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08:00
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Registration and welcome refreshments.
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08:50
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Housekeeping by Conference Chair
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Refining and streamlining PIC production
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09:00
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The value of the fab in the PIC industry
Presented by Eric Higham - Strategy Analytics
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09:20
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Fully integrating lasers, modulators, and photodetectors with standard silicon photonic fabrication
Presented by Sylvie Menezo - Scintil Photonics
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09:40
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The role of PICs in the data communication roadmap
Presented by Jim Theodoras - HG Genuine
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10:00
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Wafer-level Nanoimprint Technology for Innovative Packaging of Photonic Integrated Circuits
Presented by Andrea Kneidinger - EV Group
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10:20
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Perspectives on the future of Silicon Photonics
Presented by Eric Mounier - Yole Développement
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10:40
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Morning Break - Sponsored by Synopsys
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11:10
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Seamless PIC testing capability: moving from lab to production
Presented by François Couny - EXFO
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11:30
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Edge coupled electro-optical PIC testing on wafer level
Presented by Moritz Seyfried - ficonTEC
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11:50
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Integrating chip design and simulation environment for photonic integrated circuits
Presented by Cem Bonfil - Optiwave
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12:10
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Interoperable Software Tools for the Photonic Design Workflow
Presented by André Richter - VPIphotonics
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12:30
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Lunch Break - Sponsored by Synopsys
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13:45
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Photonics Design IP: Challenges & Opportunities
Presented by Martin Fiers - Luceda Photonics
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14:05
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Yield improvement techniques in the manufacturing of AWG (cascade) PLC
Presented by Henk Bulthuis - Broadex Technologies
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14:25
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State-of-the-Art Electronic-Photonic Design Automation
Presented by Xu Wang - Ansys
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14:45
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Photonics Design IP: Challenges & Opportunities
Presented by Martin Fiers - Luceda Photonics
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Optimising the architecture
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15:05
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Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer
Presented by Suresh Venkatesan - POET Technologies
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15:25
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Advancing SOI technology for datacentre transceivers and sensing applications
Presented by Corrado Sciancalepore - Soitec
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15:45
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Afternoon Break - Sponsored by Synopsys
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16:15
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Targeting emerging markets with the CORNERSTONE platform
Presented by Graham Reed - Cornerstone, University of Southampton, and Lia Li - Zero Point Motion
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16:35
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Improving optical coupling in PIC and Hybrid Photonic Packaging with Aligned Two-Photon Lithography
Presented by Joerg Smolenski - Nanoscribe
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16:55
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Low Loss Photonic Integrated Circuits: Every Photon Counts
Presented by Michael Geiselmann - Ligentec
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17:15
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Enabling lower power consumption optical networking using high speed, low power polymer modulators
Presented by Michael Lebby - Lightwave Logic Inc
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17:35
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TBA
Presented by Name to be advised - Ayarlabs
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17:55
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Ramping production capacity of low-loss lithium niobate on insulator PICs for electro-optic and nonlinear applications
Presented by Amir H. Ghadimi - CSEM
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18:20
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Networking Drinks / Dinner Reception sponsored by Synopsys
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