Monday 8th November 2021 starting at 14:00 BST

14:00 PIC Pilot Lines Conference (Click to view) 18:30 Pre-event Networking reception supported by IQE and EPIC. This is open to all delegates, speakers and sponsors of the PIC Pilot Lines, CS International, PIC International and Sensors International conference. Nibbles, drinks and refreshments will be provided.

Tuesday 9th November 2021 starting at 08:00 BST

08:00 Registration and welcome refreshments. 08:50 Housekeeping by Michael Lebby and David Cheskis PICs Today − Datacom, Sensing & LiDAR 09:00 PANEL SESSION PICs for LIDAR ommatidia lidar, EPIC, Ibeo Automotive Systems GmbH, and Freedom Photonics 09:30 Simplifying the LiDAR User Experience with SiPM Evaluation Kits and Reference Designs Presented by Bahman Hadji - ON Semiconductor 09:45 Beyond communication, silicon photonics is penetrating consumer and automotive Presented by Eric Mounier - Yole Développement 10:00 Presentation Title to be Confirmed 10:15 Novel electro-optical substrate enabling cost effective PIC assembly solutions for sensor and communication applications Presented by Nikolaus Floery - Vario-optics 10:30 PICs for data-center interconnects Presented by Benjamin Wohlfeil - ADVA Optical Networking 10:45 Integrated 4D Machine Vision Presented by Mehdi Asghari - SiLC 11:00 Morning Break - Sponsored by Hewlett Packard Enterprise 11:30 Hybrid Photonic Integration for Sensing and Communications Presented by Martin Schell - Fraunhofer HHI 11:45 Automotive, LiDAR & MedTech – Providing access & experiences gained Presented by Moritz Seyfried - ficonTEC 12:00 Presentation Title to be Confirmed 12:15 Silicon Photonics for automotive LIDAR applications Presented by Robert Blum - Intel 12:30 An overview of a variety of cutting edge PICs for sensing applications Presented by Paul Leisher - Freedom Photonics 12:45 Lunch Break - Sponsored by Hewlett Packard Enterprise 14:00 Plasmonics in CMOS foundries: a new toolkit for PICs Presented by Nikos Pleros - Aristotle University of Thessaloniki 14:15 Unified E/O co-design for Datacom, Sensing & LiDAR Presented by Twan Korthorst - Synopsys 14:30 Integrated Photonics for quantum applications: Si & SiN photonics Presented by Christian Haffner - Imec PIC Manufacturing − TAP, Co-Packaging & Fab 14:45 Si-Based Photonic platform at CEA – Leti Presented by Sergio Nicoletti - CEA-Leti 15:00 Low loss PICs: from fast prototyping to high volumes! Presented by Michael Geiselmann - LIGENTEC 15:15 Silicon nitride based TriPleX™ modules with hybrid PIC integration Presented by Arne Leinse - LioniX International 15:30 CORNERSTONE – The scalable rapid prototyping platform Presented by Graham Reed - Cornerstone, University of Southampton 15:45 Scaling up photonic integration: validating designs, chips and assemblies Presented by Iñigo Artundo - VLC Photonics 16:00 Spectral characterization: challenges, solutions and the future of PIC optical testing Presented by François Couny - EXFO 16:15 Indium Phosphide light sources for Silicon Photonics Integrated Circuits Presented by Andrew McKee - Sivers Photonics 16:30 PANEL SESSION Does volume drive photonics integration? Bill Ring, EFFECT Photonics, Yole Développement, AEPONYX inc, Luxtera, and Intel 17:00 New Photonics Applications, New Challenges, Old Patterns Presented by Scott Jordan - Physik Instrumente 17:15 The new positioning stage for multi-fiber micro-alignment Presented by Simone Cardarelli - MicroAlign 17:30 PIC Industry Awards 2020 17:50 Networking Drinks / Dinner Reception

Wednesday 10th November 2021 starting at 08:00 BST

08:00 Registration and welcome refreshments. 08:50 Housekeeping by Michael Lebby and David Cheskis PIC Technology − Solutions, Analysis & Research 09:00 Cost-effective high-power laser-on-silicon technology for LiDAR applications Presented by Dongjae Shin - Samsung 09:15 Photonics Then & Now; Why Now But Not Then? Presented by David Banas - Luminous Computing 09:30 Additive microfabrication for optical packaging Presented by Jochen Zimmer - Nanoscribe 09:45 Design, modeling and simulation for the imperfections of real life Presented by Greg Baethge - Lumerical 10:00 Morning Break - Sponsored by Hewlett Packard Enterprise 10:30 Coherent vs. Direct-Detection: Market Forces Shaping PIC Technology Beyond 400 G Presented by Vipul Bhatt - II-VI 10:45 Coping with the diversity of technologies and applications in CAD environments Presented by André Richter - VPIphotonics 11:00 OptiSPICE Plugin: A SPICE Native Optical Model Library for Opto-Electronic Design Automation Presented by Cem Bonfil - Optiwave PICs Vision − Evolution and Revolution 11:15 AIM's role in developing next-gen PICs and TAP manufacturing expertise Presented by Frank Tolic - AIM Photonics 11:30 Accelerating the integrated photonics industry, the Dutch way Presented by Erik van Oorschot - PhotonDelta 11:45 Elenion Technologies - Presentation Title TBC Presented by Michael Hochberg - Elenion Technologies 12:00 Lunch Break - Sponsored by Hewlett Packard Enterprise 13:15 Presentation Title to be Confirmed 13:30 Integrated photonics for neuromorphic computing Presented by Bert Offrein - IBM 13:45 Optical transceiver manufacturing in the electronics ecosystem – lessons learned and the road ahead Presented by Ted Schmidt - Juniper Networks 14:00 Increasing power efficiency with Electro-optic (EO) Polymers Presented by Michael Lebby - Lightwave Logic Inc 14:15 Afternoon Break - Sponsored by Hewlett Packard Enterprise PIC ROI − Quality Metrics & Scalability 14:30 Invest in your design flow Presented by Martin Fiers - Luceda Photonics 14:45 Presentation Title to be Confirmed - Smart Photonics Presented by Luc Augustin - Smart Photonics 15:00 Future and economics of PICs and PLCs in PON systems for data centre and mobile backhaul applications Presented by Henk Bulthuis - Broadex Technologies 15:15 Assessing the long-term growth and market potential for PICs in datacom, transport and networks Presented by Eric Higham - Strategy Analytics 15:30 Closing Remarks