support the unique requirements of PIC module TAP. Today’s PIC-based transceivers or PIC transceiver components are often assembled, packaged and tested manually. Is it possible to drive demand while the infrastructure needed to support it is still being conceived, designed and built?

Speakers

Katharine Schmidtke

Facebook

Robert Blum

Intel

Mehrdad Ziari

Infinera

Stefan Meister

Sicoya

Andrew Rickman

Rockley Photonics

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Open access manufacturing for PICs – bringing volume manufacturing to new markets

PICs are most widely used in telecom and datacom. These markets have typically been vertically integrated, with the manufacturers owning the production facility or, at least, the process. Such business models will likely not work other markets, where the threshold in terms of cost and lack of expertise is too high. Creating generic PIC processes with standardized building blocks, such as lasers, modulators and detectors, which are accessible through multi-project wafer runs, was the first step to successfully lower this threshold. Now the time is here to scale these generic processes up from prototype-level to open access volume manufacturing.

Speaker

Martijn Heck

ePIXfab – European Silicon Photonics Alliance

Martijn Heck received the M.Sc. degree in applied physics (2002) and the Ph.D. degree in electrical engineering (2008) from the Eindhoven University of Technology, The Netherlands. From 2007 to 2013 he held various postdoctoral research positions, respectively at the COBRA Research Institute and the Laser Centre, Vrije Universiteit, The Netherlands, and the University of California at Santa Barbara, USA. He is currently an Associate Professor with the Department of Engineering, Aarhus University, Denmark, where he leads the Photonic Integrated Circuits Group. His research mainly focuses on the applications of photonic integration in microwave and terahertz photonics, sensors and energy-efficient interconnects.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Advanced VCSEL PIC manufacturing

VCSEL technology and manufacturing capabilities have advanced dramatically in the last several years with the adoption of high volume applications. The establishment of 6-inch GaAs VCSEL manufacturing processes has opened the door to new opportunities – and provided new challenges. This presentation will discuss VCSEL manufacturing advances that have allowed the industry to scale fabrication to meet these challenges and provide more capacity than ever before. We will also introduce new Photonic Quasi-Crystal (PQC) technology that will enable additional photonic component integration directly onto VCSEL wafers.  

Speaker

David Cheskis

IQE

David Cheskis serves as Vice President of Strategic at IQE, responsible for epitaxial products across all of IQE business units that are focused on addressing communications, connectivity and interactivity. Dr. Cheskis started the world’s first 6-inch GaAs VCSEL wafer foundry at ANADIGICS (subsequently acquired by II-VI Inc.) and is an expert in semiconductor, optoelectronics and communications technologies, products and markets.  Dr. Cheskis earned M.S. and Ph.D. degrees in Electrical Engineering from the University of California, San Diego. 

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

How Synopsys Is Driving the PIC Revolution with a Trusted and Scalable Design Flow

This presentation's abstract will be available shortly.

Speaker

Remco Stoffer

Synopsys

Remco Stoffer received his MSc degree in Applied Physics and PhD degree from the University of Twente, The Netherlands, in 1997 and 2001, respectively. He previously worked in the companies Kymata Netherlands, Alcatel Optronics Netherlands, and PhoeniX Software, and as a postdoc at the University of Twente. He is currently employed by Synopsys in the Netherlands, formerly as numerical engineer and currently as product owner of the OptoDesigner product suite. He has contributed as a developer to the OptoDesigner, FieldDesigner, FlowDesigner, and MaskEngineer software packages. Furthermore, he has contributed as work package leader or senior researcher to more than ten European or Dutch research projects, and has 20 journal papers and more than 30 conference contributions to his name.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Photonics and EDA – Round Hole and Square Pegs

IC designers & tool developers have lived in an orthogonal world for 60 + years. Hundreds  of thousands of man years have been invested developing EDA tools for IC design. This investment representing 100’s of millions of lines of code. Photonics and MEMS have  changed this.  For integrated photonics to take off, commercial EDA tools are needed that can implement and physically verify curved shapes. Throughout the design flow, support is needed for coexistence of both electrical and photonic designs. Layout automation is required to enable the expected growth in the size of photonics designs.

Speaker

Alan Sherman

Mentor, a Siemens Business

Alan Sherman is the Photonics Product Specialist for Mentor Graphics IC Design Systems division. He has over 20 years of EDA experience in custom IC design. Alan is located in Wilsonville, Oregon, United States.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Scalable PIC design: increasing yield of components, circuits and systems

Tremendous progress has been made in recent years in PIC design and manufacturing. Nonetheless, manufacturing variations and the inevitable impact on yield remains a significant challenge. Active tuning can sometimes be a solution, but the necessary system complexity and power budgets can be prohibitive. We discuss design methods to maximize yield that account for a knowledge of design variations from specific foundry processes. These methods include inverse design approaches at the component level to large scale statistical simulation of circuits using calibrated compact models.

Speaker

James Pond

Lumerical

Dr. James Pond is the CTO and co-founder of Lumerical Inc. and is a driving force behind the company’s core software algorithms, technology, and advanced photonic modeling capabilities. He has almost two decades of experience in optical and photonic simulation, and is the author of numerous papers, patents and conference presentations.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Open access integration platform: versatile solution for photonic integrated circuits

InP based photonic components have been around for some time and have proven to be a reliable source for communication systems. InP offers the possibility to monolithically integrate high performance active and passive components. These aspects, and the introduction of generic platforms: highly standardized industrial photonic integration processes that enable realization of a broad range of applications, will lead to a dramatic reduction of the development costs of PICs which will bring them within reach for many. This talk will address the integration platform from a foundry perspective: the integration technology, the opportunities and the scale-up to large volumes.

Speaker

Luc Augustin

Smart Photonics

Luc Augustin received the M.Sc. and Ph.D. degree in Electrical Engineering from Eindhoven University of Technology, The Netherlands. After his graduation, he went to industry, to work at Cedova, and Philips Research, and later in photovoltaics at Solland Solar. He has been active in the development, pilot production and optimization of innovative technologies. He is CTO at SMART Photonics.  

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Rethinking the photonics IC design flow to make high-quality PIC design easier, cheaper and faster

This presentation's abstract will be available shortly.

Speaker

Ronald Broeke

General Manager at BRIGHT Photonics

Ronald Broeke received his Ph.D. degree on photonics integrated circuits from Delft University of Technology, Netherlands. He continued his research at the University of California at Davis on applications like optical cdma and arbitrary waveform generation. After several years at ASML in project management he decided to combine his experiences and founded "PIC design house" Bright Photonics B.V.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

The Emergence of Non-Position Positioning in Fast Manufacturing Automation

Requirements have escalated for perfect relative positioning of manufactured components. Examples: In Silicon Photonics, orientation of components to extreme tolerances is needed in multiple test and assembly steps. In Smartphone camera manufacturing, more elements are assembled to tighter tolerances with each generation.   Previously this demanded exceptional dimensional control and fixturing, or painstaking positioning. But a new branch of intelligent control now provides fast, automatic, nanoscale-accurate orientation optimization in test and assembly. This improves process economics and yield by eliminating time-consuming steps and decoupling alignment from position metrology. The key is leveraging device optimization physics to reduce dependence on position commandability. A universal implementation is now commercially available and fab-proven. Process cost reductions of 99% are seen. 

Speaker

Scott Jordan

Physik Instrumente

Scott Jordan is Head of Photonics for PI. Scott is a manager and physicist by training, with an MBA in Finance and New Venture Management. He has driven multiple business development and turnaround endeavors. Scott’s patents for fast interfacing and DAC resolution enhancement helped advance nanopositioning performance more than a hundredfold, enabling capabilities for applications as diverse as nanopatterning, atomic force microscopy, MEMS, microlithography, x-ray interferometry and photonics. He developed the first digital gradient search, fundamental to photonics test and packaging, and established a successful business upon it. He has repeatedly driven the field forward as device designs have advanced. His most recent work enables one-step, global alignment optimization across multiple inputs, outputs and degrees of freedom of today’s Silicon Photonics devices. A confirmed technology evangelist, Scott publishes and presents frequently. He was named a PI Fellow in 2016.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Large scale assembly and packaging foundry for PICs

PHIX mission is to become world leader foundry in packaging and assembly of Photonic Integrated Circuits (PIC’s) by supplying PIC based components and modules in scalable production volumes. PHIX photonics assembly is a new initiative to facilitate our customers in the assembly of all packaging challenges for PICs including product design for manufacturing. The talk will highlight the roadmap from pilot line production towards HVM-production. Key is to have the right capabilities and capacities needed to serve our customers. Further, automated tools and machines are needed to address the future needs, this will also be discussed

Speaker

Albert Hasper

Phix

Albert Hasper, Ph.D. is the CEO of PHIX photonics assembly. Albert is an operational and technical executive with 25+ years of experience in international high-tech business-to-business industry. He was for 7 years the Managing Director of the Amtech Solar Companies. Before that he was the VP of Global Operations at ASM International. Prior to the VP role he served for more than 5 years as General Manager of ASM Europe and was world-wide responsible for the Vertical Furnace product line.  Albert holds a M.Sc. and Ph.D. Degree in Electrical Engineering from the University of Twente. He has authored and co-authored over 25 scientific papers in various scientific journals. He is an inventor of 13 issued US patents in the areas of CVD & ALD deposition and Capital Equipment. 

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Putting the A in Design Automation

Whether you’re designing a photonic IC prototype or ramping up a product, you need methodologies and tools to increase your design’s yield. In this talk, we will discuss methodologies for building high quality device models, running device and circuit level variability analysis and turning these into real tape-outs. We will show how Luceda puts the Automation in E(P)DA to enable fundamentally different workflows.

Speaker

Pieter Dumon

Luceda Photonics

Pieter obtained a PhD in electronics engineering from Ghent University in 2007, with a dissertation on optical filters in silicon photonics technology. During his PhD research, he contributed to the development of the IPKISS software. Already during his PhD he started supporting tape-ins on Imec silicon photonics technology for external customers. From 2007 to 2014, Pieter coordinated ePIXfab, the European consortium for the advancement of silicon photonics. He marketed the services presence at events around the world. He coordinated the Multi Project Wafer runs at Imec, supporting numerous world-wide designers and tape-outs, and contributed to the Imec silicon photonics platform R&D. He left Ghent University-Imec in 2014 for co-founding Luceda on the basis of years of software development and research in photonics.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Hybrid PICs - Technology Alternatives and Design Implications

Hybrid integrated photonics attracts growing attention, as it enables complete and cost-efficient optical chip solutions for silicon, silicon nitride, and polymer photonics in combination with III-V active optoelectronic devices. We present different practical examples of hybrid PICs, discuss associated design challenges and our approaches to their solution. We illustrate a smoothly elaborated common design workflow, which is based on standard simulation compact models and a layout-aware design approach. We demonstrate user-friendly optoelectronic circuit simulation, optimization and analysis, as well as performance verification on system-level. 

Speaker

André Richter

VPIphotonics

Dr. André Richter is an expert in the field of optical communications and related modeling and design aspects. He holds a M.Sc. degree from Georgia Tech and a Ph.D. from TU Berlin. Being member of the VPIphotonics team since 1997, André contributed numerous fundamental modeling advances in various fields. For many years he led product management, technical services and R&D activities. André serves as General Manager of VPIphotonics since 2013.

PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Developments in PIXAPP – the photonic packaging pilot line

Speaker

Peter O'Brien

Tyndall

Dr. Peter O’Brien obtained his PhD in Physics from University College Cork in 1999. He has a Masters in Electronic Engineering and Degree in Physics from Trinity College Dublin. He was a postdoctoral scholar at the California Institute of Technology and research scientist at NASA’s Jet Propulsion Laboratory in Pasadena (Micro Devices Laboratory) where he worked on the development of millimetre wave devices for remote sensing applications. Dr O’Brien co-founded one (Biosensia) and founded a second company (Epi-Light). His second company, Epi-Light limited, developed speciality photonic systems for medical device and pharmaceutical applications. He successfully sold the company in 2009 and returned to the Tyndall National Institute to establish a research activity in advanced photonic packaging. Dr O’Brien is now head of the Photonics Packaging Group and is involved in a wide range of both academic and industry research projects, across the telecoms and medical device sectors. Dr. O’Brien is also deputy director of the Science Foundation Ireland, Irish Photonic Integration Centre

PICs Beyond 100G − Evolution and Revolution

Presentation

The critical role that EC support for photonics and PIC devices plays in our manufacturing future.

Recognising the importance of photonics and PICs, the EU’s ICT research programme has worked with the photonics industry and research community to run a series of actions to build up a technology base in Europe, particularly in PIC manufacturing. This presentation will review these actions, consider the lessons learned, and look to further opportunities for support and the next research programme beyond 2020: Horizon Europe.

Speaker

John Magan

European Commission Photonics Unit

John Magan received a Ph.D. in laser physics from Trinity College Dublin in 1989. After working for Hoechst AG in Germany from 1989 to 1992, where he was responsible for setting up an industrial laser lab, he joined the European Commission where he has worked in research funding in the Community’s Information and Communication Technologies programmes. He is currently deputy head of the photonics unit. 

PICs Beyond 100G − Evolution and Revolution

Presentation

Driving the PIC Revolution, Case Scenarios

Synopsys is driving the photonic integrated circuit (PIC) revolution with design automation solutions for a wide range of application requirements, from data communications to sensors and biomedical devices. Synopsys’ PIC Design Suite – which includes the OptSim Circuit and OptoDesigner tools – offers a seamless PIC design flow from concept to manufacturable design, as well as access to a single, world-class support channel.

Speaker

Twan Korthorst

Synopsys

Twan Korthorst is Director of Photonic Solutions for Synopsys. He has been active in the field of chip design and fabrication for non-traditional semiconductor micro and nano technologies for almost 25 years. He joined the PhoeniX Software team in 2007 and developed the company into a leading supplier of design solutions for photonic ICs in his role as CEO. In February 2018, Synopsys acquired PhoeniX Software, bringing together all the required software tools for PIC design and manufacture within one single organization and one single support channel. He will continue to lead the team in Enschede (The Netherlands) and advocate for photonic integration technologies around the world.

PICs Beyond 100G − Evolution and Revolution

Presentation

The benefits of low-barrier access to new production services for PICs today and tomorrow

The requirement for new technologies able to support faster, more efficient and less consuming devices has triggered the adoption of Photonic Integrated Circuits (PICs) for many different applications. The Pilot Lines in Photonics provide a fast service for prototyping and low-volume production of Photonic Integrated Circuits (PIC)-based products helping companies to reduce the time-to-market. The Pilot Lines, PIXAPP – for packaging and assembly PICs, MIRPHAB – for developing QCLs based chemical sensors, and PIX4LIFE – Si3N4 PICs for life sciences cover a wide range of applications from telecom to healthcare, including environmental monitoring and industrial sensing.

Speaker

Jose Pozo

EPIC

Dr. Jose Pozo is Director of Technology and Innovation at EPIC (European Photonics Industry Consortium). As EPIC’s CTO, he represents 385 leading corporate members active in the field of Photonics. His job consists on actively engaging with them and provide them with tools to strengthen their position in the supply chain. He has 20 years’ background in photonics technology, market knowledge, and a large network within the industrial and academic photonics landscape. Dr. Pozo holds a Ph.D. in electrical engineering from the University of Bristol, U.K., and a M.Sc. and B.Eng. in telecom engineering from Spain/Belgium.

PICs Beyond 100G − Evolution and Revolution

Presentation

Photonic Integration Opportunities for Next-Generation Coherent High-Capacity Systems

Next-generation high-capacity optical coherent transmission systems at 400G and above will demand different set of requirements depending on the target applications. Long haul and ultra-long haul systems such as submarine and inter-continental links will have to be optimized for fiber capacity and reach. Shorter-reach applications such as metro, DCI and 5G access links will need low power and high density pluggable modules. From an optical components perspective, the right combination of photonic integration technologies will be mandatory to address all the stringent requirements related to bandwidth, size, power and cost. In this presentation, we will review the opportunities associated with InP and Silicon Photonics optical material platforms and photonic packaging technologies to address the challenges of next-generation high-capacity optical coherent transmission systems.

Speaker

Martin Guy

Chief Technology Officer & Strategic Marketing at Ciena Corporation

From 1996 to 2000, Mr. Guy worked at INO (Institut National d’Optique) as Head of Technology for the Optical Communications Group. In April 2000, he co-founded TeraXion and acted as V-P Product Management and CTO of the company. Since 2016, he is Senior Director at Ciena and leads the activities related to the developments of high-speed photonic integrated components. Mr. Guy holds a Ph.D. degree in Electrical Engineering from Université Laval in Québec City and has worked in the field of photonics for more than 25 years.

PICs Beyond 100G − Evolution and Revolution

Presentation

3D laser written glass components for advanced photonic integration

The persistent drive for increased bandwidth and density while simultaneously reducing cost in datacenter optical communication systems is placing substantial pressures on component manufacturers to increase the level of integration and adopt more efficient and lower cost assembly processes.

Ultrafast lasers offer a unique tool for the integration of photonic components in this application. The talk will show how this can be used for manufacturing glass-based interconnect components, which are applied to both fiber-fiber and fiber-transceiver applications. The talk will show how these components can be used as optical interfaces or further combined with conventional processes to help solve challenges in the packaging of photonic components. In addition to this the talk will also show how these components can be used as integration platforms for optical sub-assemblies and photonic-electronic interposers.

Speaker

Nick Psaila

Optoscribe

Nick Psaila is co-founder and CEO of Optoscribe Ltd. He is an expert in the manufacturing and use of photonic technologies in optical communications, with a particular focus on laser based manufacturing techniques. He is responsible for both strategic and technical facets of the business and has led the company from its formation. Nick has a PhD in Photonics from Heriot Watt University, an MSc in Photonics and Optoelectronic Devices from St Andrews University and BSc in Physics from Imperial College London. In 2010, he was awarded an Enterprise Fellowship from the Royal Society of Edinburgh. He has co-authored more than 60 publications and several patents in the field of laser based manufacturing. 

PICs Beyond 100G − Evolution and Revolution

Presentation

Integrated Silicon Photonics for future Datacenter Applications

The rapid growth in data center traffic is driving accelerating requirement to the bandwidth and performance of networking equipment, including optical interfaces and Ethernet switches. Looking ahead, bandwidth scalability challenges are looming in terms of density, cost, and power; challenges that require tighter integration of optics and networking silicon. We will review motivation for integration and the enabling technology elements, and discuss how co-packaged Silicon Photonics enables higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance.

Speaker

Thomas Liljeberg

Intel

Thomas Liljeberg is Sr. Director of Product Line Management in the Silicon Photonics Products Division at Intel Corporation, where he is responsible for the photonic integration programs and products. From 2004 to 2015, he was at Source Photonics serving in various roles of increasing scope and responsibility in Product Management and R&D, most recently as Executive VP of Product Line Management. Prior to Source Photonics, Thomas Liljeberg was with Agility Communications from 2000 to 2004. He holds a Ph.D. degree in Electrical Engineering from University of California, Santa Barbara, and a M.S. from Technical University of Denmark 

PIC ROI − Show Me the Money

Presentation

Coherent DWDM router interfaces: Opportunities for photonic integration

Small form factor 400G digital coherent optical (DCO) modules are the most exiting technology development in DWDM transport since the introduction of coherent detection a decade ago. In this talk, we will focus on this new class of pluggable DCO modules from a system vendor perspective and discuss the different applications that they are expected to address. In particular, we will detail the advantages and challenges involved in using pluggable DCO modules in dense routing and switching platforms. Finally, we will consider how further optical integration and DSP development can enable an even broader use of pluggable DCO modules. 

Speaker

Dirk Van Den Borne

Juniper

Dirk van den Borne is a director of architecture at Juniper Networks. He advises operators worldwide on their network evolution strategy, with a focus on building the next-generation of IP-optical networks. He specializes in the convergence of IP/MPLS and transport technologies, and how developments in optical integration, network timing and SDN control are shaping network architectures. Dirk obtained his Ph.D. in optical communications from the Eindhoven University of Technology. He has spoken frequently at major industry events, authored and co-authored over 100 peer-reviewed journal and conference contributions and holds several patents on optical communication. He is based in Munich, Germany.

PIC ROI − Show Me the Money

Presentation

Assessing the long-term growth and market potential for PIC devices in datacom, transport and networks

Historically, growth of optical markets was sinusoidal; periods of sharp contraction followed times of booming expansion in a repeating pattern. While the past was not for the faint of heart, recent performance shows that the optical market has gotten far less volatile, with a strong upward growth trajectory. This presentation will explore the shift in drivers for optical market growth and the trends for the future. It will also address the advantages and disadvantages of Photonic Integrated Circuits (PIC), their most likely applications and the use of compound semiconductor technologies in PICs, as well as the broader optical market.

Speaker

Eric Higham

Strategy Analytics

As Director for the GaAs & Compound Semiconductor Technologies Service, Eric Higham provides analysis of the dynamics and trends for processes, technologies and components in wired and wireless communications markets. His areas of research include 3G and emerging 4G wireless networks, fiber optic networks, CATV, millimeter wave communications, broadband, military radar, EW and communications applications. Prior to joining Strategy Analytics, Eric worked in a variety of engineering, business development and marketing roles for Raytheon, Micro-Dynamics and M/A-COM. In these positions, he participated in the emergence and growth of the commercial wireless industry. Eric was most recently President and founder of Spectrum Business Development, where he developed market and product research for a variety of market applications. After over three decades in the semiconductor field, he brings a deep understanding of the technical and market trends in the GaAs and compound semiconductor sector. Eric holds an MSEE degree from Northeastern University in Boston, MA and a BSEE degree from Cornell University in Ithaca, NY.

Panel Session

Will PICs be the engine of growth over the next decade? Is the growth supported in our roadmaps world-wide?

The increasing demand for higher speed data transmission has ramifications across all network operations. Mobile operators expect 5G to meet customer demands with data rates up to 1 G/bps. The demands for fiber networks – the backbone of high capacity data conveyance – are far greater. As PICs move into 100G data center slots, the push for ever-faster, higher bandwidth intra- and inter-center communications continues. At the same time, photonic integrated circuits are relatively new technology, with automated TAP far behind state-of-the-art microelectronics manufacturing. Can PICs support advanced datacom and long-distance telecom applications as reflected in our global technology roadmaps?

Speakers

Martin Schell

Fraunhofer HHI

Michael Lebby

Lightwave Logic

Michael Liehr

American Institute for Manufacturing Photonics

Werner Steinhögl

European Commission Photonics Unit

Takahiro Nakamura

PETRA

Wyn Meredith

IQE

Marco Romagnoli

INPHOTEC

PICs Reimagined − Hybrids and Materials Innovation

Presentation

Additive manufacturing by two-photon-polymerization for photonic integration

Two-photon-polymerization can be used for the direct printing of complex micro- and mesoscale 3D parts. These parts can be transparent, have optical-quality surfaces, and be printed on pre-structured surfaces such as PICs. Each part can be printed with parameters optimized for the individual assembly it is printed on. Thus, this technology offers an interesting way to integrate components from different sources.

Speaker

Jochen Zimmer

Nanoscribe

Dr. Jochen Zimmer finished his doctorate on the subject of superconducting nanostructures at Karlsruhe Institute of Technology in 2013. Since then, he worked in the 3D printing industry (INDMATEC GmbH, Stratasys GmbH/MakerBot Division) and is with Nanoscribe GmbH since 2017.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

Vertical integration in SiN based foundry enables new applications

The integration of Photonic Integrated Circuits (PICs) in functional modules enables endusers to use PICs in a variety of applications. Due to the hybrid integration of multiple platforms in a single module a variety of new applications can be addressed. For the silicon nitride based TriPleX platform these range from 5G to virtual reality and sensing. The main benefit is in the low loss properties over a large wavelength range enabling these different applications. In this talk we will show the capabilities of these modules and the necessity for vertical integration. It is all about module functionality and not about PICs.

Speaker

Paul van Dijk

LioniX International

Paul van Dijk Ph.D. MBM (Vice President Strategy and Innovation) co-founded and started as CEO of SATRAX in 2010, targeting development of integrated microwave photonics applications and products. Before joining SATRAX, he worked 11 years at ASML, Veldhoven, The Netherlands, where he was responsible for new business development and product marketing at the business unit Special Applications, targeting the MEMS, compound semiconductor and photonics applications market. He holds an engineering degree and a Ph.D. in Physics from the Technical University Eindhoven (1997), a Master of Business Marketing (MBM) from TIAS Nimbas School (2002) and is co-author more than 46 scientific and peer-reviewed articles of and holder of 6 patents.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

Industrial Scale High Precision 3D Printing for in situ packaging

High precision 3D printing (HP3DP) is a powerful tool for rapid prototyping of miniaturized designs in automated, scalable processes, providing a real 3D technique suitable for the fabrication of optically high quality surfaces with industrial scale throughput, highest resolution, and a unique degree of freedom of structure generation. Most of the legacy processes nowadays needed for complex structure fabrication can be simply avoided, enabling a significant reduction of resources, of production cost and time to market. The usefulness of HP3DP to be implemented in industrial work flows will be demonstrated by discussing different application scenarios, ranging from LED to laser die packaging, microoptical elements and arrays for rapid prototyping of novel designs up to the manufacturing level. 

Speaker

Ruth Houbertz

Multiphoton Optics

Physicist, SPIE Fellow, Senator of Economy, Multiphoton Optics GmbH founder, CEO & Managing Director since 2014, in 2013 CTO. From 2000-2012, she worked at Fraunhofer ISC in different technical & management positions. Worked at Sandia Nat.’l Labs in Livermore (USA). Solid background in materials development, processing, technologies, analyses, hardware, and software, products. Invented more than 100 patents, evaluator and referee for (inter-)national ministries, journals, etc. Best of Industry Award 2018, Finalist in the Prism Award 2015 and 2017, Cowin Award of Entrepreneurship 2014, Green Photonics Award 2013, Fraunhofer Award in 2007 in the fields of green technology, optical interconnects, among others. Active member in SPIE, EPIC, OSA, IEEE, VDI, Bayern Photonics, Session Chair in Optical Interconnects and Emerging Technologies at SPIE Photonics West, participation in Industrial and Women in Optics Panels, Keynote and invited speaker, inventor.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

New advances in Silicon Nitride (siN) PIC Applications

Silicon nitride photonic integrated circuits offer new possibilities for existing and emerging applications. Application such as Beamforming, Augmented Reality, Quantum and nonlinear integrated photonics and Bio-sensing benefit from a transparency window from the visible to the Mid-Infrared and the ultra-low losses in those wavelength ranges.

LIGENTEC's fabrication process is based on the all-nitride-core technology and designed from the bottom up for photonics and modularity. In the all-nitride-core, most of the optical mode energy is in the waveguide material, which reduces loss and makes small bending radii possible. Latest developments on further integration of active elements and modules are presented.

Speaker

Michael Geiselmann

Co-Founder at LIGENTEC

Michael Geiselmann studied physics and engineering at University Stuttgart and Ecole Centrale Paris. After his PhD at the Institute of Photonic Sciences (ICFO) in Barcelona in 2014 he joined the laboratory of Prof. Kippenberg at EPFL, where he advanced frequency comb generation on integrated silicon nitride chips towards applications and was involved in several international research projects. In 2016, he co-founded LIGENTEC. At LIGENTEC he is advancing the technology development of silicon nitride based integrated circuits and is looking for new business opportunities. He is responsible for technical sales and brought LIGENTEC to the ESA Business Incubator Switzerland program and several other European and transatlantic projects.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

Optical passive device platform to enhance photonics performances

One optical component integration challenge is to bring together active and passive functions with very different technical constraints. Compromise is often hard to come on single technology platform making multi-platform solutions attractive.  The glass platform is a solution of choice to make the optical link between source and fiber by integrating low-loss, temperature-stable passive interface solutions. Teem photonics, expert in ion exchange technology on glass ( IoNext ) , is developing an innovative solution providing a unique low-loss collective coupling technology integrating passive functions (taps, splitter, multiplexer, ... ), compatible with most of active photonic integration platforms (SiPh, PIC, SiN ...)  

Speaker

Arnaud Rigny

Teem Photonics

Arnaud Rigny is responsible of the sales and business development activities for Teem Photonics. He has more than 20 years of experience in the fields of photonics and semiconductor. After a 10-year experience in research and development at Corning then in product line management at Alcatel Optronics, he joined Soitec as a manager of research and development projects before taking on commercial responsibilities in 2007. He graduated from the Télécom ParisTech engineering school and has a doctorate in optoelectronics from Télécom ParisTech.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

Silicon photonics - integration of materials, devices and ecosystem

Silicon has proved itself to be an attractive platform for integrated photonics; Silicon also proved itself still miles away to completely demonstrate its technical and commercial potentials. This talk will review our most recent technical advance in material and device innovation for versatile applications. I will also attempt to discuss our vision to a scalable and sustainable ecosystem which will facilitate silicon photonics to eventually become a volume business. 

Speaker

Di Liang

Research Scientist at Hewlett Packard Enterprise

Dr. Di Liang is a senior research scientist/manager at Hewlett Packard Labs in Hewlett Packard Enterprise (HPE). He leads the advanced R&D in silicon-based integrated photonics for HPE's server and high-performance computing business. He is current a principal investigator for two large US government funded R&D programs with a combined total of 17+ million USD. Prior to joining HP Labs in 2009, he was a core member in the early stage development of the hybrid III-V-on-silicon platform in Prof. John Bowers’ group at UC-Santa Barbara. He has authored and coauthored over 155 journal and conference papers (over 4000 citations), five book chapters, and was granted by 18 patents with another 45+ pending.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

III-V Lasers directly grown on Silicon

To support an energy-efficient optical interconnect technology enabled by silicon photonics, development of low-power-consumption active devices and associated integration technologies is needed. Most communication wavelength lasers with excellent device performance have been grown on III-V substrates and bonded to silicon. For monolithic integration, growth and fabrication of such lasers on III-V/ Si compliant substrates is another option. QDs grown on compliant III-V/Si substrates and laser characteristics of whispering-gallery-mode (WGM) micro-lasers, and conventional Fabry Perot lasers will be discussed. Another approach involves nano-ridge lasers with embedded quantum wells grown on stripe patterned on-axis Si substrates or SOI. Room temperature lasing inside nano-cavities at telecom bands is challenging and has only been demonstrated up to the E band. We have achieved InP/InGaAs nano-ridge lasers resulting in emission wavelengths ranging from the O-, E-, S- to C-band operating at room temperature with ultra-low lasing thresholds. These energy-efficient micro-lasers are excellent candidates for on-chip integration with silicon photonics.

Speaker

Kei May Lau

Hong Kong University of Science & Technology

Professor Kei May Lau is the Fang Professor of Engineering at the Hong Kong University of Science and Technology (HKUST). She received the B.S. and M.S. degrees in physics from the University of Minnesota, Minneapolis, and the Ph.D. degree in Electrical Engineering from Rice University, Houston, Texas. She was on the ECE faculty at the University of Massachusetts/Amherst and initiated MOCVD, compound semiconductor materials and devices programs. Since the fall of 2000, she has been with the ECE Department at HKUST. She established the Photonics Technology Center for R&D effort in III-V materials, optoelectronic, high power, and high-speed devices. Professor Lau is a Fellow of the IEEE (2001), a recipient of the US National Science Foundation (NSF) Faculty Awards for Women (FAW) Scientists and Engineers (1991), Croucher Senior Research Fellowship (2008), and the IEEE Photonics Society Aron Kressel Award (2017). She is an Editor of the IEEE EDL and former Associate Editor of IEEE TED, Applied Physics Letters and Journal of Crystal Growth.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

Polymer PIC opportunities in Applications Beyond 100G

This presentation's abstract will be available shortly.

Speaker

Michael Lebby

Lightwave Logic

Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.

PICs Reimagined − Hybrids and Materials Innovation

Presentation

The application of silicon photonics to optical switches with low-loss, polarization insensitive, low cross-talk capabilities

The evolution of information society definitely requires various optical functional devices for telecom, datacom, and sensing. Photonic integrated circuits for optical transceivers provided by silicon photonics is now being established to the product level. Expanding the application of silicon photonics to other functional devices such as optical switches is highly expected. Considering typically smaller product volume of such functional devices, design for obtaining necessary function while minimizing additional special process in fabrication is important. We have been developing optical switches based on silicon photonics. I will talk about design, fabrication, and evaluation results on the optical switch module including silicon optical circuits and optical coupling structure to fiber array for low loss, polarization insensitive, low cross-talk properties.

Speaker

Shigeru Nakamura

NEC Corporation

Shigeru Nakamura is a principal researcher of Data Science Res. Labs., NEC Corporation. He received the B. S. and M. S. degrees in physics from the University of Tokyo, Tokyo, Japan, in 1988 and 1990, respectively. In 1990, he joined NEC Corporation, Tsukuba, Japan, and has been engaged in the research and development of ultrafast all-optical devices and sub-systems, silicon photonics devices and sub-systems, and optical sensing.