| Presentation Title | Speaker | Download |
|---|---|---|
| Advanced Photonic Integrated Circuit Testing: APEX Technologies’ solution for High Precision Optical Instrumentation |  Tomy Marest |
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| Advancements in Optically Enhanced MEMS Inertial Sensors: Prototyping and Roadmap Challenges for Consumer Markets (Video presentation) |  Lia Li |
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| Advances in hybrid Silica-Nitride waveguides |  Henk Bulthuis |
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| Designing high power hybrid integrated tuneable lasers for automotive LiDAR |  Ruud Oldenbeuving |
Click to download |
| Heterogeneous Integration of Photonic Devices on Silicon |  Jonathan Klamkin |
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| Photonic Integrated Circuits: Surface Coupling Lasers using InP as an integration platform |  Bill Ring |
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| Silicon-organic hybrid electro-optic modulators for next generation optical interconnects |  Adrian Mertens |
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| Sputter deposited Al2O3: an ultra-low loss integrated photonic platform for broadband operation from the UV till the mid-IR |  Sonia M. Garcia-Blanco |
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| TFLN PIC Platform: Unleashing Monolithic power to Enhance Hybrid/Heterogeneous PICs |  Hamed Sattari |
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| Unlocking the potential of hybrid/heterogeneous PIC design |  Martin Fiers |
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| Presentation Title | Speaker | Download |
|---|---|---|
| AIM Photonics Foundry providing Co-Process and Co-Development to Address Challenges in Photonic Integrated Circuit (PIC) Packaging |  David Harame |
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| Advances in PIC Manufacturing for Sensing and Datacom Applications – All Thanks to Nanoimprint Lithography |  Jonas Khan |
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| Aligned additive microfabrication for advanced optical packaging |  Jochen Zimmer |
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| As Photonics Applications Multiply, New Ways to Subtract Costs |  Scott Jordan |
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| Breaking the barriers for high frequency packaging |  Guillermo Carpintero |
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| Electrooptic Glass Substrates for Photonic Packaging |  Andreas Matiss |
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| Industry proven Photonic Wire Bonds and Facet-Attached Micro-Optical Elements: from Telecom/Datacom to Quantum Applications |  Philipp-Immanuel Dietrich |
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| Optimizing Cost and Scaling Efficiency in Swept Wavelength Testing for Alignment and Packaging of PIC |  Matt Adams |
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| Technology Developments & Equipment Concepts for Scaling Up Photonics Production for Datacenters |  Malte Ennen |
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| Towards a Comprehensive, Multiphysics Design Solution for Co-packaged Optics |  Ahsan Alam |
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| Presentation Title | Speaker | Download |
|---|---|---|
| A view from the Foundry: Silicon Photonics |  Anthony Yu |
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| Silicon photonics for AI/HPC Optical Interconnects |  Philippe Absil |
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| Presentation Title | Speaker | Download |
|---|---|---|
| Design to Device: Accelerating PIC adoption by lowering entry barriers to turnkey photonic solutions |  Amitesh Singh |
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| Is integrated optics a perfect fit for next generation of Access Networks? |  Prof. Dr. Antonio Teixeira |
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| Opportunities and Challenges for Optics in AI Factories |  Yannick De Koninck |
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| Opportunities for Photonics in Datacenter and High-Performance Computing (HPC) Infrastructure |  Remco Stoffer |
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| Opportunities for Silicon Photonics: Developments and Applications |  James Falkiner |
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| Revolutionizing Architecture and Components for New Generation Energy-Efficient High-Density Photonic Integrated Coherent Transceivers |  Tomoyuki Akiyama |
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| Scaling photonic integration and packaging of hybrid multi-chip assemblies using 3D lithography |  Dr. Laura Horan |
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| Semiconductorization of Photonics using Silicon Optical Interposer |  Raju Kankipati |
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| Silicon Photonics Market and Applications: from Optical Transceivers to Emerging Uses |  Eric Mounier |
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| Presentation Title | Speaker | Download |
|---|---|---|
| A perspective on recent trends in inverse design of integrated photonic devices and circuits |  Wolfger Peelaers |
Click to download |
| Efficient design techniques for custom PDKs protecting your IP |  Andrzej Połatynski |
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| Presentation Title | Speaker | Download |
|---|---|---|
| The evolving role of optics in AI Clusters |  Vlad Kozlov |
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