Abdeslem Ben Hamida
Global Sales Manager
Vanguard Automation
Abdeslem Ben Hamida is a Ph.D.-qualified senior sales and business development executive with over 20 years of experience in semiconductors, photonics, lasers, and high-tech industries. He specializes in photonics packaging, GaN lasers, industrial sensors, and optoelectronics, driving market penetration and revenue growth across Europe, the Middle East, Africa, and beyond. Recent roles include Senior European Business Development & Sales Manager at Ficontec and KYOCERA SLD Laser (focused on white and blue lasers for automotive applications). He currently serves as Global Sales Manager at Vanguard Automation GmbH. Founded LED Innovation Consulting (2012–2020), advising high-tech firms such as Ficontec, Linxens, and Soraa on sales growth and market entry strategies. Delivered multimillion-euro sales pipelines at Ficontec, Optoga, Soraa, Xicato, Hyundai LED, and GE Lighting, securing strategic clients and fostering long-term partnerships. Began his career at Applied Materials and Alchimer, focusing on microelectronics and MEMS innovation, contributing to several patents. Expert in automotive lighting, medical lasers, hydrogen sensors, and photonics-related applications. Consistently achieved exceptional sales performance—such as 60% growth at Soraa—through strategic planning, client acquisition, and product optimization.
Presentations
Industry Ready Photonic Integration using Photonic Wire Bonds and Facet-Attached Micro-Lenses
Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of compact optical integration platforms in advanced photonics packaging. Here we will address the critical aspects of progressing photonic integration of PICs to scalable, high-volume production: broad compatibility with various material platforms, reproducibility, long-term reliability in Telcordia testing and seamless integration with existing packaging technologies.