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08:00
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Registration and welcome refreshments.
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08:50
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Housekeeping by Michael Lebby and David Cheskis
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PICs Today − Datacom, Sensing & LiDAR
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09:00
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PANEL SESSION
PICs for LIDAR
ommatidia lidar, EPIC, Ibeo Automotive Systems GmbH, Freedom Photonics, and Rockley Photonics
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09:30
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Sensors and Systems for Next Generation 3D Imaging & LiDAR Applications
Presented by Wade Appelman - ON Semiconductor
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09:45
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Silicon Photonics, beyond the tipping point!
Presented by Eric Mounier - Yole Développement
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10:00
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Presentation Title to be Confirmed
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10:15
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Novel electro-optical substrate enabling cost effective PIC assembly solutions for sensor and communication applications
Presented by Tobias Lamprecht - Vario-optics
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10:30
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PICs for data-center interconnects
Presented by Benjamin Wohlfeil - ADVA Optical Networking
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10:45
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Integrated 4D Machine Vision
Presented by Mehdi Asghari - SiLC
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11:00
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Morning Break - Sponsored by Hewlett Packard Enterprise
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11:30
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Hybrid Photonic Integration for Sensing and Communications
Presented by Martin Schell - Fraunhofer HHI
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11:45
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Automotive, LiDAR & MedTech – Providing access & experiences gained
Presented by Ignazio Piacentini - ficonTEC
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12:00
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From Prototypes to Production: Compact packaging of miniaturized light sources
Presented by Ruth Houbertz - Multiphoton Optics
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12:15
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Silicon Photonics for automotive LIDAR applications
Presented by Robert Blum - Intel
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12:30
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An overview of a variety of cutting edge PICs for sensing applications
Presented by Paul Leisher - Freedom Photonics
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12:45
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Lunch Break - Sponsored by Hewlett Packard Enterprise
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14:00
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Plasmonics in CMOS foundries: a new toolkit for PICs
Presented by Nikos Pleros - Aristotle University of Thessaloniki
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14:15
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Presentation Title to be Confirmed - Synopsys
Presented by Twan Korthorst - Synopsys
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PIC Manufacturing − TAP, Co-Packaging & Fab
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14:30
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Si-Based Photonic platform at CEA – Leti
Presented by Sergio Nicoletti - CEA-Leti
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14:45
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SiN goes thick enabling PIC applications
Presented by Michael Geiselmann - LIGENTEC
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15:00
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Silicon nitride based TriPleX™ modules with hybrid PIC integration
Presented by Arne Leinse - LioniX International
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15:15
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CORNERSTONE – The scalable rapid prototyping platform
Presented by Graham Reed - Cornerstone, University of Southampton
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15:30
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Scaling up photonic integration: validating designs, chips and assemblies
Presented by Iñigo Artundo - VLC Photonics
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15:45
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Spectral characterization: challenges, solutions and the future of PIC optical testing
Presented by François Couny - EXFO
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16:00
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Two Paths to Economic Packaging & Test
Presented by Scott Jordan - Physik Instrumente
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16:15
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PANEL SESSION
Does volume drive photonics integration?
Bill Ring, EFFECT Photonics, Yole Développement, AEPONYX inc, Luxtera, and Intel
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17:05
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Networking Drinks Reception
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