Building Scalable, Energy-Efficient TFLN PICs Through Industrial-Grade Manufacturing

Next-generation data networks require PICs that combine speed, energy efficiency and scalable manufacturability. This presentation shows how advances in thin-film lithium niobate processes are moving TFLN PIC manufacturing toward greater reliability and reproducibility. We illustrate how design choices gain real impact only when supported by stable, scalable fabrication delivering low-power, high-density interconnects.